DS10BR150TSD from Texas Instruments, in a WSON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	NC	unconnected	No connect pin.
2	IN+	input	Non-inverting LVDS input with internal 100Ω termination to IN-; accepts LVDS, CML and LVPECL levels, input range -0.3V to +4V absolute maximum.
3	IN-	input	Inverting LVDS input with internal 100Ω termination to IN+; accepts LVDS, CML and LVPECL levels, input range -0.3V to +4V absolute maximum.
4	NC	unconnected	No connect pin.
5	NC	unconnected	No connect pin.
6	OUT-	output	Inverting LVDS output with internal 100Ω termination to OUT+, typical VOD 350 mV (250 to 450 mV).
7	OUT+	output	Non-inverting LVDS output with internal 100Ω termination to OUT-, typical VOD 350 mV (250 to 450 mV).
8	VCC	power_in	Power supply pin, 3.0V to 3.6V recommended operating range (3.3V typical).
9	GND	power_in	Ground pad (DAP, die attach pad), which must be soldered to the board for thermal and mechanical performance.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	WSON-8-EP(3x3)
Category	Interface
Pins	9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage (VCC)	VCC	-0.3		4	V		3
LVDS Input Voltage (IN+, IN−)		-0.3		4	V		3
Differential Input Voltage /VID/	/VID/			1	V		3
LVDS Output Voltage (OUT+, OUT−)		-0.3			V		3
LVDS Differential Output Voltage ((OUT+) − (OUT−))		0		1	V		3
LVDS Output Short Circuit Current Duration				5	ms		3
Junction Temperature				150	°C		3
Storage Temperature Range		-65		150	°C		3
Lead Temperature Range Soldering				260	°C	Soldering (4 sec.)	3
Maximum Package Power Dissipation at 25°C				2.08	W	NGQ Package, at 25°C	3
ESD Susceptibility HBM		7			kV	Human Body Model, JESD22-A114C	3
ESD Susceptibility MM		250			V	Machine Model, JESD22-A115-A	3
ESD Susceptibility CDM		1250			V	Field Induced Charge Device Model, JESD22-C101-C	3
Supply Voltage (VCC)	VCC	3	3.3	3.6	V		3
Receiver Differential Input Voltage (VID)	VID	0		1	V		3
Operating Free Air Temperature (TA)	TA	-40	25	85	°C		3
Package Thermal Resistance θJA	θJA		60		°C/W		3
Package Thermal Resistance θJC	θJC		12.3		°C/W		3
Differential Output Voltage	VOD	250	350	450	mV		4
Change in Magnitude of VOD for Complimentary Output States	ΔVOD	-35		35	mV	RL = 100Ω	4
Offset Voltage	VOS	1.05	1.2	1.375	V		4
Change in Magnitude of VOS for Complimentary Output States	ΔVOS	-35		35	mV	RL = 100Ω	4
Output Short Circuit Current	IOS	-50		-30	mA	OUT to GND	4
Output Short Circuit Current	IOS	7.5		50	mA	OUT to VCC	4
Input Differential Voltage	VID	0		1	V		4
Differential Input High Threshold	VTH	0		100	mV	VCM = +0.05V or VCC-0.05V	4
Differential Input Low Threshold	VTL	-100		0	mV		4
Common Mode Voltage Range	VCMR	0.05			V	VID = 100 mV	4
Input Current	IIN	-10		10	μA	VIN = 3.6V or 0V; VCC = 3.6V or 0V	4
Total Supply Current	ICCD		16	21	mA		4
Differential Propagation Delay High to Low	tPHLD2		380	600	ps	RL = 100Ω	5
Differential Propagation Delay Low to High	tPLHD2		410	600	ps	RL = 100Ω	5
Pulse Skew /tPLHD − tPHLD/	tSKD1		30	150	ps		5
Part to Part Skew	tSKD2		45	160	ps		5
Rise Time	tLHT		165	400	ps	RL = 100Ω	5
Fall Time	tHLT		155	400	ps	RL = 100Ω	5
Deterministic Jitter (Peak-to-Peak Value)	tDJ		12	39	ps	VID = 350 mV, VCM = 1.2V, 622 Mbps	5
Deterministic Jitter (Peak-to-Peak Value)	tDJ		15	42	ps	VID = 350 mV, VCM = 1.2V, K28.5 1.06 Gbps (NRZ)	5
Random Jitter (RMS Value)	tRJ		0.6	1.3	ps	VID = 350 mV, VCM = 1.2V, 311 MHz	5
Random Jitter (RMS Value)	tRJ		0.6	1.1	ps	VID = 350 mV, VCM = 1.2V, Clock 503 MHz (NRZ)	5
Total Jitter (Peak to Peak Value)	tTJ		0.02	0.04	UIP-P	VID = 350 mV, VCM = 1.2V, 622 Mbps	5
Total Jitter (Peak to Peak Value)	tTJ		0.02	0.05	UIP-P	VID = 350 mV, VCM = 1.2V, PRBS-23 (NRZ) 1.06 Gbps	5

CAD (KiCad official)

Symbol: DS10BR150TSD
Footprint: Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
3D model: WSON-8-EP(3x3) (KiCad packages3D, STEP)
3D model files: ds10br150tsd-etched.step / ds10br150tsd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds10br150tsd.step / ds10br150tsd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (17 pp, sha256 9757757eba5cdd66, retrieved 2026-11-11, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

DS10BR150TSD

Verified DS10BR150TSD

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README