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EFM8LB11F16ES0-C-QFN24R

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SILICON LABS Microcontroller Units (MCUs/MPUs/SOCs), QFN-24-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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EFM8LB11F16ES0-C-QFN24R

SILICON LABS · Microcontroller Units (MCUs/MPUs/SOCs) · QFN-24-EP(3x3)

EFM8LB11F16ES0-C-QFN24R from SILICON LABS, in a QFN-24-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P0.1 bidirectional Multifunction I/O with crossbar capability, also INT0.1/INT1.1, port match P0MAT.1, ADC0.0, CMP0P.0/CMP0N.0 and AGND analog functions.
2 P0.0 bidirectional Multifunction I/O with crossbar capability, also INT0.0/INT1.0, port match P0MAT.0 and VREF analog function.
3 GND power_in Ground.
4 VDD / VIO power_in Combined core supply and I/O supply power input.
5 RSTb / C2CK bidirectional Active-low reset input and C2 debug clock.
6 P3.0 / C2D bidirectional Multifunction I/O (no crossbar) shared with C2 debug data.
7 P2.3 bidirectional Multifunction I/O with crossbar capability, port match P2MAT.3, and DAC3 analog output.
8 P2.2 bidirectional Multifunction I/O with crossbar capability, port match P2MAT.2, and DAC2 analog output.
9 P2.1 bidirectional Multifunction I/O with crossbar capability, port match P2MAT.1, and DAC1 analog output.
10 P2.0 bidirectional Multifunction I/O with crossbar capability, port match P2MAT.0, and DAC0 analog output.
11 P1.6 bidirectional Multifunction I/O with crossbar capability, CLU3OUT, ADC0.11, and CMP1P.5/CMP1N.5 analog functions.
12 P1.5 bidirectional Multifunction I/O with crossbar capability, CLU2OUT, ADC0.10, and CMP1P.4/CMP1N.4 analog functions.
13 P1.4 bidirectional Multifunction I/O with crossbar capability, I2C0_SCL, ADC0.9, and CMP1P.3/CMP1N.3 analog functions.
14 P1.3 bidirectional Multifunction I/O with crossbar capability, I2C0_SDA, and CMP1P.2/CMP1N.2 analog functions.
15 GND power_in Ground.
16 P1.2 bidirectional Multifunction I/O with crossbar capability, port match P1MAT.2, and ADC0.8 analog input.
17 P1.1 bidirectional Multifunction I/O with crossbar capability, port match P1MAT.1, and ADC0.7 analog input.
18 P1.0 bidirectional Multifunction I/O with crossbar capability, port match P1MAT.0, and ADC0.6 analog input.
19 P0.7 bidirectional Multifunction I/O with crossbar capability, INT0.7/INT1.7, CLU1OUT, ADC0.5, CMP0P.5/CMP0N.5 and CMP1P.1/CMP1N.1 analog functions.
20 P0.6 bidirectional Multifunction I/O with crossbar capability, CNVSTR, INT0.6/INT1.6, ADC0.4, CMP0P.4/CMP0N.4 and CMP1P.0/CMP1N.0 analog functions.
21 P0.5 bidirectional Multifunction I/O with crossbar capability, UART0_RX, INT0.5/INT1.5, ADC0.3, and CMP0P.3/CMP0N.3 analog functions.
22 P0.4 bidirectional Multifunction I/O with crossbar capability, UART0_TX, INT0.4/INT1.4, ADC0.2, and CMP0P.2/CMP0N.2 analog functions.
23 P0.3 bidirectional Multifunction I/O with crossbar capability, EXTCLK, INT0.3/INT1.3, and EXTOSC analog function.
24 P0.2 bidirectional Multifunction I/O with crossbar capability, CLU0OUT, INT0.2/INT1.2, ADC0.1, and CMP0P.1/CMP0N.1 analog functions.
25 GND power_in Center exposed pad, ground.

Key specifications

Parameter Value
Manufacturer SILICON LABS
Package QFN-24-EP(3x3)
Category Single Chip Microcomputer/Microcontroller
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Supply Voltage on VDD VDD 2.2 3.6 V 18
Operating Supply Voltage on VIO VIO 2.2 V max is VDD 18
System Clock Frequency fSYSCLK 0 73.5 MHz 18
Operating Ambient Temperature TA -40 105 °C 18
Normal Mode supply current IDD 12.9 15 mA FSYSCLK = 72 MHz (HFOSC1) 19
Normal Mode supply current IDD 4.2 5 mA FSYSCLK = 24.5 MHz (HFOSC0) 19
Normal Mode supply current IDD 625 1050 μA FSYSCLK = 1.53 MHz (HFOSC0) 19
Normal Mode supply current IDD 155 575 μA FSYSCLK = 80 kHz 19
Idle Mode supply current IDD 9.6 11.1 mA FSYSCLK = 72 MHz (HFOSC1) 19
Idle Mode supply current IDD 3.14 3.8 mA FSYSCLK = 24.5 MHz (HFOSC0) 19
Idle Mode supply current IDD 520 950 μA FSYSCLK = 1.53 MHz (HFOSC0) 19
Idle Mode supply current IDD 135 550 μA FSYSCLK = 80 kHz 19
Suspend Mode supply current IDD 125 545 μA LFO Running 19
Suspend Mode supply current IDD 120 535 μA LFO Stopped 19
Snooze Mode supply current IDD 23 430 μA LFO Running 19
Snooze Mode supply current IDD 19 425 μA LFO Stopped 19
Stop Mode supply current IDD 120 535 μA 19
Shutdown Mode supply current IDD 0.2 2.1 μA 19
High-Frequency Oscillator 0 current IHFOSC0 120 135 μA Operating at 24.5 MHz, TA = 25 °C 19
High-Frequency Oscillator 1 current IHFOSC1 1285 1340 μA Operating at 72 MHz, TA = 25 °C 19
Low-Frequency Oscillator current ILFOSC 3.7 6 μA Operating at 80 kHz, TA = 25 °C 19
ADC Throughput Rate (High Speed Mode) fS 900 ksps 14 Bit Mode 24
ADC Throughput Rate (High Speed Mode) fS 1 Msps 12 Bit Mode 24
ADC Throughput Rate (High Speed Mode) fS 1.125 Msps 10 Bit Mode 24
ADC Throughput Rate (Low Power Mode) fS 320 ksps 14 Bit Mode 24
ADC Throughput Rate (Low Power Mode) fS 340 ksps 12 Bit Mode 24
ADC Throughput Rate (Low Power Mode) fS 360 ksps 10 Bit Mode 24
ADC Power-On Time tPWR 1.2 μs 24
ADC SAR Clock Frequency fSAR 18.36 MHz High Speed Mode 24
ADC SAR Clock Frequency fSAR 12.25 MHz Low Power Mode 24
ADC Voltage Reference Range VREF 1 V max is VIO 24
ADC INL INL -1.9 1.9 LSB 12 Bit Mode 25
ADC INL INL -0.6 0.6 LSB 10 Bit Mode 25
ADC DNL DNL -0.9 0.9 LSB 12 Bit Mode 25
ADC DNL DNL -0.5 0.5 LSB 10 Bit Mode 25
ADC Offset Error EOFF -2 0 2 LSB 12 Bit Mode 25
ADC Offset Error EOFF -1 0 1 LSB 10 Bit Mode 25
ADC Slope Error EM -2.6 2.6 LSB 12 Bit Mode 25
ADC Slope Error EM -1.1 1.1 LSB 10 Bit Mode 25
ADC SNR SNR 64 68 dB 12 Bit Mode 25
ADC SNR SNR 59 61 dB 10 Bit Mode 25
ADC SNDR SNDR 64 68 dB 12 Bit Mode 25
ADC SNDR SNDR 59 61 dB 10 Bit Mode 25
Internal Fast Settling Reference Output Voltage VREFFS 1.62 1.65 1.68 V Full Temperature and Supply Range 27
Turn-on Time (fast reference) tREFFS 1.5 μs 27
Precision Reference Valid Supply Range VDD 2.2 3.6 V 1.2 V Output 27
Precision Reference Valid Supply Range VDD 2.7 3.6 V 2.4 V Output 27
On-chip Precision Reference Output Voltage VREFP 1.195 1.2 1.205 V 1.2 V Output, VDD = 3.3 V, T = 25 °C 27
On-chip Precision Reference Output Voltage VREFP 1.18 1.2 1.22 V 1.2 V Output 27
On-chip Precision Reference Output Voltage VREFP 2.39 2.4 2.41 V 2.4 V Output, VDD = 3.3 V, T = 25 °C 27
On-chip Precision Reference Output Voltage VREFP 2.36 2.4 2.44 V 2.4 V Output 27
Reference Load Capacitor CVREFP 0.1 µF Load = 0 to 200 µA to GND 27
Reference Short-circuit current ISCVREFP 8 mA 27
Temp Sensor Error ETOT -2.6 1.8 °C T = 0 °C to 70 °C 28
Temp Sensor Error ETOT -2.9 2.7 °C T = -20 °C to 85 °C 28
Temp Sensor Error ETOT -3.2 4.2 °C T = -40 °C to 105 °C 28
1.8 V LDO Output Voltage VOUT_1.8V 1.79 1.84 1.88 V 28
Thermal Resistance Junction to Ambient θJA 30 °C/W QFN24 Packages 35
Thermal Resistance Junction to Case θJC 32.8 °C/W QFN24 Packages 35
Ambient Temperature Under Bias TBIAS -55 125 °C 36
Storage Temperature TSTG -65 150 °C 36
Voltage on VDD VDD -0.3 4.2 V min printed as GND-0.3 36
Voltage on VIO VIO -0.3 V GND-0.3 to VDD+0.3 36
Voltage on I/O pins or RSTb (excl. P2.0-P2.3) VIN -0.3 5.8 V VIO > 3.3 V; min printed GND-0.3 36
Voltage on I/O pins or RSTb (excl. P2.0-P2.3) VIN -0.3 V VIO < 3.3 V; GND-0.3 to VIO+2.5 36
Voltage on P2.0-P2.3 (QFN24) VIN -0.3 V GND-0.3 to VDD+0.3 36
Total Current Sunk into Supply Pin IVDD 400 mA 36
Total Current Sourced out of Ground Pin IGND 400 mA 36
Current Sourced or Sunk by any I/O Pin or RSTb IIO -100 100 mA 36
Operating Junction Temperature TJ -40 130 °C TA = -40 °C to 105 °C 36

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components. 60

CAD (KiCad official)

  • Symbol: EFM8LB11F16ES0-C-QFN24R
  • Footprint: Package_DFN_QFN:QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm
  • 3D model: QFN-24-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: efm8lb11f16es0-c-qfn24r-etched.step / efm8lb11f16es0-c-qfn24r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); efm8lb11f16es0-c-qfn24r.step / efm8lb11f16es0-c-qfn24r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SILICON LABS datasheet (77 pp, sha256 4bb882f3cda45564, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF