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DS25BR110TSD

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Texas Instruments LVDS ICs, WSON-8-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterfaceds25br110tsdfactory-2.0.0extractor-text

Verified DS25BR110TSD

by Ray · last 11 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

11 Nov 2026RayPublished by the parts factory: tier mfr, 9 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: DS25BR110TSD · WSON-8-EP(3x3) · 9 pins
  • ✓copper: 9 copper pads, none touching another net
  • ✓datasheet: all 9 pin names found in the 21-page datasheet
  • ✓distributor: lcsc C206501, digikey DS25BR110TSD/NOPBTR-ND, mouser 926-DS25BR110TSDNOPB
  • ✓family: WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-ji6lijew/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • ✓package_fit: height within the datasheet's package drawing (datasheet p.18)
  • ✓pads: 9 pins = 9 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 9 pins agree
  • ✓symbol_text: no pin names collide
  • ✓viewers: viewers/footprint.html 20 kB, viewers/symbol.html 10 kB
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ ds25br110tsd.kicad_sym✓ ds25br110tsd.kicad_mod✓ ds25br110tsd.step
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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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docs Publish 0.1.0 · Ray
viewers ds25br110tsd: viewers rendered from the public page · Ray
ds25br110tsd-etched.glb Publish 0.1.0 · Ray
ds25br110tsd-etched.step ds25br110tsd: factory component page (tier=mfr) · Ray
ds25br110tsd-hero.glb ds25br110tsd: hero GLB from the etched model (keeps the MPN mark) · Ray
ds25br110tsd-hero.overlay.json Publish 0.1.0 · Ray
ds25br110tsd.glb Publish 0.1.0 · Ray
ds25br110tsd.kicad_mod Publish 0.1.0 · Ray
ds25br110tsd.kicad_sym Publish 0.1.0 · Ray
ds25br110tsd.lbr Publish 0.1.0 · Ray
ds25br110tsd.step Publish 0.1.0 · Ray
package.json Publish 0.1.0 · Ray
page.json Set visibility: public · Ray
README.md Publish 0.1.0 · Ray
verification.json Verified: Published by the parts factory: tier mfr, 9 pins · Ray

DS25BR110TSD

Texas Instruments · LVDS ICs · WSON-8-EP(3x3)

DS25BR110TSD from Texas Instruments, in a WSON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EQ0 input Equalizer select pin; with EQ1 sets equalization Off, Low (approx. 4 dB at 1.56 GHz), Medium (approx. 8 dB) or High (approx. 16 dB), with LVCMOS VIH min 2.0V and VIL max 0.8V.
2 IN+ input Non-inverting LVDS input pin with internal 100Ω termination to IN-, differential input voltage 0 to 1 V.
3 IN- input Inverting LVDS input pin with internal 100Ω termination to IN+, differential input voltage 0 to 1 V.
4 EQ1 input Equalizer select pin; with EQ0 sets equalization Off, Low (approx. 4 dB at 1.56 GHz), Medium (approx. 8 dB) or High (approx. 16 dB), with LVCMOS VIH min 2.0V and VIL max 0.8V.
5 NC unconnected No connect pin.
6 OUT- output Inverting LVDS output pin with internal 100Ω termination to OUT+, VOD typically 350 mV.
7 OUT+ output Non-inverting LVDS output pin with internal 100Ω termination to OUT-, VOD typically 350 mV.
8 VCC power_in Power supply pin, 3.0V to 3.6V recommended operating range (3.3V typical).
9 GND power_in Ground pad (DAP, die attach pad), which must be soldered to the board for thermal and mechanical performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-8-EP(3x3)
Category Interface
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 4 V 3
LVCMOS Input Voltage (EQ0, EQ1) -0.3 V 3
LVDS Input Voltage (IN+, IN-) -0.3 4 V 3
Differential Input Voltage /VID/ 1 V 3
LVDS Output Voltage (OUT+, OUT-) -0.3 V 3
LVDS Differential Output Voltage ((OUT+) - (OUT-)) 0 1 V 3
LVDS Output Short Circuit Current Duration 5 ms 3
Junction Temperature 150 °C 3
Storage Temperature Range -65 150 °C 3
Lead Temperature Range Soldering 260 °C 4 sec. 3
Maximum Package Power Dissipation at NGQ0008A Package 2.08 W 25°C 3
Package Thermal Resistance junction-to-ambient θJA 60 °C/W 3
Package Thermal Resistance junction-to-case θJC 12.3 °C/W 3
ESD Susceptibility HBM 7 kV Human Body Model, JESD22-A114C 3
Supply Voltage VCC 3 3.3 3.6 V 3
Receiver Differential Input Voltage VID 1 V 3
Operating Free Air Temperature TA -40 25 85 °C 3
High Level Input Voltage VIH 2 V 4
Low Level Input Voltage VIL 0.8 V 4
High Level Input Current IIH -10 0 10 μA VIN = 3.6V, VCC = 3.6V 4
Low Level Input Current IIL -10 0 10 μA VIN = GND, VCC = 3.6V 4
Input Clamp Voltage VCL -1.5 -0.9 V ICL = −18 mA, VCC = 0V 4
Differential Output Voltage VOD 250 350 450 mV 4
Change in Magnitude of VOD for Complimentary Output States ΔVOD -35 35 mV RL = 100Ω 4
Offset Voltage VOS 1.05 1.2 1.375 V 4
Change in Magnitude of VOS for Complimentary Output States ΔVOS -35 35 mV RL = 100Ω 4
Output Short Circuit Current IOS -55 -35 mA OUT to GND 4
Output Short Circuit Current IOS 7 55 mA OUT to VCC 4
Output Capacitance COUT 1.2 pF Any LVDS Output Pin to GND 4
Output Termination Resistor ROUT 100 Ω Between OUT+ and OUT- 4
Input Differential Voltage VID 0 1 V 4
Differential Input High Threshold VTH 0 100 mV VCM = +0.05V or VCC-0.05V 4
Differential Input Low Threshold VTL -100 0 mV 4
Common Mode Voltage Range VCMR 0.05 V VID = 100 mV 4
Input Current IIN -10 10 μA VIN = 3.6V or 0V, VCC = 3.6V or 0V 4
Input Capacitance CIN 1.7 pF Any LVDS Input Pin to GND 4
Input Termination Resistor RIN 100 Ω Between IN+ and IN- 4
Supply Current ICC 35 43 mA EQ0 = 0, EQ1 = 0 4
Differential Propagation Delay High to Low tPHLD 350 465 ps RL = 100Ω 5
Differential Propagation Delay Low to High tPLHD 350 465 ps RL = 100Ω 5
Pulse Skew tSKD1 45 100 ps 5
Part to Part Skew tSKD2 45 150 ps 5
Rise Time tLHT 80 150 ps RL = 100Ω 5
Fall Time tHLT 80 150 ps RL = 100Ω 5
Deterministic Jitter (Peak to Peak), EQ off, 2.5 Gbps tDJ1A 11 40 ps VID = 350 mV, VCM = 1.2V, 2.5 Gbps 5
Deterministic Jitter (Peak to Peak), EQ off, K28.5 3.125 Gbps tDJ2A 11 47 ps K28.5 (NRZ), 3.125 Gbps, EQ0 = 0, EQ1 = 0 5
Total Jitter (Peak to Peak), EQ off, 2.5 Gbps tTJ1A 0.05 0.16 UIP-P VID = 350 mV, VCM = 1.2V, 2.5 Gbps 5
Total Jitter (Peak to Peak), EQ off, PRBS-23 3.125 Gbps tTJ2A 0.08 0.2 UIP-P PRBS-23 (NRZ), 3.125 Gbps, EQ0 = 0, EQ1 = 0 5
Deterministic Jitter (Peak to Peak), EQ low, 2.5 Gbps tDJ1B 1 16 ps VID = 350 mV, VCM = 1.2V, 2.5 Gbps 5
Deterministic Jitter (Peak to Peak), EQ low, K28.5 3.125 Gbps tDJ2B 11 31 ps K28.5 (NRZ), 3.125 Gbps, EQ0 = 1, EQ1 = 0 5
Total Jitter (Peak to Peak), EQ low, 2.5 Gbps tTJ1B 0.03 0.09 UIP-P VID = 350 mV, VCM = 1.2V, 2.5 Gbps 5
Total Jitter (Peak to Peak), EQ low, PRBS-23 3.125 Gbps tTJ2B 0.06 0.14 UIP-P PRBS-23 (NRZ), 3.125 Gbps, EQ0 = 1, EQ1 = 0 5
Deterministic Jitter (Peak to Peak), EQ medium, 2.5 Gbps tDJ1C 10 29 ps VID = 350 mV, VCM = 1.2V, 2.5 Gbps 5
Deterministic Jitter (Peak to Peak), EQ medium, K28.5 3.125 Gbps tDJ2C 27 43 ps K28.5 (NRZ), 3.125 Gbps, EQ0 = 0, EQ1 = 1 5
Total Jitter (Peak to Peak), EQ medium, 2.5 Gbps tTJ1C 0.07 0.12 UIP-P VID = 350 mV, VCM = 1.2V, 2.5 Gbps 6
Total Jitter (Peak to Peak), EQ medium, PRBS-23 3.125 Gbps tTJ2C 0.12 0.17 UIP-P PRBS-23 (NRZ), 3.125 Gbps, EQ0 = 0, EQ1 = 1 6
Deterministic Jitter (Peak to Peak), EQ high, 2.5 Gbps tDJ1D 30 45 ps VID = 350 mV, VCM = 1.2V, 2.5 Gbps 6
Deterministic Jitter (Peak to Peak), EQ high, K28.5 3.125 Gbps tDJ2D 43 59 ps K28.5 (NRZ), 3.125 Gbps, EQ0 = 1, EQ1 = 1 6
Total Jitter (Peak to Peak), EQ high, 2.5 Gbps tTJ1D 0.14 0.27 UIP-P VID = 350 mV, VCM = 1.2V, 2.5 Gbps 6
Total Jitter (Peak to Peak), EQ high, PRBS-23 3.125 Gbps tTJ2D 0.19 0.28 UIP-P PRBS-23 (NRZ), 3.125 Gbps, EQ0 = 1, EQ1 = 1 6

CAD (KiCad official)

  • Symbol: DS25BR110TSD
  • Footprint: Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
  • 3D model: WSON-8-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: ds25br110tsd-etched.step / ds25br110tsd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds25br110tsd.step / ds25br110tsd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (21 pp, sha256 9154aabe2fa293a3, retrieved 2026-11-11, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF