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README

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DS100BR111SQ

Texas Instruments · Signal Buffers, Repeaters, Splitters · WQFN-24-EP(4x4)

DS100BR111SQ from Texas Instruments, in a WQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EQB0/AD3 input 4-level input that sets channel B equalization (EQB0) in pin mode (ENSMB = 0) and becomes SMBus slave address bit AD3 when ENSMB = 1.
2 EQB1/AD2 input 4-level input that sets channel B equalization (EQB1) in pin mode (ENSMB = 0) and becomes SMBus slave address bit AD2 when ENSMB = 1.
3 ENSMB input 4-level SMBus enable: High = SMBus slave mode register access, Float = read external EEPROM (SMBus master mode), tie 1 kΩ to GND = pin mode.
4 SDA/DEMA bidirectional In SMBus modes it is the SMBus data I/O (open drain, external 2 kΩ to 5 kΩ pull-up recommended); in pin mode (ENSMB = 0) it is the 4-level DEMA input setting channel A de-emphasis.
5 SCL/DEMB bidirectional In SMBus modes it is the SMBus clock (output while loading EEPROM, then input; open drain, external 2 kΩ to 5 kΩ pull-up recommended); in pin mode (ENSMB = 0) it is the 4-level DEMB input setting channel B de-emphasis.
6 TX_DIS input 2-level LVCMOS input: High = OUTA enabled and OUTB disabled, Low = OUTA and OUTB enabled.
7 OUTA+ output Non-inverting 50 Ω CML driver output of channel A with de-emphasis, compatible with AC-coupled CML inputs.
8 OUTA- output Inverting 50 Ω CML driver output of channel A with de-emphasis, compatible with AC-coupled CML inputs.
9 AD1/EQA1 input 4-level input that sets channel A equalization (EQA1) in pin mode (ENSMB = 0) and is SMBus slave address bit AD1 in SMBus mode.
10 AD0/EQA0 input 4-level input that sets channel A equalization (EQA0) in pin mode (ENSMB = 0) and is SMBus slave address bit AD0 in SMBus mode.
11 INB+ input Non-inverting CML differential input to the channel B equalizer, with on-chip 50 Ω termination to VDD, compatible with AC-coupled CML inputs.
12 INB- input Inverting CML differential input to the channel B equalizer, with on-chip 50 Ω termination to VDD, compatible with AC-coupled CML inputs.
13 LOS output Open-drain loss-of-signal indicator (default is LOS on INA), modifiable via SMBus registers.
14 SD_TH input 4-level input setting the LOS assert/deassert threshold: High = 190/130 mVpp, Float = 180/110 mVpp (default), 20 kΩ to GND = 160/100 mVpp, 1 kΩ to GND = 210/150 mVpp.
15 VIN power_in 3.3 V ± 10% input to the internal LDO regulator; must be left floating in 2.5 V mode.
16 VDD_SEL input Enables the 3.3 V to 2.5 V internal regulator: Low = 3.3 V operation, Float = 2.5 V operation.
17 VOD_SEL/READEN input VOD select (High = 10G-KR mode 1.1 or 1.3 Vpp, Float = 1.0 Vpp, 20 kΩ to GND = 1.2 Vpp, 1 kΩ to GND = 700 mVpp); in EEPROM master mode (ENSMB = Float) a low starts the EEPROM load, and in SMBus slave mode it must be low for AD[3:0] to be active, otherwise address 0xB0 is used.
18 MODE/DONE bidirectional 4-level MODE input selects operation (High = 10GbE, Float = 10G-KR slow OOB, 20 kΩ to GND = eSATA, 1 kΩ to GND = SAS); with an external EEPROM (ENSMB = Float) it is the DONE output (High = load failed or incomplete, Low = load passed).
19 OUTB- output Inverting 50 Ω CML driver output of channel B with de-emphasis, compatible with AC-coupled CML inputs.
20 OUTB+ output Non-inverting 50 Ω CML driver output of channel B with de-emphasis, compatible with AC-coupled CML inputs.
21 VDD power_in Supply pin: connect to 2.5 V in 2.5 V mode; in 3.3 V mode do not connect a supply and use only for 100 nF decoupling.
22 VDD power_in Supply pin: connect to 2.5 V in 2.5 V mode; in 3.3 V mode do not connect a supply and use only for 100 nF decoupling.
23 INA- input Inverting CML differential input to the channel A equalizer, with on-chip 50 Ω termination to VDD, compatible with AC-coupled CML inputs.
24 INA+ input Non-inverting CML differential input to the channel A equalizer, with on-chip 50 Ω termination to VDD, compatible with AC-coupled CML inputs.
25 GND power_in Exposed die attach pad (DAP) is the device ground and must be connected to GND through at least 4 vias for electrical and thermal performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-24-EP(4x4)
Category Interface
Pins 25

CAD (KiCad official)

  • Symbol: DS100BR111SQ
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: WQFN-24-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: ds100br111sq-etched.step / ds100br111sq-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ds100br111sq.step / ds100br111sq.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (56 pp, sha256 5c7dad53e562f35b, retrieved 2026-10-12, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF