# ER2G_R2_00001

**PANJIT International** · Diodes - General Purpose · SMB

ER2G_R2_00001 from PANJIT International, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal, marked by the color band on the body; the device is rated for 50 to 600 V repetitive peak reverse voltage and 2 A average forward current at TL = 110 °C. |
| 2 | Anode | passive | Anode terminal of the rectifier; the datasheet gives a peak forward surge current of 50 A (8.3 ms single half sine-wave) and an operating junction and storage range of -55 to +150 °C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | PANJIT International |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage (ER2G column) | VRRM |  |  | 400 | V |  | 1 |
| Maximum RMS Voltage (ER2G column) | VRMS |  |  | 280 | V |  | 1 |
| Maximum DC Blocking Voltage (ER2G column) | VDC |  |  | 400 | V |  | 1 |
| Maximum Average Forward Current | IF(AV) |  |  | 2 | A | TL=110°C | 1 |
| Peak Forward Surge Current | IFSM |  |  | 50 | A | 8.3ms single half sine-wave superimposed on rated load | 1 |
| Maximum DC Reverse Current | IR |  |  | 1 | μA | TJ=25°C, at rated DC blocking voltage | 1 |
| Maximum DC Reverse Current | IR |  |  | 150 | μA | TJ=100°C, at rated DC blocking voltage | 1 |
| Maximum Reverse Recovery Time | trr |  |  | 35 | ns | Note 1: IF=0.5A, IR=-1A, Irr=-0.25A | 1 |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 |  | 150 | °C |  | 1 |
| Typical Thermal Resistance, junction to lead | RθJL |  | 20 |  | °C/W | Note 3: FR4 PCB, single-sided copper, 100cm2 copper pad area | 1 |
| Typical Thermal Resistance, junction to case | RθJC |  | 15 |  | °C/W | Note 3: FR4 PCB, single-sided copper, 100cm2 copper pad area | 1 |

## CAD (KiCad official)

- Symbol: `ER2G_R2_00001`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB (KiCad packages3D, STEP)
- 3D model files: `er2g-r2-00001-etched.step` / `er2g-r2-00001-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `er2g-r2-00001.step` / `er2g-r2-00001.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [PANJIT International datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590440896736100352) (5 pp, sha256 `23615acc4f2fa80a`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/er2g-r2-00001-datasheet.pdf)