# ESD3B5CM

**MDD Microdiode Semiconductor** · ESD And Surge Protection (TVS/ESD) · SOD-323

ESD3B5CM from MDD Microdiode Semiconductor, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Bidirectional TVS terminal 1 (pin configuration shows pins 1 and 2, interchangeable), protects one I/O line with 5V working voltage (VRWM) and 5.8V to 7.8V breakdown at 1mA. |
| 2 | 2 | passive | Bidirectional TVS terminal 2 (pin configuration shows pins 1 and 2, interchangeable), connects to ground or the other side of the protected line, with ±30kV IEC 61000-4-2 ESD rating. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MDD Microdiode Semiconductor |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | VBR | 5.8 |  | 7.8 | V | IT = 1mA | 2 |
| Reverse Leakage Current | IR |  |  | 1 | μA | VRWM = 5V | 2 |
| Clamping Voltage | VC |  |  | 9.8 | V | IPP = 1A, tp = 8/20μs | 2 |
| Clamping Voltage | VC |  | 15 | 20 | V | IPP = 25A, tp = 8/20μs | 2 |
| Junction Capacitance | CJ |  | 33 | 40 | pF | VR = 0V, f = 1MHz | 2 |
| Reverse Working Voltage | VRWM |  |  | 5 | V |  | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | KV | TA=25°C | 1 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 |  | 30 | KV | TA=25°C | 1 |
| Peak Pulse Power | PPP |  |  | 500 | W | 8/20us, TA=25°C | 1 |
| Operating Temperature | TOPT | -55 |  | 150 | °C |  | 1 |
| Storage Temperature | TSTG | -55 |  | 150 | °C |  | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | gold |  Terminals: Gold plated, solderable per MIL-STD-750, method 2026  Cellular handsets and accessories | 1 |

## CAD (KiCad official)

- Symbol: `ESD3B5CM`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `esd3b5cm-etched.step` / `esd3b5cm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esd3b5cm.step` / `esd3b5cm.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MDD Microdiode Semiconductor datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590164148161048576) (4 pp, sha256 `f68d70f914cb4af2`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esd3b5cm-datasheet.pdf)