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DMP2075UVT-13

Diodes Incorporated · MOSFETs · TSOT-26

DMP2075UVT-13 from Diodes Incorporated, in a TSOT-26. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 D passive Drain terminal of the P-channel MOSFET; VDSS is -20 V and continuous drain current is -3.8 A at TA = +25°C (VGS = -4.5 V).
2 D passive Drain terminal of the P-channel MOSFET; VDSS is -20 V and continuous drain current is -3.8 A at TA = +25°C (VGS = -4.5 V).
3 G input Gate terminal with an integrated gate protection diode; gate-source voltage is limited to ±8 V (VGSS).
4 S passive Source terminal of the P-channel MOSFET; maximum continuous body diode forward current is -2.1 A.
5 D passive Drain terminal of the P-channel MOSFET; VDSS is -20 V and continuous drain current is -3.8 A at TA = +25°C (VGS = -4.5 V).
6 D passive Drain terminal of the P-channel MOSFET; VDSS is -20 V and continuous drain current is -3.8 A at TA = +25°C (VGS = -4.5 V).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package TSOT-26
Category Transistors/Thyristors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSS -20 V 2
Gate-Source Voltage VGSS -8 8 V 2
Continuous Drain Current (steady state, TA = +25°C) ID -3.8 A VGS = -4.5V, steady state, TA = +25°C (Note 6) 2
Continuous Drain Current (steady state, TA = +70°C) ID -3 A VGS = -4.5V, steady state, TA = +70°C (Note 6) 2
Maximum Continuous Body Diode Forward Current IS -2.1 A Note 6 2
Pulsed Drain Current IDM -25 A 10µs pulse, duty cycle = 1% 2
Total Power Dissipation PD 1.2 W Note 5: FR-4 PCB, 2oz copper, minimum recommended pad layout 2
Thermal Resistance, Junction to Ambient, Steady State RθJA 105 °C/W Note 5: FR-4 PCB, 2oz copper, minimum recommended pad layout 2
Total Power Dissipation PD 1.6 W Note 6: FR-4 PCB, 2oz copper, 1 inch square copper plate 2
Thermal Resistance, Junction to Ambient, Steady State RθJA 77 °C/W Note 6: FR-4 PCB, 2oz copper, 1 inch square copper plate 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Drain-Source Breakdown Voltage BVDSS -20 V VGS = 0V, ID = -250µA 2
Zero Gate Voltage Drain Current (TJ = +25°C) IDSS -1 µA VDS = -20V, VGS = 0V 2
Gate-Source Leakage IGSS -10 10 µA VGS = ±8.0V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) -0.3 -1 V VDS = VGS, ID = -250µA 2
Static Drain-Source On-Resistance RDS(ON) 75 mΩ VGS = -4.5V, ID = -4.0A 2
Static Drain-Source On-Resistance RDS(ON) 137 mΩ VGS = -2.5V, ID = -3.5A 2
Diode Forward Voltage VSD -1.2 V VGS = 0V, IS = -1.0A 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminal Connections: See Diagram  Terminals: Finish, Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: DMP2075UVT-13
  • Footprint: Package_TO_SOT_SMD:TSOT-23-6
  • 3D model: TSOT-26 (KiCad packages3D, STEP)
  • 3D model files: dmp2075uvt-13-etched.step / dmp2075uvt-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmp2075uvt-13.step / dmp2075uvt-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 a00134040fb97463, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF