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DS25MB100TSQX
Public Made by Adomby adom
Texas Instruments Signal Buffers, Repeaters, Splitters, QFN-36-EP(6x6). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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DS25MB100TSQX
Texas Instruments · Signal Buffers, Repeaters, Splitters · QFN-36-EP(6x6)
DS25MB100TSQX from Texas Instruments, in a QFN-36-EP(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DES1 | input | Selects the output pre-emphasis of the switch-side drivers (OUT0±, OUT1±) together with DES0, and is internally pulled high. |
| 2 | GND | power_in | Ground reference that must be connected to the ground plane through a low-inductance path, typically with a via placed as close as possible to the pin. |
| 3 | OUT0+ | output | Non-inverting switch-side differential output 0, internally terminated with 50 Ω to VCC, and must be AC coupled. |
| 4 | OUT0- | output | Inverting switch-side differential output 0, internally terminated with 50 Ω to VCC, and must be AC coupled. |
| 5 | VCC | power_in | Supply pin for 3.3 V ±5%, to be bypassed to ground plane with a 0.01-µF or 0.1-µF X7R size-0402 capacitor. |
| 6 | IN0+ | input | Non-inverting switch-side mux differential input 0, internally terminated with 50 Ω to an internal reference voltage, and must be AC coupled. |
| 7 | IN0- | input | Inverting switch-side mux differential input 0, internally terminated with 50 Ω to an internal reference voltage, and must be AC coupled. |
| 8 | GND | power_in | Ground reference that must be connected to the ground plane through a low-inductance path, typically with a via placed as close as possible to the pin. |
| 9 | GND | power_in | Ground reference that must be connected to the ground plane through a low-inductance path, typically with a via placed as close as possible to the pin. |
| 10 | DES0 | input | Selects the output pre-emphasis of the switch-side drivers (OUT0±, OUT1±) together with DES1, and is internally pulled high. |
| 11 | EQL | input | A logic low enables the line-side input equalizer, with a default of EQ disabled, and the pin is internally pulled high. |
| 12 | GND | power_in | Ground reference that must be connected to the ground plane through a low-inductance path, typically with a via placed as close as possible to the pin. |
| 13 | VCC | power_in | Supply pin for 3.3 V ±5%, to be bypassed to ground plane with a 0.01-µF or 0.1-µF X7R size-0402 capacitor. |
| 14 | GND | power_in | Ground reference that must be connected to the ground plane through a low-inductance path, typically with a via placed as close as possible to the pin. |
| 15 | VCC | power_in | Supply pin for 3.3 V ±5%, to be bypassed to ground plane with a 0.01-µF or 0.1-µF X7R size-0402 capacitor. |
| 16 | GND | power_in | Ground reference that must be connected to the ground plane through a low-inductance path, typically with a via placed as close as possible to the pin. |
| 17 | RSV | input | Reserved for factory testing; it may be left open, tied to GND, or tied to GND through an external pulldown resistor. |
| 18 | DEL0 | input | Selects the output pre-emphasis of the line-side drivers (OUT±) together with DEL1, and is internally pulled high. |
| 19 | MUX | input | A logic low selects IN1±; the pin is internally pulled high and the default state selects IN0±. |
| 20 | GND | power_in | Ground reference that must be connected to the ground plane through a low-inductance path, typically with a via placed as close as possible to the pin. |
| 21 | OUT1- | output | Inverting switch-side differential output 1, internally terminated with 50 Ω to VCC, and must be AC coupled. |
| 22 | OUT1+ | output | Non-inverting switch-side differential output 1, internally terminated with 50 Ω to VCC, and must be AC coupled. |
| 23 | VCC | power_in | Supply pin for 3.3 V ±5%, to be bypassed to ground plane with a 0.01-µF or 0.1-µF X7R size-0402 capacitor. |
| 24 | IN1- | input | Inverting switch-side mux differential input 1, internally terminated with 50 Ω to an internal reference voltage, and must be AC coupled. |
| 25 | IN1+ | input | Non-inverting switch-side mux differential input 1, internally terminated with 50 Ω to an internal reference voltage, and must be AC coupled. |
| 26 | LB1 | input | A logic low enables the internal loopback path from IN1± to OUT1±, and the pin is internally pulled high. |
| 27 | DEL1 | input | Selects the output pre-emphasis of the line-side drivers (OUT±) together with DEL0, and is internally pulled high. |
| 28 | LB0 | input | A logic low enables the internal loopback path from IN0± to OUT0±, and the pin is internally pulled high. |
| 29 | GND | power_in | Ground reference that must be connected to the ground plane through a low-inductance path, typically with a via placed as close as possible to the pin. |
| 30 | OUT+ | output | Non-inverting line-side differential output, internally terminated with 50 Ω to VCC, and must be AC coupled. |
| 31 | OUT− | output | Inverting line-side differential output, internally terminated with 50 Ω to VCC, and must be AC coupled. |
| 32 | VCC | power_in | Supply pin for 3.3 V ±5%, to be bypassed to ground plane with a 0.01-µF or 0.1-µF X7R size-0402 capacitor. |
| 33 | IN+ | input | Non-inverting line-side differential input, internally terminated with 50 Ω to an internal reference voltage, and must be AC coupled. |
| 34 | IN− | input | Inverting line-side differential input, internally terminated with 50 Ω to an internal reference voltage, and must be AC coupled. |
| 35 | GND | power_in | Ground reference that must be connected to the ground plane through a low-inductance path, typically with a via placed as close as possible to the pin. |
| 36 | EQS | input | A logic low enables the switch-side input equalizer, with a default of EQ disabled, and the pin is internally pulled high. |
| 37 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-36-EP(6x6) |
| Category | Interface |
| Pins | 37 |
CAD (KiCad official)
- Symbol:
DS25MB100TSQX - Footprint:
Package_DFN_QFN:QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm - 3D model: QFN-36-EP(6x6) (KiCad packages3D, STEP)
- 3D model files:
ds25mb100tsqx-etched.step/ds25mb100tsqx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ds25mb100tsqx.step/ds25mb100tsqx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (23 pp, sha256
1cadf90de3d08519, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).