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EG2124A

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EG Micro Gate Drivers, TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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EG2124A

EG Micro · Gate Drivers · TSSOP-20

EG2124A from EG Micro, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 HIN1 input High-side logic input for channel 1, active high (1 turns the high-side MOSFET on, 0 turns it off), with a logic-high threshold of 2.5 V minimum and a logic-low threshold of 1.0 V maximum.
2 HIN2 input High-side logic input for channel 2, active high (1 turns the high-side MOSFET on, 0 turns it off), with a logic-high threshold of 2.5 V minimum and a logic-low threshold of 1.0 V maximum.
3 HIN3 input High-side logic input for channel 3, active high (1 turns the high-side MOSFET on, 0 turns it off), with a logic-high threshold of 2.5 V minimum and a logic-low threshold of 1.0 V maximum.
4 LIN1 input Low-side logic input for channel 1, active high (1 turns the low-side MOSFET on, 0 turns it off), with internal pull-down so that a floating input keeps the low-side MOSFET off.
5 LIN2 input Low-side logic input for channel 2, active high (1 turns the low-side MOSFET on, 0 turns it off), with internal pull-down so that a floating input keeps the low-side MOSFET off.
6 LIN3 input Low-side logic input for channel 3, active high (1 turns the low-side MOSFET on, 0 turns it off), with internal pull-down so that a floating input keeps the low-side MOSFET off.
7 VCC power_in Analog supply for the low-side circuitry, specified for 5 V to 20 V operation with an absolute maximum of 25 V.
8 GND power_in Analog ground reference for the device.
9 LO1 output Low-side gate drive output for channel 1 that controls the low-side MOSFET, with a peak source current of +0.8 A and sink current of -1.2 A (pulse width up to 10 µs).
10 LO2 output Low-side gate drive output for channel 2 that controls the low-side MOSFET, with a peak source current of +0.8 A and sink current of -1.2 A (pulse width up to 10 µs).
11 LO3 output Low-side gate drive output for channel 3 that controls the low-side MOSFET, with a peak source current of +0.8 A and sink current of -1.2 A (pulse width up to 10 µs).
12 VS1 passive High-side floating ground (half-bridge output node) for channel 1, which must stay between VB-25 V and VB+0.3 V and has a static negative limit of -6 V.
13 HO1 output High-side gate drive output for channel 1 that controls the high-side MOSFET, referenced to VS1 and limited to VS-0.3 V to VB+0.3 V.
14 VB1 power_in High-side floating bootstrap supply for channel 1, with an absolute maximum of 280 V and undervoltage lockout turn-on at 4.1 V and turn-off at 4.0 V.
15 VS2 passive High-side floating ground (half-bridge output node) for channel 2, which must stay between VB-25 V and VB+0.3 V and has a static negative limit of -6 V.
16 HO2 output High-side gate drive output for channel 2 that controls the high-side MOSFET, referenced to VS2 and limited to VS-0.3 V to VB+0.3 V.
17 VB2 power_in High-side floating bootstrap supply for channel 2, with an absolute maximum of 280 V and undervoltage lockout turn-on at 4.1 V and turn-off at 4.0 V.
18 VS3 passive High-side floating ground (half-bridge output node) for channel 3, which must stay between VB-25 V and VB+0.3 V and has a static negative limit of -6 V.
19 HO3 output High-side gate drive output for channel 3 that controls the high-side MOSFET, referenced to VS3 and limited to VS-0.3 V to VB+0.3 V.
20 VB3 power_in High-side floating bootstrap supply for channel 3, with an absolute maximum of 280 V and undervoltage lockout turn-on at 4.1 V and turn-off at 4.0 V.

Key specifications

Parameter Value
Manufacturer EG Micro
Package TSSOP-20
Category Motor Driver ICs
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
自举高端 VB 电源 (High-side bootstrap supply) VB1、VB2、VB3 -0.3 280 V - 8
电源 VCC (Supply) VCC -0.3 25 V - 8
环境温度 (Ambient temperature) -40 125 ℃ - 9
储存温度 (Storage temperature) -55 150 ℃ - 9
焊接温度 (Soldering temperature) 300 ℃ T=10S 9
电源 VDD (Supply voltage) VDD 5 12 20 V 9
输入逻辑信号高电位 (Logic input high voltage) Vin(H) 2.5 V 所有输入控制信号 9
输入逻辑信号低电位 (Logic input low voltage) Vin(L) -0.3 0 1 V 所有输入控制信号 9
输入逻辑信号高电平的电流 (Logic input high current) IN(H) 20 uA Vin=5V 9
输入逻辑信号低电平的电流 (Logic input low current) IN(L) -15 uA Vin=0V 9
悬浮电源漏电流 (Floating supply leakage current) ILK 0.1 1 uA VB1,2,3=VS1,2,3=300V 9
VBS 静态电流 (VBS quiescent current) IQBS 20 50 uA VIN 悬空 9
VBS 动态电流 (VBS dynamic current) IPBS 100 200 uA f=16KHZ 9
Vcc 静态电流 (Vcc quiescent current) IQcc 150 350 uA VIN 悬空 9
Vcc 动态电流 (Vcc dynamic current) IPcc 400 600 uA f=16KHZ 9
LIN 高电平输入偏置电流 (LIN high-level input bias current) ILINH 20 40 uA VLIN=5V 9
LIN 低电平输入偏置电流 (LIN low-level input bias current) ILINL 2 uA VLIN=0V 9
HIN 高电平输入偏置电流 (HIN high-level input bias current) IHINH 20 40 uA VLIN=5V 9
HIN 低电平输入偏置电流 (HIN low-level input bias current) IHINL 2 uA VLIN=0V 9
低端输出 LO 开延时 (LO turn-on delay) Ton 320 420 nS 见图 7-1 9
低端输出 LO 关延时 (LO turn-off delay) Toff 120 220 nS 见图 7-1 9
低端输出 LO 上升时间 (LO rise time) Tr 35 70 nS 见图 7-1 9
低端输出 LO 下降时间 (LO fall time) Tf 25 50 nS 见图 7-1 9
高端输出 HO 开延时 (HO turn-on delay) Ton 320 420 nS 见图 7-2 9
高端输出 HO 关延时 (HO turn-off delay) Toff 120 220 nS 见图 7-2 9
高端输出 HO 上升时间 (HO rise time) Tr 35 70 nS 见图 7-2 9
高端输出 HO 下降时间 (HO fall time) Tf 25 50 nS 见图 7-2 9
死区时间 (Dead time) DT 100 200 300 nS 见图 7-3，无负载电容 CL=0 10
VS 静态负压 (VS static negative voltage) VSN -6 V 9
输入下拉电阻 (Input pull-down resistor) RIN 240 KΩ 10
HO 下拉电阻 (HO pull-down resistor) RHO 70 KΩ 10
LO 下拉电阻 (LO pull-down resistor) RLO 70 KΩ 10
Vcc 开启电压 (Vcc turn-on voltage) Vcc(on) 4.3 V 9
Vcc 关断电压 (Vcc turn-off voltage) Vcc(off) 4.2 V 10
VB 开启电压 (VB turn-on voltage) VB(on) 4.1 V 10
VB 关断电压 (VB turn-off voltage) VB(off) 4 V 10
IO 输出拉电流 (IO source current) IO+ 0.8 A Vo=0V,VIN=VIH PW≤10uS 10
IO 输出灌电流 (IO sink current) IO- -1.2 A Vo=12V,VIN=VIL PW≤10uS 10

CAD (KiCad official)

  • Symbol: EG2124A
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: eg2124a-etched.step / eg2124a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); eg2124a.step / eg2124a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: EG Micro datasheet (15 pp, sha256 aebf228e12198305, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF