# DS8570F8

**DSTECH** · Linear Voltage Regulators (LDO) · ESOP-8

DS8570F8 from DSTECH, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | POK | output | Power good open-drain output that goes high once VOUT reaches 90% of its normal value; it needs a 100kΩ pull-up resistor to VOUT. |
| 2 | EN | input | Enable control input with logic-high VIH of at least 1.2V and logic-low VIL of at most 0.4V; the regulator is off when EN is low or floating because EN is pulled low internally. |
| 3 | VIN | power_in | Input supply voltage with a stated range of 1V to 5.5V; a 10uF or larger input capacitor placed as close to the IC as possible is recommended. |
| 4 | VCC | power_in | Supply voltage for the control circuit, 3V to 5.5V, which must stay above VOUT + 1.5V. |
| 5 | NC | unconnected | No internal connection. |
| 6 | VOUT | power_out | Regulated output voltage, adjustable from 0.8V up to VIN through the FB divider, with output current up to 3A. |
| 7 | FB | input | Feedback input for output voltage setting, where VOUT = VREF × (R1+R2)/R2 with VREF of 0.8V typical and R1 and R2 each above 10kΩ. |
| 8 | GND | power_in | Ground reference for the device. |
| 9 | GND | power_in | The exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | DSTECH |
| Package | ESOP-8 |
| Category | Power Management ICs |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN & VCC to GND |  | -0.3 |  | 6 | V |  | 4 |
| VOUT to GND |  | -0.3 |  | 6 | V |  | 4 |
| Other to GND |  | -0.3 |  | 6 | V |  | 4 |
| Lead Temperature (Soldering, 10 sec.) |  |  |  | 260 | °C | 10 sec soldering | 4 |
| Junction Temperature |  |  |  | 150 | °C |  | 4 |
| Storage Temperature Range |  | -60 |  | 150 | °C |  | 4 |
| ESD Susceptibility HBM |  |  |  | 2 | KV | HBM | 4 |
| Control Voltage, VCC | VCC | 3 |  | 5.5 | V | VCC > VOUT + 1.5V | 4 |
| Input Voltage | VIN | 1 |  | 5.5 | V |  | 4 |
| Junction Temperature Range |  | -40 |  | 125 | °C |  | 4 |
| Ambient Temperature Range |  | -40 |  | 85 | °C |  | 4 |
| VCC Operation Range | VDD | 3 |  | 5.5 | V |  | 5 |
| VCC POR Threshold | VPOR_VCC | 2.4 | 2.7 | 3 | V | VCC Rising | 5 |
| VCC POR Falling Hysteresis | VPOR_VCC | 0.15 | 0.2 |  | V | VCC Falling | 5 |
| Quiescent Current | IQ |  | 0.6 | 1.2 | mA | EN on, no load | 5 |
| Input Voltage Range | VIN | 1 |  | 5.5 | V |  | 5 |
| VIN POR Threshold | VPOR_VIN | 0.7 | 0.8 | 0.9 | V | VIN Rising | 5 |
| VIN POR Falling Hysteresis | VPOR_VIN | 0.15 | 0.2 | 0.25 | V | VIN Falling | 5 |
| Reference Voltage | VREF | 0.788 | 0.8 | 0.812 | V |  | 5 |
| VOUT Load Regulation | VLOAD |  | 0.5 | 1 | % | IOUT = 1mA to 3A, VIN = VOUT + 1V | 5 |
| OUT Line Regulation | VLINE |  | 0.2 | 0.6 | % | VCC = 3.6V to 5.5V, VIN = VOUT + 1V to 5V, IOUT = 1mA | 5 |
| Dropout Voltage | VDROP |  | 250 | 350 | mV | IOUT = 2A | 5 |
| Dropout Voltage | VDROP |  | 350 | 450 | mV | IOUT = 3A | 5 |
| Current Limit | ILIM | 3.1 | 3.6 | 4.2 | A | VIN = 3.6V | 5 |
| Short Circuit Current | ISC | 1 | 1.4 | 1.8 | A | VOUT < 0.2V | 5 |
| POK Delay Time |  |  | 1 | 1.5 | mS |  | 5 |
| POK Sink Capability | VPOK |  | 0.2 | 0.4 | V | ISINK = 10mA | 5 |
| EN Input Voltage Logic-High | VIH | 1.2 |  |  | V |  | 5 |
| EN Input Voltage Logic-Low | VIL |  |  | 0.4 | V |  | 5 |
| EN Delay Time |  | 0.3 | 0.85 | 1.4 | mS |  | 5 |
| VDD Pin Shutdown Current | ISHDN_VDD |  |  | 1 | uA | VEN = 0V | 6 |
| VIN Pin Shutdown Current | ISHDN_VIN |  |  | 1 | uA | VEN = 0V, VIN = 5V | 6 |
| Soft-Start Time | TSS | 1.9 | 2.8 | 3.75 | mS |  | 6 |
| Package Thermal Resistance, ESOP-8 junction-to-ambient | θJA |  | 75 |  | °C/W |  | 4 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | capacitors must be back to the DS8570 ground pin using as wide and as short of a copper trace as is practical. | 9 |

## CAD (KiCad official)

- Symbol: `DS8570F8`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `ds8570f8-etched.step` / `ds8570f8-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ds8570f8.step` / `ds8570f8.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [DSTECH datasheet](docs/ds8570f8-datasheet.pdf) (11 pp, sha256 `fb0319560326929d`, retrieved 2026-11-04, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ds8570f8-datasheet.pdf)