component
EFM8BB22F16I-C-QFN28
Public Made by Adomby adom
SILICON LABS Pre-ordered MCUs, VQFN-28-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
EFM8BB22F16I-C-QFN28
SILICON LABS · Pre-ordered MCUs · VQFN-28-EP(5x5)
EFM8BB22F16I-C-QFN28 from SILICON LABS, in a VQFN-28-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | P0.1 | bidirectional | Multifunction I/O with crossbar capability, P0MAT.1, INT0.1/INT1.1, ADC0.1, CMP0P.1/CMP0N.1 and AGND analog function. |
| 2 | P0.0 | bidirectional | Multifunction I/O with crossbar capability, P0MAT.0, INT0.0/INT1.0, ADC0.0, CMP0P.0/CMP0N.0 and VREF analog function. |
| 3 | GND | power_in | Ground. |
| 4 | N/C | unconnected | No connection. |
| 5 | N/C | unconnected | No connection. |
| 6 | VDD | power_in | Supply power input / 5V regulator output. |
| 7 | VREGIN | power_in | 5V regulator input. |
| 8 | P3.1 | bidirectional | Multifunction I/O (no crossbar capability listed). |
| 9 | RSTb / C2CK | bidirectional | Active-low reset / C2 debug clock. |
| 10 | P3.0 / C2D | bidirectional | Multifunction I/O / C2 debug data. |
| 11 | P2.3 | bidirectional | Multifunction I/O with crossbar capability, P2MAT.3, ADC0.23, CP1P.12/CP1N.12. |
| 12 | P2.2 | bidirectional | Multifunction I/O with crossbar capability, P2MAT.2, ADC0.22, CP1P.11/CP1N.11. |
| 13 | P2.1 | bidirectional | Multifunction I/O with crossbar capability, P2MAT.1, ADC0.21, CP1P.10/CP1N.10. |
| 14 | P2.0 | bidirectional | Multifunction I/O with crossbar capability, P2MAT.0, ADC0.20, CP1P.9/CP1N.9. |
| 15 | P1.7 | bidirectional | Multifunction I/O with crossbar capability, P1MAT.7, ADC0.15, CP1P.7/CP1N.7. |
| 16 | P1.6 | bidirectional | Multifunction I/O with crossbar capability, P1MAT.6, I2C0_SCL, ADC0.14, CP1P.6/CP1N.6. |
| 17 | P1.5 | bidirectional | Multifunction I/O with crossbar capability, P1MAT.5, I2C0_SDA, ADC0.13, CP1P.5/CP1N.5. |
| 18 | P1.4 | bidirectional | Multifunction I/O with crossbar capability, P1MAT.4, ADC0.12, CP1P.4/CP1N.4. |
| 19 | P1.3 | bidirectional | Multifunction I/O with crossbar capability, P1MAT.3, ADC0.11, CP1P.3/CP1N.3. |
| 20 | P1.2 | bidirectional | Multifunction I/O with crossbar capability, P1MAT.2, ADC0.10, CP1P.2/CP1N.2. |
| 21 | P1.1 | bidirectional | Multifunction I/O with crossbar capability, P1MAT.1, ADC0.9, CP1P.1/CP1N.1, CMP0P.10/CMP0N.10. |
| 22 | P1.0 | bidirectional | Multifunction I/O with crossbar capability, P1MAT.0, ADC0.8, CP1P.0/CP1N.0, CMP0P.9/CMP0N.9. |
| 23 | P0.7 | bidirectional | Multifunction I/O with crossbar capability, P0MAT.7, INT0.7/INT1.7, ADC0.7, CMP0P.7/CMP0N.7. |
| 24 | P0.6 | bidirectional | Multifunction I/O with crossbar capability, P0MAT.6, CNVSTR, INT0.6/INT1.6, ADC0.6, CMP0P.6/CMP0N.6. |
| 25 | P0.5 | bidirectional | Multifunction I/O with crossbar capability, P0MAT.5, INT0.5/INT1.5, UART0_RX, ADC0.5, CMP0P.5/CMP0N.5. |
| 26 | P0.4 | bidirectional | Multifunction I/O with crossbar capability, P0MAT.4, INT0.4/INT1.4, UART0_TX, ADC0.4, CMP0P.4/CMP0N.4. |
| 27 | P0.3 | bidirectional | Multifunction I/O with crossbar capability, P0MAT.3, EXTCLK, INT0.3/INT1.3, ADC0.3, CMP0P.3/CMP0N.3. |
| 28 | P0.2 | bidirectional | Multifunction I/O with crossbar capability, P0MAT.2, INT0.2/INT1.2, ADC0.2, CMP0P.2/CMP0N.2. |
| 29 | GND | power_in | Center exposed pad, ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SILICON LABS |
| Package | VQFN-28-EP(5x5) |
| Category | Embedded Processors & Controllers |
| Pins | 29 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Supply Voltage on VDD | VDD | 2.2 | 3.6 | V | 16 | ||
| Operating Supply Voltage on VREGIN | VREGIN | 3 | 5.25 | V | 16 | ||
| System Clock Frequency | fSYSCLK | 0 | 50 | MHz | 16 | ||
| Operating Ambient Temperature | TA | -40 | 125 | °C | I-grade or A-grade devices | 16 | |
| Digital Core Supply Current, Normal Mode | IDD | 9.4 | 10.9 | mA | I-grade/A-grade; FSYSCLK = 49 MHz (HFOSC1) | 17 | |
| Digital Core Supply Current, Normal Mode | IDD | 4.5 | 5.6 | mA | I-grade/A-grade; FSYSCLK = 24.5 MHz (HFOSC0) | 17 | |
| Digital Core Supply Current, Normal Mode | IDD | 600 | 1555 | μA | I-grade/A-grade; FSYSCLK = 1.53 MHz (HFOSC0) | 17 | |
| Digital Core Supply Current, Normal Mode | IDD | 145 | 1070 | μA | I-grade/A-grade; FSYSCLK = 80 kHz | 17 | |
| Digital Core Supply Current, Idle Mode | IDD | 6.3 | 7.4 | mA | I-grade/A-grade; FSYSCLK = 49 MHz (HFOSC1) | 17 | |
| Digital Core Supply Current, Idle Mode | IDD | 2.9 | 3.9 | mA | I-grade/A-grade; FSYSCLK = 24.5 MHz (HFOSC0) | 17 | |
| Digital Core Supply Current, Idle Mode | IDD | 440 | 1400 | μA | I-grade/A-grade; FSYSCLK = 1.53 MHz (HFOSC0) | 17 | |
| Digital Core Supply Current, Idle Mode | IDD | 130 | 1050 | μA | I-grade/A-grade; FSYSCLK = 80 kHz | 17 | |
| Digital Core Supply Current, Suspend Mode | IDD | 125 | 1050 | μA | I-grade/A-grade; LFO Running | 17 | |
| Digital Core Supply Current, Suspend Mode | IDD | 120 | 1045 | μA | I-grade/A-grade; LFO Stopped | 17 | |
| Digital Core Supply Current, Snooze Mode | IDD | 25 | 950 | μA | I-grade/A-grade; LFO Running | 18 | |
| Digital Core Supply Current, Snooze Mode | IDD | 20 | 940 | μA | I-grade/A-grade; LFO Stopped | 18 | |
| Digital Core Supply Current, Stop Mode | IDD | 120 | 1045 | μA | I-grade/A-grade; Internal LDO On | 18 | |
| Digital Core Supply Current, Shutdown Mode | IDD | 0.2 | 15 | μA | I-grade/A-grade; Internal LDO Off | 18 | |
| High-Frequency Oscillator 1 Supply Current | IHFOSC1 | 865 | 940 | μA | Operating at 49 MHz, TA = 25 °C | 18 | |
| ADC0 Always-on Supply Current | IADC | 820 | 1200 | μA | 800 ksps 10-bit or 200 ksps 12-bit conversions; Normal bias settings; VDD = 3.0 V | 18 | |
| ADC0 Always-on Supply Current | IADC | 405 | 580 | μA | 250 ksps 10-bit or 62.5 ksps 12-bit conversions; Low power bias settings; VDD = 3.0 V | 18 | |
| Internal ADC0 Reference Supply Current, Normal Power Mode | IVREFFS | 680 | 790 | μA | Normal Power Mode | 19 | |
| Internal ADC0 Reference Supply Current, Low Power Mode | IVREFFS | 160 | 210 | μA | Low Power Mode | 19 | |
| Temperature Sensor Supply Current | ITSENSE | 70 | 120 | μA | 19 | ||
| Voltage Supply Monitor Supply Current | IVMON | 15 | 20 | μA | 19 | ||
| 5V Regulator Supply Current, Normal Mode | IVREG | 245 | 340 | μA | SUSEN = 0, BIASENB = 0 | 19 | |
| 5V Regulator Supply Current, Suspend Mode | IVREG | 60 | 100 | μA | SUSEN = 1, BIASENB = 0 | 19 | |
| 5V Regulator Supply Current, Bias Disabled | IVREG | 2.5 | 10 | μA | BIASENB = 1 | 19 | |
| VDD Supply Monitor Threshold | VVDDM | 1.95 | 2.05 | 2.15 | V | 20 | |
| Falling Voltage on VDD (POR Threshold) | VPOR | 0.75 | 1.36 | V | Falling Voltage on VDD | 20 | |
| Reset Delay from POR | tPOR | 3 | 10 | 31 | ms | Relative to VDD > VPOR | 20 |
| RST Low Time to Generate Reset | tRSTL | 15 | μs | 20 | |||
| Missing Clock Detector Response Time (final rising edge to reset) | tMCD | 0.625 | 1.2 | ms | FSYSCLK > 1 MHz | 20 | |
| Missing Clock Detector Trigger Frequency | FMCD | 7.5 | 13.5 | kHz | 20 | ||
| Write Time | tWRITE | 19 | 20 | 21 | μs | One Byte, FSYSCLK = 24.5 MHz | 20 |
| Erase Time | tERASE | 5.2 | 5.35 | 5.5 | ms | One Page, FSYSCLK = 24.5 MHz | 20 |
| VDD Voltage During Programming | VPROG | 2.2 | 3.6 | V | 20 | ||
| Idle Mode Wake-up Time | tIDLEWK | 2 | 3 | SYSCLKs | 21 | ||
| High Frequency Oscillator 0 Frequency | fHFOSC0 | 24 | 24.5 | 25 | MHz | Full Temperature and Supply Range | 21 |
| High Frequency Oscillator 1 Frequency | fHFOSC1 | 48.25 | 49 | 49.75 | MHz | Full Temperature and Supply Range | 21 |
| Low Frequency Oscillator Frequency | fLFOSC | 75 | 80 | 85 | kHz | Full Temperature and Supply Range | 21 |
| Internal Fast Settling Reference Output Voltage | VREFFS | 1.62 | 1.65 | 1.68 | V | 1.65 V Setting, Full Temperature and Supply Range | 24 |
| Internal Fast Settling Reference Output Voltage | VREFFS | 2.35 | 2.4 | 2.45 | V | 2.4 V Setting, VDD > 2.6 V | 24 |
| 1.8 V Internal LDO Output Voltage | VOUT_1.8V | 1.78 | 1.85 | 1.92 | V | 25 | |
| Output Voltage on VDD (5V Regulator) | VREGOUT | 3.1 | 3.3 | 3.6 | V | Output Current = 1 to 100 mA; Regulation range (VREGIN ≥ 4.1 V) | 25 |
| Output Current (5V Regulator) | IREGOUT | 100 | mA | 25 | |||
| Dropout Voltage (5V Regulator) | VDROPOUT | 0.8 | V | Output Current = 100 mA | 25 | ||
| Ambient Temperature Under Bias | TBIAS | -55 | 125 | °C | 28 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 28 | ||
| Voltage on VDD | VDD | 4.2 | V | 28 | |||
| Voltage on VREGIN | VREGIN | 5.8 | V | 28 | |||
| Voltage on I/O pins or RSTb | VIN | 5.8 | V | VDD > 3.3 V | 28 | ||
| Total Current Sunk into Supply Pin | IVDD | 200 | mA | 28 | |||
| Total Current Sourced out of Ground Pin | IGND | 200 | mA | 28 | |||
| Current Sourced or Sunk by any I/O Pin or RSTb | IIO | -100 | 100 | mA | 28 | ||
| Operating Junction Temperature | TJ | -40 | 130 | °C | TA = -40 °C to 125 °C (I-grade or A-grade parts only) | 28 | |
| Output Low Voltage (High Drive) | VOL | 0.6 | V | IOL = 13.5 mA, VDD ≥ 3.0 V | 27 | ||
| Input Low Voltage | VIL | 0.6 | V | 27 | |||
| Weak Pull-Up Current | IPU | -30 | -20 | -10 | μA | VIN = 0 V, VDD = 3.6 | 27 |
| Thermal Resistance (Junction to Ambient) | θJA | 26 | °C/W | QFN-28 Packages | 27 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. | 46 |
CAD (KiCad official)
- Symbol:
EFM8BB22F16I-C-QFN28 - Footprint:
Package_DFN_QFN:QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm - 3D model: VQFN-28-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
efm8bb22f16i-c-qfn28-etched.step/efm8bb22f16i-c-qfn28-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);efm8bb22f16i-c-qfn28.step/efm8bb22f16i-c-qfn28.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SILICON LABS datasheet (59 pp, sha256
68db19b3e729b537, retrieved 2026-11-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).