DS25BR110TSD from Texas Instruments, in a WSON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	EQ0	input	Equalizer select pin; with EQ1 sets equalization Off, Low (approx. 4 dB at 1.56 GHz), Medium (approx. 8 dB) or High (approx. 16 dB), with LVCMOS VIH min 2.0V and VIL max 0.8V.
2	IN+	input	Non-inverting LVDS input pin with internal 100Ω termination to IN-, differential input voltage 0 to 1 V.
3	IN-	input	Inverting LVDS input pin with internal 100Ω termination to IN+, differential input voltage 0 to 1 V.
4	EQ1	input	Equalizer select pin; with EQ0 sets equalization Off, Low (approx. 4 dB at 1.56 GHz), Medium (approx. 8 dB) or High (approx. 16 dB), with LVCMOS VIH min 2.0V and VIL max 0.8V.
5	NC	unconnected	No connect pin.
6	OUT-	output	Inverting LVDS output pin with internal 100Ω termination to OUT+, VOD typically 350 mV.
7	OUT+	output	Non-inverting LVDS output pin with internal 100Ω termination to OUT-, VOD typically 350 mV.
8	VCC	power_in	Power supply pin, 3.0V to 3.6V recommended operating range (3.3V typical).
9	GND	power_in	Ground pad (DAP, die attach pad), which must be soldered to the board for thermal and mechanical performance.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	WSON-8-EP(3x3)
Category	Interface
Pins	9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage	VCC	-0.3		4	V		3
LVCMOS Input Voltage (EQ0, EQ1)		-0.3			V		3
LVDS Input Voltage (IN+, IN-)		-0.3		4	V		3
Differential Input Voltage	/VID/			1	V		3
LVDS Output Voltage (OUT+, OUT-)		-0.3			V		3
LVDS Differential Output Voltage ((OUT+) - (OUT-))		0		1	V		3
LVDS Output Short Circuit Current Duration				5	ms		3
Junction Temperature				150	°C		3
Storage Temperature Range		-65		150	°C		3
Lead Temperature Range Soldering				260	°C	4 sec.	3
Maximum Package Power Dissipation at NGQ0008A Package				2.08	W	25°C	3
Package Thermal Resistance junction-to-ambient	θJA			60	°C/W		3
Package Thermal Resistance junction-to-case	θJC			12.3	°C/W		3
ESD Susceptibility HBM		7			kV	Human Body Model, JESD22-A114C	3
Supply Voltage	VCC	3	3.3	3.6	V		3
Receiver Differential Input Voltage	VID			1	V		3
Operating Free Air Temperature	TA	-40	25	85	°C		3
High Level Input Voltage	VIH	2			V		4
Low Level Input Voltage	VIL			0.8	V		4
High Level Input Current	IIH	-10	0	10	μA	VIN = 3.6V, VCC = 3.6V	4
Low Level Input Current	IIL	-10	0	10	μA	VIN = GND, VCC = 3.6V	4
Input Clamp Voltage	VCL	-1.5		-0.9	V	ICL = −18 mA, VCC = 0V	4
Differential Output Voltage	VOD	250	350	450	mV		4
Change in Magnitude of VOD for Complimentary Output States	ΔVOD	-35		35	mV	RL = 100Ω	4
Offset Voltage	VOS	1.05	1.2	1.375	V		4
Change in Magnitude of VOS for Complimentary Output States	ΔVOS	-35		35	mV	RL = 100Ω	4
Output Short Circuit Current	IOS	-55		-35	mA	OUT to GND	4
Output Short Circuit Current	IOS	7		55	mA	OUT to VCC	4
Output Capacitance	COUT		1.2		pF	Any LVDS Output Pin to GND	4
Output Termination Resistor	ROUT		100		Ω	Between OUT+ and OUT-	4
Input Differential Voltage	VID	0		1	V		4
Differential Input High Threshold	VTH	0		100	mV	VCM = +0.05V or VCC-0.05V	4
Differential Input Low Threshold	VTL	-100		0	mV		4
Common Mode Voltage Range	VCMR	0.05			V	VID = 100 mV	4
Input Current	IIN	-10		10	μA	VIN = 3.6V or 0V, VCC = 3.6V or 0V	4
Input Capacitance	CIN		1.7		pF	Any LVDS Input Pin to GND	4
Input Termination Resistor	RIN		100		Ω	Between IN+ and IN-	4
Supply Current	ICC		35	43	mA	EQ0 = 0, EQ1 = 0	4
Differential Propagation Delay High to Low	tPHLD		350	465	ps	RL = 100Ω	5
Differential Propagation Delay Low to High	tPLHD		350	465	ps	RL = 100Ω	5
Pulse Skew	tSKD1		45	100	ps		5
Part to Part Skew	tSKD2		45	150	ps		5
Rise Time	tLHT		80	150	ps	RL = 100Ω	5
Fall Time	tHLT		80	150	ps	RL = 100Ω	5
Deterministic Jitter (Peak to Peak), EQ off, 2.5 Gbps	tDJ1A		11	40	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps	5
Deterministic Jitter (Peak to Peak), EQ off, K28.5 3.125 Gbps	tDJ2A		11	47	ps	K28.5 (NRZ), 3.125 Gbps, EQ0 = 0, EQ1 = 0	5
Total Jitter (Peak to Peak), EQ off, 2.5 Gbps	tTJ1A		0.05	0.16	UIP-P	VID = 350 mV, VCM = 1.2V, 2.5 Gbps	5
Total Jitter (Peak to Peak), EQ off, PRBS-23 3.125 Gbps	tTJ2A		0.08	0.2	UIP-P	PRBS-23 (NRZ), 3.125 Gbps, EQ0 = 0, EQ1 = 0	5
Deterministic Jitter (Peak to Peak), EQ low, 2.5 Gbps	tDJ1B		1	16	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps	5
Deterministic Jitter (Peak to Peak), EQ low, K28.5 3.125 Gbps	tDJ2B		11	31	ps	K28.5 (NRZ), 3.125 Gbps, EQ0 = 1, EQ1 = 0	5
Total Jitter (Peak to Peak), EQ low, 2.5 Gbps	tTJ1B		0.03	0.09	UIP-P	VID = 350 mV, VCM = 1.2V, 2.5 Gbps	5
Total Jitter (Peak to Peak), EQ low, PRBS-23 3.125 Gbps	tTJ2B		0.06	0.14	UIP-P	PRBS-23 (NRZ), 3.125 Gbps, EQ0 = 1, EQ1 = 0	5
Deterministic Jitter (Peak to Peak), EQ medium, 2.5 Gbps	tDJ1C		10	29	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps	5
Deterministic Jitter (Peak to Peak), EQ medium, K28.5 3.125 Gbps	tDJ2C		27	43	ps	K28.5 (NRZ), 3.125 Gbps, EQ0 = 0, EQ1 = 1	5
Total Jitter (Peak to Peak), EQ medium, 2.5 Gbps	tTJ1C		0.07	0.12	UIP-P	VID = 350 mV, VCM = 1.2V, 2.5 Gbps	6
Total Jitter (Peak to Peak), EQ medium, PRBS-23 3.125 Gbps	tTJ2C		0.12	0.17	UIP-P	PRBS-23 (NRZ), 3.125 Gbps, EQ0 = 0, EQ1 = 1	6
Deterministic Jitter (Peak to Peak), EQ high, 2.5 Gbps	tDJ1D		30	45	ps	VID = 350 mV, VCM = 1.2V, 2.5 Gbps	6
Deterministic Jitter (Peak to Peak), EQ high, K28.5 3.125 Gbps	tDJ2D		43	59	ps	K28.5 (NRZ), 3.125 Gbps, EQ0 = 1, EQ1 = 1	6
Total Jitter (Peak to Peak), EQ high, 2.5 Gbps	tTJ1D		0.14	0.27	UIP-P	VID = 350 mV, VCM = 1.2V, 2.5 Gbps	6
Total Jitter (Peak to Peak), EQ high, PRBS-23 3.125 Gbps	tTJ2D		0.19	0.28	UIP-P	PRBS-23 (NRZ), 3.125 Gbps, EQ0 = 1, EQ1 = 1	6

CAD (KiCad official)

Symbol: DS25BR110TSD
Footprint: Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
3D model: WSON-8-EP(3x3) (KiCad packages3D, STEP)
3D model files: ds25br110tsd-etched.step / ds25br110tsd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds25br110tsd.step / ds25br110tsd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (21 pp, sha256 9154aabe2fa293a3, retrieved 2026-11-11, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

DS25BR110TSD

Verified DS25BR110TSD

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README