main
Download ZIP Propose a change
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
Name Last commit message Last updated
docs drv8833cpwpr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers drv8833cpwpr: viewers after the footprint correction · Ray
drv8833cpwpr-etched.fit.json drv8833cpwpr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
drv8833cpwpr-etched.glb drv8833cpwpr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
drv8833cpwpr-etched.step drv8833cpwpr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
drv8833cpwpr-hero.glb Publish 0.1.1 · Ray
drv8833cpwpr-hero.overlay.json Publish 0.1.1 · Ray
drv8833cpwpr.glb Publish 0.1.0 · Ray
drv8833cpwpr.kicad_mod Publish 0.1.1 · Ray
drv8833cpwpr.kicad_sym Publish 0.1.0 · Ray
drv8833cpwpr.lbr Publish 0.1.1 · Ray
drv8833cpwpr.step Publish 0.1.0 · Ray
package.json Publish 0.1.1 · Ray
page.json drv8833cpwpr 0.1.1: footprint corrected to TI PWP0016A (4214868/A): signal pads 1.5 x 0.45 at 5.8 (were 1.05 at 5.55, L… · Ray
README.md Publish 0.1.1 · Ray

DRV8833CPWPR

Texas Instruments · Stepper Motor Driver · TSSOP-16-EP

DRV8833CPWPR from Texas Instruments, in a TSSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Review notes

  • Footprint corrected (0.1.1). The footprint now follows TI's PWP0016A EXAMPLE BOARD LAYOUT (4214868/A) and stencil. 0.1.0 carried KiCad's TSSOP-16-1EP Linear Technology FE variant. Changes:
    • Signal pads: 1.5 x 0.45 at 0.65 pitch, centred 5.8 apart. They were 1.05 long at 5.55.
    • Thermal pad 17: copper is 3.4 x 5, with a solder-mask-defined 3.3 x 3.3 opening and 3.3 x 3.3 paste for a 0.125 stencil. TI notes the copper size may vary for creepage.
  • Unchanged: the symbol and 3D model.

Pinout

Pin Name Type Function
1 nSLEEP input Logic high enables the device; logic low puts device into low-power sleep mode; has internal pulldown resistor (typ. 500 kΩ) and 6.5 V clamp.
2 AOUT1 output H-bridge A output; positive current flows AOUT1 → AOUT2.
3 AISEN output Bridge A current-sense pin; external sense resistor to GND sets the PWM current-regulation trip level (VTRIP = 200 mV typ).
4 AOUT2 output H-bridge A output; positive current flows AOUT1 → AOUT2.
5 BOUT2 output H-bridge B output; positive current flows BOUT1 → BOUT2.
6 BISEN output Bridge B current-sense pin; external sense resistor to GND sets the PWM current-regulation trip level (VTRIP = 200 mV typ).
7 BOUT1 output H-bridge B output; positive current flows BOUT1 → BOUT2.
8 nFAULT output Open-drain fault-indication output, pulled logic low during an overcurrent, thermal-shutdown or reported fault condition; requires an external pullup resistor (>1 kΩ).
9 BIN1 input H-bridge B PWM control input; sets state of BOUT1/BOUT2 per H-bridge logic table; internal pulldown.
10 BIN2 input H-bridge B PWM control input; sets state of BOUT1/BOUT2 per H-bridge logic table; internal pulldown.
11 NC unconnected No internal connection; leave unconnected or tie as needed for layout.
12 VM power_in Motor/power supply input, 2.7 V to 10.8 V; bypass to GND with a 10-µF ceramic capacitor rated for VM.
13 GND power_in Device ground; both the GND pin and the PowerPAD must be connected to ground.
14 VINT power_out Internal 3.3-V regulator output (3.0-3.6 V typ 3.3 V); bypass to GND with a 2.2-µF, 6.3-V capacitor; not intended to drive external loads.
15 AIN2 input H-bridge A PWM control input; sets state of AOUT1/AOUT2 per H-bridge logic table; internal pulldown.
16 AIN1 input H-bridge A PWM control input; sets state of AOUT1/AOUT2 per H-bridge logic table; internal pulldown.
17 GND (PowerPAD) power_in Exposed thermal pad; must be soldered to the PCB ground plane and connected to GND for proper thermal and electrical performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TSSOP-16-EP
Category Motor Driver ICs
Pins 17

CAD (KiCad official)

  • Symbol: DRV8833CPWPR
  • Footprint: TI_PWP0016A_HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.3x3.3mm
  • 3D model: TSSOP-16-EP (KiCad packages3D, STEP)
  • 3D model files: drv8833cpwpr-etched.step / drv8833cpwpr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv8833cpwpr.step / drv8833cpwpr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (30 pp, sha256 dda360de3eae5490, retrieved 2026-09-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF