# DRV5013AGELPGQ1

**Texas Instruments** · Hall Switches · TO-92

DRV5013AGELPGQ1 from Texas Instruments, in a TO-92. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Power supply pin for 2.7 V to 38 V operation; bypass it to GND with a 0.01-µF (minimum) ceramic capacitor rated for VCC. |
| 2 | GND | power_in | Ground pin for the device. |
| 3 | OUT | output | Hall sensor open-drain output that requires a resistor pullup. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | TO-92 |
| Category | Magnetic Sensors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VCC | 2.7 |  | 38 | V |  | 4 |
| Operate point | BOP | 3 | 6 | 9 | mT | DRV5013AG: ±6 mT; see Figure 7-2 | 6 |
| Release point | BRP | -9 | -6 | -3 | mT | DRV5013AG: ±6 mT; see Figure 7-2 | 6 |
| Magnetic offset | BO | -1.5 | 0 | 1.5 | mT | DRV5013AG: ±6 mT; BO = (BOP + BRP) / 2 | 6 |
| Operating supply current | ICC |  | 3 | 3.5 | mA | VCC = 2.7 V to 38 V, TA = TA, MAX | 5 |
| Power-on time | ton |  | 35 | 50 | µs | AD, AG, BC versions | 5 |
| FET on-resistance | rDS(on) |  | 36 | 50 | Ω | VCC = 3.3 V, IO = 10 mA, TA = 125 | 5 |
| Off-state leakage current | Ilkg(off) |  |  | 1 | µA | Output Hi-Z | 5 |
| Overcurrent protection level | IOCP | 15 | 30 | 45 | mA | OUT shorted VCC | 5 |
| Output delay time | td |  | 13 | 25 | µs | B = BRP, 10 mT to BOP + 10 mT in 1 µs | 5 |
| Absolute maximum power supply voltage | VCC | -22 |  | 40 | V | Specified by design; only tested to -20 V at minimum | 4 |
| Output pin voltage |  | -0.5 |  | 40 | V |  | 4 |
| Output pin reverse current during reverse supply condition |  | 0 |  | 100 | mA |  | 4 |
| Operating junction temperature E grade | TJ | -40 |  | 175 | °C | E, see Figure 9-1 | 4 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 4 |
| Output pin voltage (OUT) | VO | 0 |  | 38 | V |  | 4 |
| Output pin current sink (OUT) | ISINK | 0 |  | 30 | mA | Power dissipation and thermal limits must be observed | 4 |
| Operating ambient temperature E grade | TA | -40 |  | 150 | °C | E, see Figure 9-1 | 4 |
| Junction-to-ambient thermal resistance (LPG TO-92) | RθJA |  | 180 |  | °C/W |  | 4 |
| Junction-to-case (top) thermal resistance (LPG TO-92) | RθJC(top) |  | 98.6 |  | °C/W |  | 4 |
| Junction-to-board thermal resistance (LPG TO-92) | RθJB |  | 154.9 |  | °C/W |  | 4 |
| Junction-to-top characterization parameter (LPG TO-92) | ψJT |  | 40 |  | °C/W |  | 4 |
| Junction-to-board characterization parameter (LPG TO-92) | ψJB |  | 154.9 |  | °C/W |  | 4 |
| Hysteresis | Bhys |  | 12 |  | mT | DRV5013AG: ±6 mT; Bhys = (BOP, BRP) | 6 |
| Bandwidth | ƒBW | 20 | 30 |  | kHz |  | 6 |
| Operating supply current at 25°C | ICC |  | 2.7 |  | mA | VCC = 2.7 V to 38 V, TA = 25°C | 5 |
| Reverse supply voltage | VCCR |  | -22 |  | V |  | 5 |
| Rise time (10% to 90%) | tr |  | 200 |  | ns | R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V | 5 |
| Fall time (90% to 10%) | tf |  | 31 |  | ns | R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V | 5 |
| FET on-resistance at 25°C | rDS(on) |  | 22 |  | Ω | VCC = 3.3 V, IO = 10 mA, TA = 25°C | 5 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | Abs |  | • Corrected body size of SOT-23 package and SIP package name to TO-92 ..................................................... 1 • Added BMAX to Absolute Maximum Ratings ................................. | 3 |

## CAD (KiCad official)

- Symbol: `DRV5013AGELPGQ1`
- Footprint: `Package_TO_SOT_THT:TO-92_Inline`
- 3D model: TO-92 (KiCad packages3D, STEP)
- 3D model files: `drv5013agelpgq1-etched.step` / `drv5013agelpgq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `drv5013agelpgq1.step` / `drv5013agelpgq1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/drv5013-q1.pdf) (33 pp, sha256 `26782fcc8dd907fe`, retrieved 2026-11-05, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/drv5013agelpgq1-datasheet.pdf)