component
ESD752DBZR
Public Made by Adomby adom
TEXAS INSTRUMENTS Global Sourcing Parts, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownESD752DBZR
TEXAS INSTRUMENTS · Global Sourcing Parts · SOT-23-3
ESD752DBZR from TEXAS INSTRUMENTS, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IO 1 | bidirectional | ESD-protected bidirectional I/O with a reverse stand-off voltage of ±24 V (VRWM), IEC 61000-4-2 contact discharge of ±30 kV and IEC 61000-4-5 (8/20 µs) surge current of 5.7 A for the ESD752. |
| 2 | IO 2 | bidirectional | ESD-protected bidirectional I/O with a reverse stand-off voltage of ±24 V (VRWM), IEC 61000-4-2 contact discharge of ±30 kV and IEC 61000-4-5 (8/20 µs) surge current of 5.7 A for the ESD752. |
| 3 | GND | power_in | Connect to ground; the layout guidance says to use a thick and short trace for this return path when pin 3 is connected to ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TEXAS INSTRUMENTS |
| Package | SOT-23-3 |
| Category | Global Sourcing Parts |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse stand-off voltage | VRWM | -24 | 24 | V | 5 | ||
| Forward breakdown voltage | VBRF | 25.5 | 35.5 | V | IIO = 10 mA, IO to GND | 5 | |
| Reverse breakdown voltage | VBRR | -35.5 | -25.5 | V | IIO = -10 mA, IO to GND | 5 | |
| Leakage current | ILEAK | -50 | 5 | 50 | nA | VIO = ±24 V, IO to GND | 5 |
| Line capacitance | CL | 3 | 5 | pF | VIO = 0 V, f = 1 MHz, Vpp = 30 mV | 5 | |
| IEC 61000-4-5 Power (tp, 8/20 µs) at 25°C, ESD752 | Ppp | 210 | W | tp, 8/20 µs at 25°C | 4 | ||
| IEC 61000-4-5 current (tp, 8/20 µs) at 25°C, ESD752 | Ipp | 5.7 | A | tp, 8/20 µs at 25°C | 4 | ||
| Operating free-air temperature | TA | -55 | 150 | °C | 4 | ||
| Junction temperature | TJ | -55 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 155 | °C | 4 | ||
| Electrostatic discharge (HBM) | V(ESD) | -2500 | 2500 | V | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 | 4 | |
| Electrostatic discharge (CDM) | V(ESD) | -1000 | 1000 | V | Charged device model (CDM), per JEDEC JS-002 | 4 | |
| Electrostatic discharge, IEC 61000-4-2 contact discharge, ESD752 | V(ESD) | 30000 | V | IEC 61000-4-2 Contact Discharge, all pins | 4 | ||
| Electrostatic discharge, IEC 61000-4-2 air discharge, ESD752 | V(ESD) | 30000 | V | IEC 61000-4-2 Air Discharge, all pins | 4 | ||
| Input voltage | VIN | -24 | 24 | V | 4 | ||
| Operating free-air temperature | TA | -55 | 150 | °C | 4 | ||
| Clamping voltage (8/20 µs surge) | VCLAMP | 37 | V | IPP = 5.7 A, tp = 8/20 µs, IO to GND, ESD752 | 5 | ||
| Clamping voltage (TLP) | VCLAMP | 35 | V | IPP = 16 A, TLP, IO to GND or GND to IO, ESD752 | 5 | ||
| Holding voltage after snapback (TLP) | VHold | 30 | V | TLP, ESD752 | 5 | ||
| Dynamic resistance | RDYN | 0.35 | Ω | IO to GND and GND to IO, ESD752 | 5 | ||
| Junction-to-ambient thermal resistance | RθJA | 291.5 | °C/W | DBZ (SOT-23) package | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 147.1 | °C/W | DBZ (SOT-23) package | 4 | ||
| Junction-to-board thermal resistance | RθJB | 131.1 | °C/W | DBZ (SOT-23) package | 4 | ||
| Junction-to-top characterization parameter | ΨJT | 32 | °C/W | DBZ (SOT-23) package | 4 | ||
| Junction-to-board characterization parameter | ΨJB | 130.2 | °C/W | DBZ (SOT-23) package | 4 |
CAD (KiCad official)
- Symbol:
ESD752DBZR - Footprint:
Package_TO_SOT_SMD:SOT-23-3 - 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files:
esd752dbzr-etched.step/esd752dbzr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd752dbzr.step/esd752dbzr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TEXAS INSTRUMENTS datasheet (24 pp, sha256
9027f2d577fc22ab, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).