DRV8833CPWPR

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	(descr "TI PWP0016A HTSSOP-16 PowerPAD; land pattern per the DRV8833C datasheet EXAMPLE BOARD LAYOUT 4214868/A: 16X 1.5 x 0.45 at 0.65 pitch, 5.8 centre to centre; thermal copper 3.4 x 5 (note 9: may vary for creepage), solder mask defined opening 3.3 x 3.3, paste 3.3 x 3.3 for a 0.125 stencil")
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