component
ESD5341N-MS
Public Made by Adomby adom
MSKSEMI ESD Protection Devices, DFN1006-2. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 13d ago |
| viewers | 13d ago |
| esd5341n-ms-etched.glb | 13d ago |
| esd5341n-ms-etched.step | 13d ago |
| esd5341n-ms-hero.glb | 13d ago |
| esd5341n-ms-hero.overlay.json | 13d ago |
| esd5341n-ms.glb | 13d ago |
| esd5341n-ms.kicad_mod | 13d ago |
| esd5341n-ms.kicad_sym | 13d ago |
| esd5341n-ms.lbr | 13d ago |
| esd5341n-ms.step | 13d ago |
| package.json | 13d ago |
| page.json | 13d ago |
| README.md | 13d ago |
ESD5341N-MS
MSKSEMI · ESD Protection Devices · DFN1006-2
ESD5341N-MS from MSKSEMI, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VRWM | 5 | V | 3 | |||
| Reverse Breakdown Voltage | VBR | 6 | 7.5 | V | IT=1mA | 3 | |
| Reverse Leakage Current | IR | 100 | nA | VRWM=5V,T=25℃ | 3 | ||
| Peak Pulse Current | IPP | 4 | A | tp =8/20μs | 3 | ||
| Clamping Voltage | VC | 14 | V | IPP=4A,tp=8/20μs | 3 | ||
| Junction Capacitance | Cj | 0.45 | 0.6 | pF | VR = 0V, f = 1MHz | 3 | |
| Peak Pulse Power | PPP | 56 | Watts | tp =8/20μs | 3 | ||
| Peak Pulse Current | Ipp | 4 | A | tp =8/20μs (note1) | 3 | ||
| ESD per IEC 61000-4-2 (Air) | VESD | 20 | kV | 3 | |||
| ESD per IEC 61000-4-2 (Contact) | VESD | 20 | kV | 3 | |||
| Lead Soldering Temperature | TL | 260 | ℃ | 10 seconds | 3 | ||
| Junction Temperature | TJ | -55 | 125 | ℃ | 3 | ||
| Storage Temperature | Tstg | -55 | 125 | ℃ | 3 |
CAD (KiCad official)
- Symbol:
ESD5341N-MS - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files:
esd5341n-ms-etched.step/esd5341n-ms-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd5341n-ms.step/esd5341n-ms.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MSKSEMI datasheet (6 pp, sha256
13c3acf398554513, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).