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Contents

README

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DRV5023BIQDBZTQ1

Texas Instruments · Hall Switches · SOT-23

DRV5023BIQDBZTQ1 from Texas Instruments, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Power supply pin rated 2.7 to 38 V; bypass it to the GND pin with a 0.01-μF (minimum) ceramic capacitor rated for VCC.
2 OUT output Hall sensor open-drain output that requires a resistor pullup.
3 GND power_in Ground pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23
Category Magnetic Sensors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC operating voltage VCC 2.7 38 V 6
Output pin voltage (OUT) VO 0 38 V 6
Output pin current sink (OUT) ISINK 0 30 mA 6
Operating ambient temperature TA -40 125 °C Q, see Figure 26 6
Power supply voltage VCC -22 40 V 6
Voltage ramp rate (VCC) 0 2 V/µs VCC > 5 V 6
Output pin voltage -0.5 40 V 6
Output pin reverse current 0 100 mA during reverse supply condition 6
Operating junction temperature TJ -40 150 °C Q, see Figure 26 6
Storage temperature Tstg -65 150 °C 6
Reverse supply voltage VCCR -22 V 7
Operating supply current ICC 3 3.5 mA VCC = 2.7 to 38 V, TA = TA,MAX (note 1) 7
Operating supply current ICC 2.7 mA VCC = 2.7 to 38 V, TA = 25°C 7
Power-on time ton 35 50 µs AJ, BI versions 7
FET on-resistance rDS(on) 36 50 Ω VCC = 3.3 V, IO = 10 mA, TA = 125°C 7
FET on-resistance rDS(on) 22 Ω VCC = 3.3 V, IO = 10 mA, TA = 25°C 7
Off-state leakage current Ilkg(off) 1 µA Output Hi-Z 7
Overcurrent protection level IOCP 15 30 45 mA OUT shorted VCC 7
Output delay time td 13 25 µs B = BRP, 10 mT to BOP + 10 mT in 1 µs 7
Output rise time (10% to 90%) tr 200 ns R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V 7
Output fall time (90% to 10%) tf 31 ns R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V 7
Output jitter tj -8.5 8.5 µs Measured from 20 000 cycles of B increasing at a rate of 50 mT/ms (see Figure 19) 7
Bandwidth ƒBW 20 30 kHz 7
Operate point BOP 6 14.5 24 mT BI version, see Figure 12 and Figure 13 7
Release point BRP 3 6 9 mT BI version, see Figure 12 and Figure 13 7
Hysteresis Bhys 8.5 mT Bhys = (BOP, BRP) 7
Magnetic offset BO 10.3 mT BO = (BOP + BRP) / 2 7
Junction-to-ambient thermal resistance RθJA 333.2 °C/W DBZ (SOT-23), 3 pins 6
Junction-to-case (top) thermal resistance RθJC(top) 99.9 °C/W DBZ (SOT-23), 3 pins 6
Junction-to-board thermal resistance RθJB 66.9 °C/W DBZ (SOT-23), 3 pins 6
Junction-to-top characterization parameter ψJT 4.9 °C/W DBZ (SOT-23), 3 pins 6
Junction-to-board characterization parameter ψJB 65.2 °C/W DBZ (SOT-23), 3 pins 6

CAD (KiCad official)

  • Symbol: DRV5023BIQDBZTQ1
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: drv5023biqdbztq1-etched.step / drv5023biqdbztq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv5023biqdbztq1.step / drv5023biqdbztq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (34 pp, sha256 a5ccf66bec8620c9, retrieved 2026-11-05, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF