# DRV8143PQDGQRQ1

**Texas Instruments** · Brushed DC Motor Drivers · HTSSOP-28

DRV8143PQDGQRQ1 from Texas Instruments, in a HTSSOP-28. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SCLK | input | SPI serial clock input; SDI is captured at its falling edge and SDO is updated at its rising edge. |
| 2 | nSCS | input | SPI chip select; an active-low level on this pin enables serial interface communication. |
| 3 | IN | input | Controller input pin for bridge operation; see the Bridge Control section. |
| 4 | DRVOFF | input | Controller input pin for bridge Hi-Z; see the Bridge Control section. |
| 5 | VCP | power_out | Charge pump pin for the storage capacitor; connect a 6.3 V, 1 µF capacitor to the VM supply. |
| 6 | VM | power_in | Motor supply voltage; must be combined with the other five VM pins to support device current capability and bypassed to GND with a 0.1 µF ceramic capacitor plus a bulk capacitor. |
| 7 | VM | power_in | Motor supply voltage; must be combined with the other five VM pins to support device current capability and bypassed to GND with a 0.1 µF ceramic capacitor plus a bulk capacitor. |
| 8 | VM | power_in | Motor supply voltage; must be combined with the other five VM pins to support device current capability and bypassed to GND with a 0.1 µF ceramic capacitor plus a bulk capacitor. |
| 9 | OUT | power_out | Half-bridge output to the motor or load; must be combined with the other five OUT pins to support device current capability. |
| 10 | OUT | power_out | Half-bridge output to the motor or load; must be combined with the other five OUT pins to support device current capability. |
| 11 | OUT | power_out | Half-bridge output to the motor or load; must be combined with the other five OUT pins to support device current capability. |
| 12 | GND | power_in | Ground pin; must be combined with the other five GND pins to support device current capability. |
| 13 | GND | power_in | Ground pin; must be combined with the other five GND pins to support device current capability. |
| 14 | GND | power_in | Ground pin; must be combined with the other five GND pins to support device current capability. |
| 15 | GND | power_in | Ground pin; must be combined with the other five GND pins to support device current capability. |
| 16 | GND | power_in | Ground pin; must be combined with the other five GND pins to support device current capability. |
| 17 | GND | power_in | Ground pin; must be combined with the other five GND pins to support device current capability. |
| 18 | OUT | power_out | Half-bridge output to the motor or load; must be combined with the other five OUT pins to support device current capability. |
| 19 | OUT | power_out | Half-bridge output to the motor or load; must be combined with the other five OUT pins to support device current capability. |
| 20 | OUT | power_out | Half-bridge output to the motor or load; must be combined with the other five OUT pins to support device current capability. |
| 21 | VM | power_in | Motor supply voltage; must be combined with the other five VM pins to support device current capability and bypassed to GND with a 0.1 µF ceramic capacitor plus a bulk capacitor. |
| 22 | VM | power_in | Motor supply voltage; must be combined with the other five VM pins to support device current capability and bypassed to GND with a 0.1 µF ceramic capacitor plus a bulk capacitor. |
| 23 | VM | power_in | Motor supply voltage; must be combined with the other five VM pins to support device current capability and bypassed to GND with a 0.1 µF ceramic capacitor plus a bulk capacitor. |
| 24 | VDD | power_in | Logic power supply to the device. |
| 25 | IPROPI | bidirectional | Driver load current analog feedback; see the IPROPI section of Device Configuration. |
| 26 | nFAULT | output | Open-drain fault indication to the controller; see the nFAULT section of Device Configuration. |
| 27 | SDO | output | SPI serial data output (push-pull); data is updated at the rising edge of SCLK. |
| 28 | SDI | input | SPI serial data input; data is captured at the falling edge of SCLK. |
| 29 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HTSSOP-28 |
| Category | Motor Driver ICs |
| Pins | 29 |

## CAD (KiCad official)

- Symbol: `DRV8143PQDGQRQ1`
- Footprint: `Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm`
- 3D model: HTSSOP-28 (KiCad packages3D, STEP)
- 3D model files: `drv8143pqdgqrq1-etched.step` / `drv8143pqdgqrq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `drv8143pqdgqrq1.step` / `drv8143pqdgqrq1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8604293440192454656) (71 pp, sha256 `66959cc6e8f9728b`, retrieved 2026-10-12, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/drv8143pqdgqrq1-datasheet.pdf)