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DP83869HMRGZT

Texas Instruments · Ethernet Transceivers · VQFN-48-EP(7x7)

DP83869HMRGZT from Texas Instruments, in a VQFN-48-EP(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TD_P_A bidirectional Differential transmit and receive signal for channel A, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor.
2 TD_M_A bidirectional Differential transmit and receive signal for channel A, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor.
3 VDDA2P5 power_in 2.5V analog power supply (±5%) requiring 1µF and 0.1µF capacitors to ground at each pin.
4 TD_P_B bidirectional Differential transmit and receive signal for channel B, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor.
5 TD_M_B bidirectional Differential transmit and receive signal for channel B, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor.
6 VDD1P1 power_in 1.1V digital power supply (±10%) requiring 1µF and 0.1µF capacitors to ground at each pin.
7 TD_P_C bidirectional Differential transmit and receive signal for channel C, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor.
8 TD_M_C bidirectional Differential transmit and receive signal for channel C, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor.
9 VDDA2P5 power_in 2.5V analog power supply (±5%) requiring 1µF and 0.1µF capacitors to ground at each pin.
10 TD_P_D bidirectional Differential transmit and receive signal for channel D, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor.
11 TD_M_D bidirectional Differential transmit and receive signal for channel D, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor.
12 RBIAS passive Bias resistor connection requiring external 11kΩ ±1% resistor connected to ground for impedance matching.
13 VDDA1P8_1 power_in 1.8V analog power supply (±5%) for triple power mode, no connection required in dual power mode and must remain unconnected when unused.
14 SON output Differential SGMII or fiber data output providing LVDS signal AC-coupled via 0.1µF capacitor from PHY to MAC or transceiver.
15 SOP output Differential SGMII or fiber data output providing LVDS signal AC-coupled via 0.1µF capacitor from PHY to MAC or transceiver.
16 SIP input Differential SGMII or fiber data input receiving LVDS signal AC-coupled via 0.1µF capacitor from MAC or transceiver to PHY.
17 SIN input Differential SGMII or fiber data input receiving LVDS signal AC-coupled via 0.1µF capacitor from MAC or transceiver to PHY.
18 VDDIO power_in I/O power supply selectable as 1.8V (±5%), 2.5V (±5%), or 3.3V (±5%) requiring 1µF and 0.1µF capacitors to ground.
19 XO output Crystal oscillator output for 25MHz crystal secondary connection, must remain floating if external clock oscillator is used.
20 XI input Crystal oscillator input for 25MHz reference clock from crystal or external CMOS oscillator.
21 JTAG_CLK/TX_ER input JTAG test clock input per IEEE 1149.1 standard or MII transmit error signal in 100M mode with internal weak pull-up.
22 JTAG_TDO/GPIO_1 output JTAG test data output per IEEE 1149.1 standard or configurable GPIO output controlled by GPIO_MUX_CTRL register.
23 JTAG_TMS input JTAG test mode select input per IEEE 1149.1 standard for TAP controller with internal weak pull-up.
24 JTAG_TDI/SD input JTAG test data input per IEEE 1149.1 standard or active-low signal detect input for 1000Base-X and 100Base-FX fiber modes with weak pull-up.
25 TX_D3 input Transmit data bit 3 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down.
26 TX_D2 input Transmit data bit 2 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down.
27 TX_D1 input Transmit data bit 1 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down.
28 TX_D0 input Transmit data bit 0 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down.
29 GTX_CLK/TX_CLK bidirectional RGMII transmit clock input at 125MHz or MII transmit clock output at 25MHz (100Mbps) or 2.5MHz (10Mbps) with mode-dependent direction.
30 VDDIO power_in I/O power supply selectable as 1.8V (±5%), 2.5V (±5%), or 3.3V (±5%) requiring 1µF and 0.1µF capacitors to ground.
31 VDD1P1 power_in 1.1V digital power supply (±10%) requiring 1µF and 0.1µF capacitors to ground at each pin.
32 RX_CLK output Recovered receive clock output providing 125MHz for 1000Mbps RGMII mode and 25MHz for 100Mbps or 2.5MHz for 10Mbps modes.
33 RX_D0 output Receive data bit 0 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes.
34 RX_D1 output Receive data bit 1 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes.
35 RX_D2 output Receive data bit 2 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes.
36 RX_D3 output Receive data bit 3 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes.
37 TX_CTRL/TX_EN input Transmit control in RGMII mode combining TX_EN and TX_ER on clock edges, or transmit enable in MII mode with internal weak pull-down.
38 RX_CTRL/RX_DV output Receive control in RGMII mode combining RX_DV and RX_ER on clock edges, or receive data valid in MII mode.
39 VDD1P1 power_in 1.1V digital power supply (±10%) requiring 1µF and 0.1µF capacitors to ground at each pin.
40 CLK_OUT output Programmable clock output providing 25MHz default or configurable to 125/5MHz recovery clock per I/O configuration register.
41 MDIO bidirectional Management data I/O for serial MDIO interface, open-drain requiring external 1.5kΩ pull-up resistor to VDDIO.
42 MDC input Management data clock for MDIO synchronous interface operating up to 25MHz maximum frequency.
43 RESET_N input Active-low reset input for device initialization requiring 100Ω series resistor and 47µF capacitor to ground.
44 INT_N/PWDN_N bidirectional Configurable as active-low power down input or open-drain interrupt output per register control with internal pull-up.
45 LED_2/GPIO_0 bidirectional LED output or configurable GPIO output controlled by GPIO_MUX_CTRL register with polarity set by strap configuration.
46 LED_1/RX_ER output LED output for link or activity indication or receive error signal in MII mode synchronized with RX_CLK rising edge.
47 LED_0 output LED output for link or activity indication, part of VDDIO voltage domain.
48 VDDA1P8_2 power_in 1.8V analog power supply (±5%) for triple power mode, no connection required in dual power mode and must remain unconnected when unused.
49 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-48-EP(7x7)
Category Interface
Pins 49

CAD (KiCad official)

  • Symbol: DP83869HMRGZT
  • Footprint: Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
  • 3D model: VQFN-48-EP(7x7) (KiCad packages3D, STEP)
  • 3D model files: dp83869hmrgzt-etched.step / dp83869hmrgzt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dp83869hmrgzt.step / dp83869hmrgzt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (136 pp, sha256 c9f251ea9e61fb66, retrieved 2026-10-05, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF