component
DP83869HMRGZT
Public Made by Adomby adom
Texas Instruments Ethernet Transceivers, VQFN-48-EP(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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DP83869HMRGZT
Texas Instruments · Ethernet Transceivers · VQFN-48-EP(7x7)
DP83869HMRGZT from Texas Instruments, in a VQFN-48-EP(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TD_P_A | bidirectional | Differential transmit and receive signal for channel A, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 2 | TD_M_A | bidirectional | Differential transmit and receive signal for channel A, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 3 | VDDA2P5 | power_in | 2.5V analog power supply (±5%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 4 | TD_P_B | bidirectional | Differential transmit and receive signal for channel B, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 5 | TD_M_B | bidirectional | Differential transmit and receive signal for channel B, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 6 | VDD1P1 | power_in | 1.1V digital power supply (±10%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 7 | TD_P_C | bidirectional | Differential transmit and receive signal for channel C, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 8 | TD_M_C | bidirectional | Differential transmit and receive signal for channel C, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 9 | VDDA2P5 | power_in | 2.5V analog power supply (±5%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 10 | TD_P_D | bidirectional | Differential transmit and receive signal for channel D, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 11 | TD_M_D | bidirectional | Differential transmit and receive signal for channel D, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 12 | RBIAS | passive | Bias resistor connection requiring external 11kΩ ±1% resistor connected to ground for impedance matching. |
| 13 | VDDA1P8_1 | power_in | 1.8V analog power supply (±5%) for triple power mode, no connection required in dual power mode and must remain unconnected when unused. |
| 14 | SON | output | Differential SGMII or fiber data output providing LVDS signal AC-coupled via 0.1µF capacitor from PHY to MAC or transceiver. |
| 15 | SOP | output | Differential SGMII or fiber data output providing LVDS signal AC-coupled via 0.1µF capacitor from PHY to MAC or transceiver. |
| 16 | SIP | input | Differential SGMII or fiber data input receiving LVDS signal AC-coupled via 0.1µF capacitor from MAC or transceiver to PHY. |
| 17 | SIN | input | Differential SGMII or fiber data input receiving LVDS signal AC-coupled via 0.1µF capacitor from MAC or transceiver to PHY. |
| 18 | VDDIO | power_in | I/O power supply selectable as 1.8V (±5%), 2.5V (±5%), or 3.3V (±5%) requiring 1µF and 0.1µF capacitors to ground. |
| 19 | XO | output | Crystal oscillator output for 25MHz crystal secondary connection, must remain floating if external clock oscillator is used. |
| 20 | XI | input | Crystal oscillator input for 25MHz reference clock from crystal or external CMOS oscillator. |
| 21 | JTAG_CLK/TX_ER | input | JTAG test clock input per IEEE 1149.1 standard or MII transmit error signal in 100M mode with internal weak pull-up. |
| 22 | JTAG_TDO/GPIO_1 | output | JTAG test data output per IEEE 1149.1 standard or configurable GPIO output controlled by GPIO_MUX_CTRL register. |
| 23 | JTAG_TMS | input | JTAG test mode select input per IEEE 1149.1 standard for TAP controller with internal weak pull-up. |
| 24 | JTAG_TDI/SD | input | JTAG test data input per IEEE 1149.1 standard or active-low signal detect input for 1000Base-X and 100Base-FX fiber modes with weak pull-up. |
| 25 | TX_D3 | input | Transmit data bit 3 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down. |
| 26 | TX_D2 | input | Transmit data bit 2 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down. |
| 27 | TX_D1 | input | Transmit data bit 1 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down. |
| 28 | TX_D0 | input | Transmit data bit 0 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down. |
| 29 | GTX_CLK/TX_CLK | bidirectional | RGMII transmit clock input at 125MHz or MII transmit clock output at 25MHz (100Mbps) or 2.5MHz (10Mbps) with mode-dependent direction. |
| 30 | VDDIO | power_in | I/O power supply selectable as 1.8V (±5%), 2.5V (±5%), or 3.3V (±5%) requiring 1µF and 0.1µF capacitors to ground. |
| 31 | VDD1P1 | power_in | 1.1V digital power supply (±10%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 32 | RX_CLK | output | Recovered receive clock output providing 125MHz for 1000Mbps RGMII mode and 25MHz for 100Mbps or 2.5MHz for 10Mbps modes. |
| 33 | RX_D0 | output | Receive data bit 0 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes. |
| 34 | RX_D1 | output | Receive data bit 1 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes. |
| 35 | RX_D2 | output | Receive data bit 2 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes. |
| 36 | RX_D3 | output | Receive data bit 3 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes. |
| 37 | TX_CTRL/TX_EN | input | Transmit control in RGMII mode combining TX_EN and TX_ER on clock edges, or transmit enable in MII mode with internal weak pull-down. |
| 38 | RX_CTRL/RX_DV | output | Receive control in RGMII mode combining RX_DV and RX_ER on clock edges, or receive data valid in MII mode. |
| 39 | VDD1P1 | power_in | 1.1V digital power supply (±10%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 40 | CLK_OUT | output | Programmable clock output providing 25MHz default or configurable to 125/5MHz recovery clock per I/O configuration register. |
| 41 | MDIO | bidirectional | Management data I/O for serial MDIO interface, open-drain requiring external 1.5kΩ pull-up resistor to VDDIO. |
| 42 | MDC | input | Management data clock for MDIO synchronous interface operating up to 25MHz maximum frequency. |
| 43 | RESET_N | input | Active-low reset input for device initialization requiring 100Ω series resistor and 47µF capacitor to ground. |
| 44 | INT_N/PWDN_N | bidirectional | Configurable as active-low power down input or open-drain interrupt output per register control with internal pull-up. |
| 45 | LED_2/GPIO_0 | bidirectional | LED output or configurable GPIO output controlled by GPIO_MUX_CTRL register with polarity set by strap configuration. |
| 46 | LED_1/RX_ER | output | LED output for link or activity indication or receive error signal in MII mode synchronized with RX_CLK rising edge. |
| 47 | LED_0 | output | LED output for link or activity indication, part of VDDIO voltage domain. |
| 48 | VDDA1P8_2 | power_in | 1.8V analog power supply (±5%) for triple power mode, no connection required in dual power mode and must remain unconnected when unused. |
| 49 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-48-EP(7x7) |
| Category | Interface |
| Pins | 49 |
CAD (KiCad official)
- Symbol:
DP83869HMRGZT - Footprint:
Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm - 3D model: VQFN-48-EP(7x7) (KiCad packages3D, STEP)
- 3D model files:
dp83869hmrgzt-etched.step/dp83869hmrgzt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dp83869hmrgzt.step/dp83869hmrgzt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (136 pp, sha256
c9f251ea9e61fb66, retrieved 2026-10-05, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DP83869HMRGZT
**Texas Instruments** · Ethernet Transceivers · VQFN-48-EP(7x7)
DP83869HMRGZT from Texas Instruments, in a VQFN-48-EP(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TD_P_A | bidirectional | Differential transmit and receive signal for channel A, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 2 | TD_M_A | bidirectional | Differential transmit and receive signal for channel A, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 3 | VDDA2P5 | power_in | 2.5V analog power supply (±5%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 4 | TD_P_B | bidirectional | Differential transmit and receive signal for channel B, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 5 | TD_M_B | bidirectional | Differential transmit and receive signal for channel B, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 6 | VDD1P1 | power_in | 1.1V digital power supply (±10%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 7 | TD_P_C | bidirectional | Differential transmit and receive signal for channel C, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 8 | TD_M_C | bidirectional | Differential transmit and receive signal for channel C, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 9 | VDDA2P5 | power_in | 2.5V analog power supply (±5%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 10 | TD_P_D | bidirectional | Differential transmit and receive signal for channel D, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 11 | TD_M_D | bidirectional | Differential transmit and receive signal for channel D, provides LVDS signal AC-coupled to remote device with 0.1µF capacitor. |
| 12 | RBIAS | passive | Bias resistor connection requiring external 11kΩ ±1% resistor connected to ground for impedance matching. |
| 13 | VDDA1P8_1 | power_in | 1.8V analog power supply (±5%) for triple power mode, no connection required in dual power mode and must remain unconnected when unused. |
| 14 | SON | output | Differential SGMII or fiber data output providing LVDS signal AC-coupled via 0.1µF capacitor from PHY to MAC or transceiver. |
| 15 | SOP | output | Differential SGMII or fiber data output providing LVDS signal AC-coupled via 0.1µF capacitor from PHY to MAC or transceiver. |
| 16 | SIP | input | Differential SGMII or fiber data input receiving LVDS signal AC-coupled via 0.1µF capacitor from MAC or transceiver to PHY. |
| 17 | SIN | input | Differential SGMII or fiber data input receiving LVDS signal AC-coupled via 0.1µF capacitor from MAC or transceiver to PHY. |
| 18 | VDDIO | power_in | I/O power supply selectable as 1.8V (±5%), 2.5V (±5%), or 3.3V (±5%) requiring 1µF and 0.1µF capacitors to ground. |
| 19 | XO | output | Crystal oscillator output for 25MHz crystal secondary connection, must remain floating if external clock oscillator is used. |
| 20 | XI | input | Crystal oscillator input for 25MHz reference clock from crystal or external CMOS oscillator. |
| 21 | JTAG_CLK/TX_ER | input | JTAG test clock input per IEEE 1149.1 standard or MII transmit error signal in 100M mode with internal weak pull-up. |
| 22 | JTAG_TDO/GPIO_1 | output | JTAG test data output per IEEE 1149.1 standard or configurable GPIO output controlled by GPIO_MUX_CTRL register. |
| 23 | JTAG_TMS | input | JTAG test mode select input per IEEE 1149.1 standard for TAP controller with internal weak pull-up. |
| 24 | JTAG_TDI/SD | input | JTAG test data input per IEEE 1149.1 standard or active-low signal detect input for 1000Base-X and 100Base-FX fiber modes with weak pull-up. |
| 25 | TX_D3 | input | Transmit data bit 3 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down. |
| 26 | TX_D2 | input | Transmit data bit 2 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down. |
| 27 | TX_D1 | input | Transmit data bit 1 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down. |
| 28 | TX_D0 | input | Transmit data bit 0 synchronized with transmit clock for RGMII and MII modes with internal weak pull-down. |
| 29 | GTX_CLK/TX_CLK | bidirectional | RGMII transmit clock input at 125MHz or MII transmit clock output at 25MHz (100Mbps) or 2.5MHz (10Mbps) with mode-dependent direction. |
| 30 | VDDIO | power_in | I/O power supply selectable as 1.8V (±5%), 2.5V (±5%), or 3.3V (±5%) requiring 1µF and 0.1µF capacitors to ground. |
| 31 | VDD1P1 | power_in | 1.1V digital power supply (±10%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 32 | RX_CLK | output | Recovered receive clock output providing 125MHz for 1000Mbps RGMII mode and 25MHz for 100Mbps or 2.5MHz for 10Mbps modes. |
| 33 | RX_D0 | output | Receive data bit 0 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes. |
| 34 | RX_D1 | output | Receive data bit 1 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes. |
| 35 | RX_D2 | output | Receive data bit 2 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes. |
| 36 | RX_D3 | output | Receive data bit 3 from PHY to MAC synchronized with RX_CLK in RGMII and MII modes. |
| 37 | TX_CTRL/TX_EN | input | Transmit control in RGMII mode combining TX_EN and TX_ER on clock edges, or transmit enable in MII mode with internal weak pull-down. |
| 38 | RX_CTRL/RX_DV | output | Receive control in RGMII mode combining RX_DV and RX_ER on clock edges, or receive data valid in MII mode. |
| 39 | VDD1P1 | power_in | 1.1V digital power supply (±10%) requiring 1µF and 0.1µF capacitors to ground at each pin. |
| 40 | CLK_OUT | output | Programmable clock output providing 25MHz default or configurable to 125/5MHz recovery clock per I/O configuration register. |
| 41 | MDIO | bidirectional | Management data I/O for serial MDIO interface, open-drain requiring external 1.5kΩ pull-up resistor to VDDIO. |
| 42 | MDC | input | Management data clock for MDIO synchronous interface operating up to 25MHz maximum frequency. |
| 43 | RESET_N | input | Active-low reset input for device initialization requiring 100Ω series resistor and 47µF capacitor to ground. |
| 44 | INT_N/PWDN_N | bidirectional | Configurable as active-low power down input or open-drain interrupt output per register control with internal pull-up. |
| 45 | LED_2/GPIO_0 | bidirectional | LED output or configurable GPIO output controlled by GPIO_MUX_CTRL register with polarity set by strap configuration. |
| 46 | LED_1/RX_ER | output | LED output for link or activity indication or receive error signal in MII mode synchronized with RX_CLK rising edge. |
| 47 | LED_0 | output | LED output for link or activity indication, part of VDDIO voltage domain. |
| 48 | VDDA1P8_2 | power_in | 1.8V analog power supply (±5%) for triple power mode, no connection required in dual power mode and must remain unconnected when unused. |
| 49 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-48-EP(7x7) |
| Category | Interface |
| Pins | 49 |
## CAD (KiCad official)
- Symbol: `DP83869HMRGZT`
- Footprint: `Package_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm`
- 3D model: VQFN-48-EP(7x7) (KiCad packages3D, STEP)
- 3D model files: `dp83869hmrgzt-etched.step` / `dp83869hmrgzt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dp83869hmrgzt.step` / `dp83869hmrgzt.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/dp83869hm) (136 pp, sha256 `c9f251ea9e61fb66`, retrieved 2026-10-05, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/dp83869hmrgzt-datasheet.pdf)