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Contents

README

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DS15BR401TVSX

Texas Instruments · LVDS ICs · TQFP-48(7x7)

DS15BR401TVSX from Texas Instruments, in a TQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N/C unconnected No connect pin on the TQFP package; leave unconnected.
2 PEM input LVTTL pre-emphasis control input that applies to all channels (0 = off, 1 = on, about 6 dB boost at 750 MHz); VIH is 2.0 V minimum and VIL is 0.8 V maximum.
3 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
4 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
5 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
6 N/C unconnected No connect pin on the TQFP package; leave unconnected.
7 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
8 GND power_in Ground reference for LVDS and CMOS circuitry.
9 GND power_in Ground reference for LVDS and CMOS circuitry.
10 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
11 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
12 PWDN input LVTTL input; a logic low activates the hardware power-down mode for all channels, powering off all input and output buffers and internal bias.
13 IN0+ input Channel 0 non-inverting LVDS differential input (differential input voltage 100 mV to 2400 mV); the DS15BR400 has an internal 100 Ω termination across IN0+/IN0-.
14 IN0- input Channel 0 inverting LVDS differential input (differential input voltage 100 mV to 2400 mV); the DS15BR400 has an internal 100 Ω termination across IN0+/IN0-.
15 IN1+ input Channel 1 non-inverting LVDS differential input (differential input voltage 100 mV to 2400 mV); the DS15BR400 has an internal 100 Ω termination across IN1+/IN1-.
16 IN1- input Channel 1 inverting LVDS differential input (differential input voltage 100 mV to 2400 mV); the DS15BR400 has an internal 100 Ω termination across IN1+/IN1-.
17 GND power_in Ground reference for LVDS and CMOS circuitry.
18 GND power_in Ground reference for LVDS and CMOS circuitry.
19 IN2+ input Channel 2 non-inverting LVDS differential input (differential input voltage 100 mV to 2400 mV); the DS15BR400 has an internal 100 Ω termination across IN2+/IN2-.
20 IN2- input Channel 2 inverting LVDS differential input (differential input voltage 100 mV to 2400 mV); the DS15BR400 has an internal 100 Ω termination across IN2+/IN2-.
21 IN3+ input Channel 3 non-inverting LVDS differential input (differential input voltage 100 mV to 2400 mV); the DS15BR400 has an internal 100 Ω termination across IN3+/IN3-.
22 IN3- input Channel 3 inverting LVDS differential input (differential input voltage 100 mV to 2400 mV); the DS15BR400 has an internal 100 Ω termination across IN3+/IN3-.
23 GND power_in Ground reference for LVDS and CMOS circuitry.
24 GND power_in Ground reference for LVDS and CMOS circuitry.
25 N/C unconnected No connect pin on the TQFP package; leave unconnected.
26 N/C unconnected No connect pin on the TQFP package; leave unconnected.
27 N/C unconnected No connect pin on the TQFP package; leave unconnected.
28 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
29 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
30 N/C unconnected No connect pin on the TQFP package; leave unconnected.
31 N/C unconnected No connect pin on the TQFP package; leave unconnected.
32 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
33 VDD power_in 3.3 V supply pin (VDD = 3.3 V ±10%, recommended 3.0 V to 3.6 V); decouple close to the pin.
34 N/C unconnected No connect pin on the TQFP package; leave unconnected.
35 N/C unconnected No connect pin on the TQFP package; leave unconnected.
36 N/C unconnected No connect pin on the TQFP package; leave unconnected.
37 GND power_in Ground reference for LVDS and CMOS circuitry.
38 GND power_in Ground reference for LVDS and CMOS circuitry.
39 OUT3- output Channel 3 inverting LVDS differential output with 100 Ω integrated output termination; for point-to-point backplane and cable use only, not multidrop (BLVDS).
40 OUT3+ output Channel 3 non-inverting LVDS differential output with 100 Ω integrated output termination; for point-to-point backplane and cable use only, not multidrop (BLVDS).
41 OUT2- output Channel 2 inverting LVDS differential output with 100 Ω integrated output termination; for point-to-point backplane and cable use only, not multidrop (BLVDS).
42 OUT2+ output Channel 2 non-inverting LVDS differential output with 100 Ω integrated output termination; for point-to-point backplane and cable use only, not multidrop (BLVDS).
43 GND power_in Ground reference for LVDS and CMOS circuitry.
44 GND power_in Ground reference for LVDS and CMOS circuitry.
45 OUT1- output Channel 1 inverting LVDS differential output with 100 Ω integrated output termination; for point-to-point backplane and cable use only, not multidrop (BLVDS).
46 OUT1+ output Channel 1 non-inverting LVDS differential output with 100 Ω integrated output termination; for point-to-point backplane and cable use only, not multidrop (BLVDS).
47 OUT0- output Channel 0 inverting LVDS differential output with 100 Ω integrated output termination; for point-to-point backplane and cable use only, not multidrop (BLVDS).
48 OUT0+ output Channel 0 non-inverting LVDS differential output with 100 Ω integrated output termination; for point-to-point backplane and cable use only, not multidrop (BLVDS).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TQFP-48(7x7)
Category Interface
Pins 48

CAD (KiCad official)

  • Symbol: DS15BR401TVSX
  • Footprint: Package_QFP:TQFP-48_7x7mm_P0.5mm
  • 3D model: TQFP-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: ds15br401tvsx-etched.step / ds15br401tvsx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds15br401tvsx.step / ds15br401tvsx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (24 pp, sha256 d2f51d86ec9c5b5f, retrieved 2026-10-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF