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DRV5015A1QDBZT

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Texas Instruments Hall Sensor, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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DRV5015A1QDBZT

Texas Instruments · Hall Sensor · SOT-23

DRV5015A1QDBZT from Texas Instruments, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in 2.5-V to 5.5-V power supply; connect a ceramic capacitor of at least 0.01 µF between VCC and ground.
2 OUT output Open-drain output; pull-up voltage max 5.5 V and output sinking current up to 20 mA recommended.
3 GND power_in Ground reference.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23
Category Sensors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating supply current ICC 2.3 2.8 mA VCC = 2.5 V to 5.5 V 4
Power-on time tON 40 70 µs VCC = 2.5 V to 5.5 V 4
Propagation delay time td 13 25 µs B = BRP, 10 mT to BOP + 10 mT in 1 µs 4
High-impedance output leakage current IOZ 100 nA 5.5 V applied to OUT, while OUT is high-impedance 4
Low-level output voltage VOL 0.15 0.4 V IOUT = 20 mA 4
Sensing bandwidth fBW 20 30 kHz VCC = 2.5 V to 5.5 V 4
Magnetic threshold operate point BOP -0.2 0.7 2 mT DRV5015A1 4
Magnetic threshold release point BRP -2 -0.7 0.2 mT DRV5015A1 4
Magnetic hysteresis /BOP, BRP/ BHYS 0.35 1.4 mT DRV5015A1 4
Power supply voltage VCC 2.5 5.5 V 4
Output pin voltage VOUT 0 5.5 V 4
Output sinking current IOUT 0 20 mA 4
Operating ambient temperature TA -40 125 °C 4
Power supply voltage VCC -0.3 6 V 3
Output voltage VOUT -0.3 6 V 3
Output current IOUT 30 mA 3
Operating junction temperature TJ -40 150 °C 3
Storage temperature Tstg -65 150 °C 3
ESD HBM V(ESD) -5000 5000 V Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 3
ESD CDM V(ESD) -1500 1500 V Charged device model (CDM), per JEDEC specification JESD22-C101 3
Junction-to-ambient thermal resistance RθJA 356 °C/W SOT-23 (DBZ), 3 pins 4
Junction-to-case (top) thermal resistance RθJC(top) 128 °C/W SOT-23 (DBZ), 3 pins 4
Junction-to-board thermal resistance RθJB 94 °C/W SOT-23 (DBZ), 3 pins 4
Junction-to-top characterization parameter YJT 11.4 °C/W SOT-23 (DBZ), 3 pins 4
Junction-to-board characterization parameter YJB 92 °C/W SOT-23 (DBZ), 3 pins 4

CAD (KiCad official)

  • Symbol: DRV5015A1QDBZT
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: drv5015a1qdbzt-etched.step / drv5015a1qdbzt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv5015a1qdbzt.step / drv5015a1qdbzt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (28 pp, sha256 393af117b90fea84, retrieved 2026-10-23, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF