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DMP3037LSS-13

Public Made by Adom

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Diodes Incorporated MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componenttransistorsdmp3037lss-13factory-2.0.0extractor-text

Verified DMP3037LSS-13

by Ray · last 13 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

13 Nov 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • •array (skip): not an array of element pairs
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: DMP3037LSS-13 · SO-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 8-page datasheet
  • ✓distributor: lcsc C150501, digikey DMP3037LSS-13DITR-ND, mouser 621-DMP3037LSS-13
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-nf8ojtyi/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • ✓package_fit: height and body within the datasheet's package drawing (datasheet p.7)
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓symbol_text: no pin names collide
  • ✓viewers: viewers/footprint.html 24 kB, viewers/symbol.html 10 kB
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ dmp3037lss-13.kicad_sym✓ dmp3037lss-13.kicad_mod✓ dmp3037lss-13.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray
viewers dmp3037lss-13: viewers rendered from the public page · Ray
dmp3037lss-13-etched.glb dmp3037lss-13: factory component page (tier=mfr) · Ray
dmp3037lss-13-etched.step dmp3037lss-13: factory component page (tier=mfr) · Ray
dmp3037lss-13-hero.glb dmp3037lss-13: hero GLB from the etched model (keeps the MPN mark) · Ray
dmp3037lss-13-hero.overlay.json dmp3037lss-13: hero GLB from the etched model (keeps the MPN mark) · Ray
dmp3037lss-13.glb Publish 0.1.0 · Ray
dmp3037lss-13.kicad_mod Publish 0.1.0 · Ray
dmp3037lss-13.kicad_sym Publish 0.1.0 · Ray
dmp3037lss-13.lbr Publish 0.1.0 · Ray
dmp3037lss-13.step Publish 0.1.0 · Ray
package.json Publish 0.1.0 · Ray
page.json Set visibility: public · Ray
README.md Publish 0.1.0 · Ray
verification.json Verified: Published by the parts factory: tier mfr, 8 pins · Ray

DMP3037LSS-13

Diodes Incorporated · MOSFETs · SO-8

DMP3037LSS-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 S passive Source terminal of the P-channel MOSFET; the device is rated for a drain-source voltage of -30V and a gate-source voltage of ±20V.
2 S passive Source terminal of the P-channel MOSFET; the device is rated for a drain-source voltage of -30V and a gate-source voltage of ±20V.
3 S passive Source terminal of the P-channel MOSFET; the device is rated for a drain-source voltage of -30V and a gate-source voltage of ±20V.
4 G input Gate terminal of the P-channel MOSFET; the gate-source voltage is rated at ±20V.
5 D passive Drain terminal of the P-channel MOSFET; the device is rated for a drain-source voltage of -30V and a continuous drain current of -5.8A at TA = +25°C.
6 D passive Drain terminal of the P-channel MOSFET; the device is rated for a drain-source voltage of -30V and a continuous drain current of -5.8A at TA = +25°C.
7 D passive Drain terminal of the P-channel MOSFET; the device is rated for a drain-source voltage of -30V and a continuous drain current of -5.8A at TA = +25°C.
8 D passive Drain terminal of the P-channel MOSFET; the device is rated for a drain-source voltage of -30V and a continuous drain current of -5.8A at TA = +25°C.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8
Category Transistors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 V VGS = 0V, ID = -250μA 3
Zero Gate Voltage Drain Current (TJ = +25°C) IDSS -1 μA VDS = -30V, VGS = 0V 3
Gate-Source Leakage IGSS -100 100 nA VGS = ±20V, VDS = 0V 3
Gate Threshold Voltage VGS(TH) -1 -2.4 V VDS = VGS, ID = -250μA 3
Static Drain-Source On-Resistance RDS(ON) 19 32 mΩ VGS = -10V, ID = -7A 3
Static Drain-Source On-Resistance RDS(ON) 28 50 mΩ VGS = -4.5V, ID = -5A 3
Diode Forward Voltage VSD -0.75 -1.2 V VGS = 0V, IS = -1A 3
Drain-Source Voltage VDSS -30 V 2
Gate-Source Voltage VGSS -20 20 V 2
Continuous Drain Current (TA = +25°C) ID -5.8 A VGS = -10V, TA = +25°C (Note 6) 2
Continuous Drain Current (TA = +70°C) ID -4.6 A VGS = -10V, TA = +70°C (Note 6) 2
Pulsed Drain Current IDM -40 A 10µs Pulse, Duty cycle = 1% 2
Avalanche Current IAS -17 A L = 0.1mH (Note 7) 2
Avalanche Energy EAS 15 mJ L = 0.1mH (Note 7) 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Total Power Dissipation (TA = +25°C) PD 1.2 W TA = +25°C (Note 5) 2
Total Power Dissipation (TA = +70°C) PD 0.8 W TA = +70°C (Note 5) 2
Thermal Resistance, Junction to Ambient (steady state) RθJA 100 °C/W Steady state (Note 5) 2
Thermal Resistance, Junction to Ambient (t < 10s) RθJA 58 °C/W t < 10s (Note 5) 2
Total Power Dissipation (TA = +25°C) PD 1.6 W TA = +25°C (Note 6) 2
Total Power Dissipation (TA = +70°C) PD 1 W TA = +70°C (Note 6) 2
Thermal Resistance, Junction to Ambient (steady state) RθJA 77 °C/W Steady state (Note 6) 2
Thermal Resistance, Junction to Ambient (t < 10s) RθJA 45 °C/W t < 10s (Note 6) 2
Thermal Resistance, Junction to Case RθJC 10 °C/W (Note 6) 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminals: Matte Tin Plated over Copper Leadframe. Solderable 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: DMP3037LSS-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8, generated on the KiCad land (body 3.85 x 4.9 mm, terminals on the pads, 1.45 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: dmp3037lss-13-etched.step / dmp3037lss-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmp3037lss-13.step / dmp3037lss-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (8 pp, sha256 6e9acee3609b207e, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF