# EL2630

**Everlight Elec** · Logic Output Optoisolators · DIP-8

EL2630 from Everlight Elec, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode | passive | Anode of the input infrared emitting diode, with a maximum forward current IF of 20 mA and a maximum reverse voltage VR of 5 V. |
| 2 | Cathode | passive | Cathode of the input infrared emitting diode; the switching tests use an input current IF of 7.5 mA, with a 3.75 mA threshold used for propagation delay measurement. |
| 3 | Cathode | passive | Second cathode connection of the input infrared emitting diode, internally shorted to pin 2 in the datasheet's absolute maximum isolation test. |
| 4 | Anode | passive | Second anode connection of the input infrared emitting diode, internally shorted to pin 1 in the datasheet's absolute maximum isolation test. |
| 5 | GND | power_in | Ground reference for the photodetector logic output stage; a 0.1 µF bypass capacitor must connect between pins 8 and 5, placed as close to the package as possible. |
| 6 | Vout 2 | output | Logic gate output 2 of the high-speed photodetector, with a maximum output current IO of 50 mA and a maximum output voltage VO of 7.0 V. |
| 7 | Vout 1 | output | Logic gate output 1 of the high-speed photodetector, with a maximum output current IO of 50 mA and a maximum output voltage VO of 7.0 V. |
| 8 | VCC | power_in | Supply voltage for the photodetector and logic output, with an absolute maximum rating of 7.0 V and a 0.1 µF bypass capacitor required to GND (pin 5). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Everlight Elec |
| Package | DIP-8 |
| Category | Optoisolators |
| Pins | 8 |

## CAD (KiCad official)

- Symbol: `EL2630`
- Footprint: `Package_DIP:DIP-8_W7.62mm`
- 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files: `el2630-etched.step` / `el2630-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `el2630.step` / `el2630.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Everlight Elec datasheet](https://en.everlight.com/wp-content/plugins/ItemRelationship/product_files/pdf/EL263X.pdf) (14 pp, sha256 `fa5ca4d46f35cbf9`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/el2630-datasheet.pdf)