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DRV5023BIQDBZTQ1
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Texas Instruments Hall Switches, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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DRV5023BIQDBZTQ1
Texas Instruments · Hall Switches · SOT-23
DRV5023BIQDBZTQ1 from Texas Instruments, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Power supply pin rated 2.7 to 38 V; bypass it to the GND pin with a 0.01-μF (minimum) ceramic capacitor rated for VCC. |
| 2 | OUT | output | Hall sensor open-drain output that requires a resistor pullup. |
| 3 | GND | power_in | Ground pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23 |
| Category | Magnetic Sensors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC operating voltage | VCC | 2.7 | 38 | V | 6 | ||
| Output pin voltage (OUT) | VO | 0 | 38 | V | 6 | ||
| Output pin current sink (OUT) | ISINK | 0 | 30 | mA | 6 | ||
| Operating ambient temperature | TA | -40 | 125 | °C | Q, see Figure 26 | 6 | |
| Power supply voltage | VCC | -22 | 40 | V | 6 | ||
| Voltage ramp rate (VCC) | 0 | 2 | V/µs | VCC > 5 V | 6 | ||
| Output pin voltage | -0.5 | 40 | V | 6 | |||
| Output pin reverse current | 0 | 100 | mA | during reverse supply condition | 6 | ||
| Operating junction temperature | TJ | -40 | 150 | °C | Q, see Figure 26 | 6 | |
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| Reverse supply voltage | VCCR | -22 | V | 7 | |||
| Operating supply current | ICC | 3 | 3.5 | mA | VCC = 2.7 to 38 V, TA = TA,MAX (note 1) | 7 | |
| Operating supply current | ICC | 2.7 | mA | VCC = 2.7 to 38 V, TA = 25°C | 7 | ||
| Power-on time | ton | 35 | 50 | µs | AJ, BI versions | 7 | |
| FET on-resistance | rDS(on) | 36 | 50 | Ω | VCC = 3.3 V, IO = 10 mA, TA = 125°C | 7 | |
| FET on-resistance | rDS(on) | 22 | Ω | VCC = 3.3 V, IO = 10 mA, TA = 25°C | 7 | ||
| Off-state leakage current | Ilkg(off) | 1 | µA | Output Hi-Z | 7 | ||
| Overcurrent protection level | IOCP | 15 | 30 | 45 | mA | OUT shorted VCC | 7 |
| Output delay time | td | 13 | 25 | µs | B = BRP, 10 mT to BOP + 10 mT in 1 µs | 7 | |
| Output rise time (10% to 90%) | tr | 200 | ns | R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V | 7 | ||
| Output fall time (90% to 10%) | tf | 31 | ns | R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V | 7 | ||
| Output jitter | tj | -8.5 | 8.5 | µs | Measured from 20 000 cycles of B increasing at a rate of 50 mT/ms (see Figure 19) | 7 | |
| Bandwidth | ƒBW | 20 | 30 | kHz | 7 | ||
| Operate point | BOP | 6 | 14.5 | 24 | mT | BI version, see Figure 12 and Figure 13 | 7 |
| Release point | BRP | 3 | 6 | 9 | mT | BI version, see Figure 12 and Figure 13 | 7 |
| Hysteresis | Bhys | 8.5 | mT | Bhys = (BOP, BRP) | 7 | ||
| Magnetic offset | BO | 10.3 | mT | BO = (BOP + BRP) / 2 | 7 | ||
| Junction-to-ambient thermal resistance | RθJA | 333.2 | °C/W | DBZ (SOT-23), 3 pins | 6 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 99.9 | °C/W | DBZ (SOT-23), 3 pins | 6 | ||
| Junction-to-board thermal resistance | RθJB | 66.9 | °C/W | DBZ (SOT-23), 3 pins | 6 | ||
| Junction-to-top characterization parameter | ψJT | 4.9 | °C/W | DBZ (SOT-23), 3 pins | 6 | ||
| Junction-to-board characterization parameter | ψJB | 65.2 | °C/W | DBZ (SOT-23), 3 pins | 6 |
CAD (KiCad official)
- Symbol:
DRV5023BIQDBZTQ1 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
drv5023biqdbztq1-etched.step/drv5023biqdbztq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);drv5023biqdbztq1.step/drv5023biqdbztq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (34 pp, sha256
a5ccf66bec8620c9, retrieved 2026-11-05, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DRV5023BIQDBZTQ1
**Texas Instruments** · Hall Switches · SOT-23
DRV5023BIQDBZTQ1 from Texas Instruments, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Power supply pin rated 2.7 to 38 V; bypass it to the GND pin with a 0.01-μF (minimum) ceramic capacitor rated for VCC. |
| 2 | OUT | output | Hall sensor open-drain output that requires a resistor pullup. |
| 3 | GND | power_in | Ground pin. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23 |
| Category | Magnetic Sensors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC operating voltage | VCC | 2.7 | | 38 | V | | 6 |
| Output pin voltage (OUT) | VO | 0 | | 38 | V | | 6 |
| Output pin current sink (OUT) | ISINK | 0 | | 30 | mA | | 6 |
| Operating ambient temperature | TA | -40 | | 125 | °C | Q, see Figure 26 | 6 |
| Power supply voltage | VCC | -22 | | 40 | V | | 6 |
| Voltage ramp rate (VCC) | | 0 | | 2 | V/µs | VCC > 5 V | 6 |
| Output pin voltage | | -0.5 | | 40 | V | | 6 |
| Output pin reverse current | | 0 | | 100 | mA | during reverse supply condition | 6 |
| Operating junction temperature | TJ | -40 | | 150 | °C | Q, see Figure 26 | 6 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 6 |
| Reverse supply voltage | VCCR | -22 | | | V | | 7 |
| Operating supply current | ICC | | 3 | 3.5 | mA | VCC = 2.7 to 38 V, TA = TA,MAX (note 1) | 7 |
| Operating supply current | ICC | | 2.7 | | mA | VCC = 2.7 to 38 V, TA = 25°C | 7 |
| Power-on time | ton | | 35 | 50 | µs | AJ, BI versions | 7 |
| FET on-resistance | rDS(on) | | 36 | 50 | Ω | VCC = 3.3 V, IO = 10 mA, TA = 125°C | 7 |
| FET on-resistance | rDS(on) | | 22 | | Ω | VCC = 3.3 V, IO = 10 mA, TA = 25°C | 7 |
| Off-state leakage current | Ilkg(off) | | | 1 | µA | Output Hi-Z | 7 |
| Overcurrent protection level | IOCP | 15 | 30 | 45 | mA | OUT shorted VCC | 7 |
| Output delay time | td | | 13 | 25 | µs | B = BRP, 10 mT to BOP + 10 mT in 1 µs | 7 |
| Output rise time (10% to 90%) | tr | | 200 | | ns | R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V | 7 |
| Output fall time (90% to 10%) | tf | | 31 | | ns | R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V | 7 |
| Output jitter | tj | -8.5 | | 8.5 | µs | Measured from 20 000 cycles of B increasing at a rate of 50 mT/ms (see Figure 19) | 7 |
| Bandwidth | ƒBW | | 20 | 30 | kHz | | 7 |
| Operate point | BOP | 6 | 14.5 | 24 | mT | BI version, see Figure 12 and Figure 13 | 7 |
| Release point | BRP | 3 | 6 | 9 | mT | BI version, see Figure 12 and Figure 13 | 7 |
| Hysteresis | Bhys | | 8.5 | | mT | Bhys = (BOP, BRP) | 7 |
| Magnetic offset | BO | | 10.3 | | mT | BO = (BOP + BRP) / 2 | 7 |
| Junction-to-ambient thermal resistance | RθJA | | 333.2 | | °C/W | DBZ (SOT-23), 3 pins | 6 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 99.9 | | °C/W | DBZ (SOT-23), 3 pins | 6 |
| Junction-to-board thermal resistance | RθJB | | 66.9 | | °C/W | DBZ (SOT-23), 3 pins | 6 |
| Junction-to-top characterization parameter | ψJT | | 4.9 | | °C/W | DBZ (SOT-23), 3 pins | 6 |
| Junction-to-board characterization parameter | ψJB | | 65.2 | | °C/W | DBZ (SOT-23), 3 pins | 6 |
## CAD (KiCad official)
- Symbol: `DRV5023BIQDBZTQ1`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `drv5023biqdbztq1-etched.step` / `drv5023biqdbztq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `drv5023biqdbztq1.step` / `drv5023biqdbztq1.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/drv5023-q1) (34 pp, sha256 `a5ccf66bec8620c9`, retrieved 2026-11-05, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/drv5023biqdbztq1-datasheet.pdf)