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DRV5013AGELPGQ1

Texas Instruments · Hall Switches · TO-92

DRV5013AGELPGQ1 from Texas Instruments, in a TO-92. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Power supply pin for 2.7 V to 38 V operation; bypass it to GND with a 0.01-µF (minimum) ceramic capacitor rated for VCC.
2 GND power_in Ground pin for the device.
3 OUT output Hall sensor open-drain output that requires a resistor pullup.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TO-92
Category Magnetic Sensors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VCC 2.7 38 V 4
Operate point BOP 3 6 9 mT DRV5013AG: ±6 mT; see Figure 7-2 6
Release point BRP -9 -6 -3 mT DRV5013AG: ±6 mT; see Figure 7-2 6
Magnetic offset BO -1.5 0 1.5 mT DRV5013AG: ±6 mT; BO = (BOP + BRP) / 2 6
Operating supply current ICC 3 3.5 mA VCC = 2.7 V to 38 V, TA = TA, MAX 5
Power-on time ton 35 50 µs AD, AG, BC versions 5
FET on-resistance rDS(on) 36 50 Ω VCC = 3.3 V, IO = 10 mA, TA = 125 5
Off-state leakage current Ilkg(off) 1 µA Output Hi-Z 5
Overcurrent protection level IOCP 15 30 45 mA OUT shorted VCC 5
Output delay time td 13 25 µs B = BRP, 10 mT to BOP + 10 mT in 1 µs 5
Absolute maximum power supply voltage VCC -22 40 V Specified by design; only tested to -20 V at minimum 4
Output pin voltage -0.5 40 V 4
Output pin reverse current during reverse supply condition 0 100 mA 4
Operating junction temperature E grade TJ -40 175 °C E, see Figure 9-1 4
Storage temperature Tstg -65 150 °C 4
Output pin voltage (OUT) VO 0 38 V 4
Output pin current sink (OUT) ISINK 0 30 mA Power dissipation and thermal limits must be observed 4
Operating ambient temperature E grade TA -40 150 °C E, see Figure 9-1 4
Junction-to-ambient thermal resistance (LPG TO-92) RθJA 180 °C/W 4
Junction-to-case (top) thermal resistance (LPG TO-92) RθJC(top) 98.6 °C/W 4
Junction-to-board thermal resistance (LPG TO-92) RθJB 154.9 °C/W 4
Junction-to-top characterization parameter (LPG TO-92) ψJT 40 °C/W 4
Junction-to-board characterization parameter (LPG TO-92) ψJB 154.9 °C/W 4
Hysteresis Bhys 12 mT DRV5013AG: ±6 mT; Bhys = (BOP, BRP) 6
Bandwidth ƒBW 20 30 kHz 6
Operating supply current at 25°C ICC 2.7 mA VCC = 2.7 V to 38 V, TA = 25°C 5
Reverse supply voltage VCCR -22 V 5
Rise time (10% to 90%) tr 200 ns R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V 5
Fall time (90% to 10%) tf 31 ns R1 = 1 kΩ, CO = 50 pF, VCC = 3.3 V 5
FET on-resistance at 25°C rDS(on) 22 Ω VCC = 3.3 V, IO = 10 mA, TA = 25°C 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing Abs • Corrected body size of SOT-23 package and SIP package name to TO-92 ..................................................... 1 • Added BMAX to Absolute Maximum Ratings ................................. 3

CAD (KiCad official)

  • Symbol: DRV5013AGELPGQ1
  • Footprint: Package_TO_SOT_THT:TO-92_Inline
  • 3D model: TO-92 (KiCad packages3D, STEP)
  • 3D model files: drv5013agelpgq1-etched.step / drv5013agelpgq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv5013agelpgq1.step / drv5013agelpgq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (33 pp, sha256 26782fcc8dd907fe, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF