component
ESD5341N-MS
Public Made by Adomby adom
MSKSEMI ESD Protection Devices, DFN1006-2. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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ESD5341N-MS
MSKSEMI · ESD Protection Devices · DFN1006-2
ESD5341N-MS from MSKSEMI, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VRWM | 5 | V | 3 | |||
| Reverse Breakdown Voltage | VBR | 6 | 7.5 | V | IT=1mA | 3 | |
| Reverse Leakage Current | IR | 100 | nA | VRWM=5V,T=25℃ | 3 | ||
| Peak Pulse Current | IPP | 4 | A | tp =8/20μs | 3 | ||
| Clamping Voltage | VC | 14 | V | IPP=4A,tp=8/20μs | 3 | ||
| Junction Capacitance | Cj | 0.45 | 0.6 | pF | VR = 0V, f = 1MHz | 3 | |
| Peak Pulse Power | PPP | 56 | Watts | tp =8/20μs | 3 | ||
| Peak Pulse Current | Ipp | 4 | A | tp =8/20μs (note1) | 3 | ||
| ESD per IEC 61000-4-2 (Air) | VESD | 20 | kV | 3 | |||
| ESD per IEC 61000-4-2 (Contact) | VESD | 20 | kV | 3 | |||
| Lead Soldering Temperature | TL | 260 | ℃ | 10 seconds | 3 | ||
| Junction Temperature | TJ | -55 | 125 | ℃ | 3 | ||
| Storage Temperature | Tstg | -55 | 125 | ℃ | 3 |
CAD (KiCad official)
- Symbol:
ESD5341N-MS - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files:
esd5341n-ms-etched.step/esd5341n-ms-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd5341n-ms.step/esd5341n-ms.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MSKSEMI datasheet (6 pp, sha256
13c3acf398554513, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ESD5341N-MS
**MSKSEMI** · ESD Protection Devices · DFN1006-2
ESD5341N-MS from MSKSEMI, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VRWM | | | 5 | V | | 3 |
| Reverse Breakdown Voltage | VBR | 6 | 7.5 | | V | IT=1mA | 3 |
| Reverse Leakage Current | IR | | | 100 | nA | VRWM=5V,T=25℃ | 3 |
| Peak Pulse Current | IPP | | | 4 | A | tp =8/20μs | 3 |
| Clamping Voltage | VC | | | 14 | V | IPP=4A,tp=8/20μs | 3 |
| Junction Capacitance | Cj | | 0.45 | 0.6 | pF | VR = 0V, f = 1MHz | 3 |
| Peak Pulse Power | PPP | | | 56 | Watts | tp =8/20μs | 3 |
| Peak Pulse Current | Ipp | | | 4 | A | tp =8/20μs (note1) | 3 |
| ESD per IEC 61000-4-2 (Air) | VESD | | | 20 | kV | | 3 |
| ESD per IEC 61000-4-2 (Contact) | VESD | | | 20 | kV | | 3 |
| Lead Soldering Temperature | TL | | | 260 | ℃ | 10 seconds | 3 |
| Junction Temperature | TJ | -55 | | 125 | ℃ | | 3 |
| Storage Temperature | Tstg | -55 | | 125 | ℃ | | 3 |
## CAD (KiCad official)
- Symbol: `ESD5341N-MS`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files: `esd5341n-ms-etched.step` / `esd5341n-ms-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esd5341n-ms.step` / `esd5341n-ms.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [MSKSEMI datasheet](docs/esd5341n-ms-datasheet.pdf) (6 pp, sha256 `13c3acf398554513`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/esd5341n-ms-datasheet.pdf)