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ESD3B5CM

MDD Microdiode Semiconductor · ESD And Surge Protection (TVS/ESD) · SOD-323

ESD3B5CM from MDD Microdiode Semiconductor, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Bidirectional TVS terminal 1 (pin configuration shows pins 1 and 2, interchangeable), protects one I/O line with 5V working voltage (VRWM) and 5.8V to 7.8V breakdown at 1mA.
2 2 passive Bidirectional TVS terminal 2 (pin configuration shows pins 1 and 2, interchangeable), connects to ground or the other side of the protected line, with ±30kV IEC 61000-4-2 ESD rating.

Key specifications

Parameter Value
Manufacturer MDD Microdiode Semiconductor
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage VBR 5.8 7.8 V IT = 1mA 2
Reverse Leakage Current IR 1 μA VRWM = 5V 2
Clamping Voltage VC 9.8 V IPP = 1A, tp = 8/20μs 2
Clamping Voltage VC 15 20 V IPP = 25A, tp = 8/20μs 2
Junction Capacitance CJ 33 40 pF VR = 0V, f = 1MHz 2
Reverse Working Voltage VRWM 5 V 2
ESD per IEC 61000-4-2 (Air) VESD -30 30 KV TA=25°C 1
ESD per IEC 61000-4-2 (Contact) VESD -30 30 KV TA=25°C 1
Peak Pulse Power PPP 500 W 8/20us, TA=25°C 1
Operating Temperature TOPT -55 150 °C 1
Storage Temperature TSTG -55 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts gold  Terminals: Gold plated, solderable per MIL-STD-750, method 2026  Cellular handsets and accessories 1

CAD (KiCad official)

  • Symbol: ESD3B5CM
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: esd3b5cm-etched.step / esd3b5cm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd3b5cm.step / esd3b5cm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD Microdiode Semiconductor datasheet (4 pp, sha256 f68d70f914cb4af2, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF