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ER2G_R2_00001

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PANJIT International Diodes - General Purpose, SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ER2G_R2_00001

PANJIT International · Diodes - General Purpose · SMB

ER2G_R2_00001 from PANJIT International, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal, marked by the color band on the body; the device is rated for 50 to 600 V repetitive peak reverse voltage and 2 A average forward current at TL = 110 °C.
2 Anode passive Anode terminal of the rectifier; the datasheet gives a peak forward surge current of 50 A (8.3 ms single half sine-wave) and an operating junction and storage range of -55 to +150 °C.

Key specifications

Parameter Value
Manufacturer PANJIT International
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Recurrent Peak Reverse Voltage (ER2G column) VRRM 400 V 1
Maximum RMS Voltage (ER2G column) VRMS 280 V 1
Maximum DC Blocking Voltage (ER2G column) VDC 400 V 1
Maximum Average Forward Current IF(AV) 2 A TL=110°C 1
Peak Forward Surge Current IFSM 50 A 8.3ms single half sine-wave superimposed on rated load 1
Maximum DC Reverse Current IR 1 μA TJ=25°C, at rated DC blocking voltage 1
Maximum DC Reverse Current IR 150 μA TJ=100°C, at rated DC blocking voltage 1
Maximum Reverse Recovery Time trr 35 ns Note 1: IF=0.5A, IR=-1A, Irr=-0.25A 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 °C 1
Typical Thermal Resistance, junction to lead RθJL 20 °C/W Note 3: FR4 PCB, single-sided copper, 100cm2 copper pad area 1
Typical Thermal Resistance, junction to case RθJC 15 °C/W Note 3: FR4 PCB, single-sided copper, 100cm2 copper pad area 1

CAD (KiCad official)

  • Symbol: ER2G_R2_00001
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: er2g-r2-00001-etched.step / er2g-r2-00001-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); er2g-r2-00001.step / er2g-r2-00001.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: PANJIT International datasheet (5 pp, sha256 23615acc4f2fa80a, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF