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Contents

README

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EFM8UB20F64G-B-QFP32

SILICON LABS · Pre-ordered MCUs · QFP-32(7x7)

EFM8UB20F64G-B-QFP32 from SILICON LABS, in a QFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P0.1 bidirectional Crossbar-capable multifunction I/O with INT0.1/INT1.1 external interrupt, ADC0P.18/ADC0N.18 and CMP0N.4 analog functions.
2 P0.0 bidirectional Crossbar-capable multifunction I/O with INT0.0/INT1.0 external interrupt, ADC0P.17/ADC0N.17 and CMP0P.4 analog functions.
3 GND power_in Ground.
4 D+ bidirectional USB Data Positive.
5 D- bidirectional USB Data Negative.
6 VDD power_in Supply power input / 5V regulator output.
7 VREGIN power_in 5V regulator input.
8 VBUS power_in USB VBUS sense input.
9 RSTb / C2CK bidirectional Active-low reset and C2 debug clock.
10 P3.0 / C2D bidirectional Crossbar-capable multifunction I/O shared with C2 debug data, with ADC0P.16/ADC0N.16 analog functions.
11 P2.7 bidirectional Crossbar-capable multifunction I/O with ADC0P.15/ADC0N.15 analog functions.
12 P2.6 bidirectional Crossbar-capable multifunction I/O with ADC0P.14/ADC0N.14 analog functions.
13 P2.5 bidirectional Crossbar-capable multifunction I/O with ADC0P.13/ADC0N.13 and CMP0N.3 analog functions.
14 P2.4 bidirectional Crossbar-capable multifunction I/O with ADC0P.12/ADC0N.12 and CMP0P.3 analog functions.
15 P2.3 bidirectional Crossbar-capable multifunction I/O with ADC0P.11/ADC0N.11 and CMP1N.2 analog functions.
16 P2.2 bidirectional Crossbar-capable multifunction I/O with ADC0P.10/ADC0N.10 and CMP1P.2 analog functions.
17 P2.1 bidirectional Crossbar-capable multifunction I/O with ADC0P.9/ADC0N.9 and CMP0N.2 analog functions.
18 P2.0 bidirectional Crossbar-capable multifunction I/O with ADC0P.8/ADC0N.8 and CMP0P.2 analog functions.
19 P1.7 bidirectional Crossbar-capable multifunction I/O with ADC0P.7/ADC0N.7 and CMP1N.1 analog functions.
20 P1.6 bidirectional Crossbar-capable multifunction I/O with ADC0P.6/ADC0N.6 and CMP1P.1 analog functions.
21 P1.5 bidirectional Crossbar-capable multifunction I/O with ADC0P.5/ADC0N.5 and CMP0N.1 analog functions.
22 P1.4 bidirectional Crossbar-capable multifunction I/O with ADC0P.4/ADC0N.4 and CMP0P.1 analog functions.
23 P1.3 bidirectional Crossbar-capable multifunction I/O with ADC0P.3/ADC0N.3 and CMP1N.0 analog functions.
24 P1.2 bidirectional Crossbar-capable multifunction I/O with ADC0P.2/ADC0N.2 and CMP1P.0 analog functions.
25 P1.1 bidirectional Crossbar-capable multifunction I/O with ADC0P.1/ADC0N.1 and CMP0N.0 analog functions.
26 P1.0 bidirectional Crossbar-capable multifunction I/O with ADC0P.0/ADC0N.0 and CMP0P.0 analog functions.
27 P0.7 bidirectional Crossbar-capable multifunction I/O with INT0.7/INT1.7 external interrupt and VREF function.
28 P0.6 bidirectional Crossbar-capable multifunction I/O with CNVSTR and INT0.6/INT1.6 external interrupt.
29 P0.5 bidirectional Crossbar-capable multifunction I/O with UART0_RX, INT0.5/INT1.5, ADC0P.20/ADC0N.20 and CMP1N.4.
30 P0.4 bidirectional Crossbar-capable multifunction I/O with UART0_TX, INT0.4/INT1.4, ADC0P.19/ADC0N.19 and CMP1P.4.
31 P0.3 bidirectional Crossbar-capable multifunction I/O with EXTCLK and INT0.3/INT1.3 external interrupt.
32 P0.2 bidirectional Crossbar-capable multifunction I/O with INT0.2/INT1.2 external interrupt.

Key specifications

Parameter Value
Manufacturer SILICON LABS
Package QFP-32(7x7)
Category Embedded Processors & Controllers
Pins 32

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Supply Voltage on VDD VDD 2.72 3.3 3.6 V 12
Operating Supply Voltage on VREGIN VREGIN 2.7 5.25 V 12
System Clock Frequency fSYSCLK 0 48 MHz 12
Operating Ambient Temperature TA -40 85 °C 12
Digital Core Supply Current, Normal Mode-Full speed with code executing from flash IDD 12 14 mA FSYSCLK = 48 MHz 13
Digital Core Supply Current, Normal Mode-Full speed with code executing from flash IDD 7 8 mA FSYSCLK = 24 MHz 13
Digital Core Supply Current, Idle Mode-Core halted with peripherals running IDD 6.5 8 mA FSYSCLK = 48 MHz 13
Digital Core Supply Current, Idle Mode-Core halted with peripherals running IDD 3.5 5 mA FSYSCLK = 24 MHz 13
ADC0 Supply Current IADC 750 1000 μA Operating at 500 ksps, VDD = 3.0 V 13
Voltage Supply Monitor (VMON0) Supply Current IVMON 15 50 μA 13
High Frequency Oscillator 0 (48 MHz) Oscillator Frequency fHFOSC0 47.3 48 48.7 MHz Full Temperature and Supply Range 15
Low Frequency Oscillator (80 kHz) Oscillator Frequency fLFOSC 75 80 85 kHz Full Temperature and Supply Range 15
Crystal Frequency fXTAL 0.02 30 MHz 15
External Input CMOS Clock Frequency (at EXTCLK pin) fCMOS 0 48 MHz 15
ADC Throughput Rate fS 500 ksps 16
ADC Tracking Time tTRK 300 ns 16
ADC SAR Clock Frequency fSAR 8.33 MHz 16
ADC Conversion Time tCNV 13 Clocks 10-Bit Conversion 16
ADC Voltage Reference Range VREF 1 V 16
ADC Input Voltage Range VIN 0 V Single-Ended (AIN+ - GND) 16
ADC Integral Nonlinearity INL -1 0.5 1 LSB DC Performance, VREF = 2.4 V 16
ADC Differential Nonlinearity (Guaranteed Monotonic) DNL -1 0.5 1 LSB DC Performance, VREF = 2.4 V 16
ADC Offset Error EOFF -2 0 2 LSB DC Performance, VREF = 2.4 V 16
ADC Slope Error EM -0.5 -0.2 0.5 % DC Performance, VREF = 2.4 V 16
ADC Signal-to-Noise SNR 55 58 dB 10 kHz Sine Wave Input, 1 dB below full scale, VREF = 2.4 V 16
ADC Signal-to-Noise Plus Distortion SNDR 55 58 dB 10 kHz Sine Wave Input, 1 dB below full scale, VREF = 2.4 V 16
On-chip Precision Reference Output Voltage VREFP 2.38 2.42 2.46 V T = 25 °C 17
On-chip Precision Reference Short-circuit current ISCVREFP 8 mA 17
Thermal Resistance, QFP32 Packages θJA 80 °C/W 23
Ambient Temperature Under Bias TBIAS -55 125 °C 24
Storage Temperature TSTG -65 150 °C 24
Voltage on VDD VDD 4.2 V 24
Voltage on VREGIN VREGIN 5.8 V 24
Voltage on I/O, RSTb, or VBUS pins VIN 5.8 V VDD > 2.2 V 24
Total Current Sunk into Supply Pin IVDD 500 mA 24
Total Current Sourced out of Ground Pin IGND 500 mA 24
Current Sourced or Sunk by any I/O Pin or RSTb IIO -100 100 mA 24

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components. 43

CAD (KiCad official)

  • Symbol: EFM8UB20F64G-B-QFP32
  • Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
  • 3D model: QFP-32(7x7) (KiCad packages3D, STEP)
  • 3D model files: efm8ub20f64g-b-qfp32-etched.step / efm8ub20f64g-b-qfp32-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); efm8ub20f64g-b-qfp32.step / efm8ub20f64g-b-qfp32.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SILICON LABS datasheet (57 pp, sha256 6022323e8bbca04e, retrieved 2026-11-13, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF