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DMP2035UVT-7
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Diodes Incorporated MOSFETs, TSOT-26. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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dmp2035uvt-7: specified limits as data (metadata.characteristics, 39 rows from the datasheet)
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DMP2035UVT-7
Diodes Incorporated · MOSFETs · TSOT-26
DMP2035UVT-7 from Diodes Incorporated, in a TSOT-26. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | D | passive | Drain terminal of the -20V P-channel MOSFET, rated for continuous drain current of -6.0A at TA = +25°C (steady state, VGS = -4.5V). |
| 2 | D | passive | Drain terminal of the -20V P-channel MOSFET, rated for continuous drain current of -6.0A at TA = +25°C (steady state, VGS = -4.5V). |
| 3 | G | input | Gate terminal; gate-source voltage is rated VGSS ±12V and an internal gate protection diode provides ESD protection up to 3kV. |
| 4 | S | passive | Source terminal of the MOSFET; maximum continuous body diode forward current IS is -2.0A. |
| 5 | D | passive | Drain terminal of the -20V P-channel MOSFET, rated for continuous drain current of -6.0A at TA = +25°C (steady state, VGS = -4.5V). |
| 6 | D | passive | Drain terminal of the -20V P-channel MOSFET, rated for continuous drain current of -6.0A at TA = +25°C (steady state, VGS = -4.5V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TSOT-26 |
| Category | Transistors/Thyristors |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | -20 | V | 2 | |||
| Gate-Source Voltage | VGSS | -12 | 12 | V | 2 | ||
| Continuous Drain Current, steady state | ID | -6 | A | VGS=-4.5V, TA=+25°C | 2 | ||
| Continuous Drain Current, steady state | ID | -4.8 | A | VGS=-4.5V, TA=+70°C | 2 | ||
| Continuous Drain Current, t<10s | ID | -7.2 | A | VGS=-4.5V, TA=+25°C | 2 | ||
| Continuous Drain Current, t<10s | ID | -5.7 | A | VGS=-4.5V, TA=+70°C | 2 | ||
| Continuous Drain Current, steady state | ID | -5.2 | A | VGS=-2.5V, TA=+25°C | 2 | ||
| Continuous Drain Current, steady state | ID | -4.1 | A | VGS=-2.5V, TA=+70°C | 2 | ||
| Continuous Drain Current, t<10s | ID | -6.2 | A | VGS=-2.5V, TA=+25°C | 2 | ||
| Continuous Drain Current, t<10s | ID | -4.9 | A | VGS=-2.5V, TA=+70°C | 2 | ||
| Maximum Continuous Body Diode Forward Current | IS | -2 | A | Note 6 | 2 | ||
| Pulsed Drain Current | IDM | -24 | A | 10µs pulse, duty cycle = 1% | 2 | ||
| Total Power Dissipation | PD | 1.2 | W | Note 5 (FR-4, minimum recommended pad layout) | 2 | ||
| Total Power Dissipation | PD | 2 | W | Note 6 (FR-4, 1 inch square copper plate) | 2 | ||
| Thermal Resistance, Junction to Ambient, steady state | RθJA | 106 | °C/W | Note 5 | 2 | ||
| Thermal Resistance, Junction to Ambient, t<10s | RθJA | 74 | °C/W | Note 5 | 2 | ||
| Thermal Resistance, Junction to Ambient, steady state | RθJA | 65 | °C/W | Note 6 | 2 | ||
| Thermal Resistance, Junction to Ambient, t<10s | RθJA | 46 | °C/W | Note 6 | 2 | ||
| Thermal Resistance, Junction to Case, steady state | RθJC | 11.8 | °C/W | Note 6 | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | -20 | V | VGS = 0V, ID = -250µA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | -1 | µA | VDS = -20V, VGS = 0V | 2 | ||
| Gate-Source Leakage | IGSS | 10 | µA | VGS = 8V, VDS = 0V | 2 | ||
| Gate Threshold Voltage | VGS(TH) | -0.4 | -0.7 | -1.5 | V | VDS = VGS, ID = -250µA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | 23 | 35 | mΩ | VGS = -4.5V, ID = -4.0A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 30 | 45 | mΩ | VGS = -2.5V, ID = -4.0A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 41 | 62 | mΩ | VGS = -1.8V, ID = -2.0A | 2 | |
| Diode Forward Voltage | VSD | -0.7 | -1 | V | VGS = 0V, IS = -1A | 2 | |
| Input Capacitance | Ciss | 1610 | 2400 | pF | VDS = -10V, VGS = 0V, f = 1.0MHz | 2 | |
| Output Capacitance | Coss | 157 | 210 | pF | VDS = -10V, VGS = 0V, f = 1.0MHz | 2 | |
| Reverse Transfer Capacitance | Crss | 145 | 200 | pF | VDS = -10V, VGS = 0V, f = 1.0MHz | 2 | |
| Gate Resistance | RG | 9.4 | 14.1 | Ω | VDS = 0V, VGS = 0V, f = 1.0MHz | 2 | |
| Total Gate Charge | Qg | 15.4 | 23.1 | nC | VDS = -10V, VGS = -4.5V, ID = -4A | 2 | |
| Turn-On Delay Time | tD(ON) | 17 | 33 | ns | VGS = -4.5V, VDS = -10V, RG = 6Ω, ID = -1A, RL = 10Ω | 2 | |
| Turn-On Rise Time | tR | 12 | 19 | ns | VGS = -4.5V, VDS = -10V, RG = 6Ω, ID = -1A, RL = 10Ω | 2 | |
| Turn-Off Delay Time | tD(OFF) | 94 | 150 | ns | VGS = -4.5V, VDS = -10V, RG = 6Ω, ID = -1A, RL = 10Ω | 2 | |
| Turn-Off Fall Time | tF | 42 | 64 | ns | VGS = -4.5V, VDS = -10V, RG = 6Ω, ID = -1A, RL = 10Ω | 2 | |
| Reverse Recovery Time | tRR | 14 | 25 | ns | IF = -4.5A, di/dt = 100A/µs | 2 | |
| Reverse Recovery Charge | QRR | 4 | 8 | nC | IF = -4.5A, di/dt = 100A/µs | 2 |
CAD (KiCad official)
- Symbol:
DMP2035UVT-7 - Footprint:
Package_TO_SOT_SMD:TSOT-23-6 - 3D model: TSOT-26 (KiCad packages3D, STEP)
- 3D model files:
dmp2035uvt-7-etched.step/dmp2035uvt-7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dmp2035uvt-7.step/dmp2035uvt-7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (6 pp, sha256
6a4eab87d0444b30, retrieved 2026-10-09, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DMP2035UVT-7
**Diodes Incorporated** · MOSFETs · TSOT-26
DMP2035UVT-7 from Diodes Incorporated, in a TSOT-26. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | D | passive | Drain terminal of the -20V P-channel MOSFET, rated for continuous drain current of -6.0A at TA = +25°C (steady state, VGS = -4.5V). |
| 2 | D | passive | Drain terminal of the -20V P-channel MOSFET, rated for continuous drain current of -6.0A at TA = +25°C (steady state, VGS = -4.5V). |
| 3 | G | input | Gate terminal; gate-source voltage is rated VGSS ±12V and an internal gate protection diode provides ESD protection up to 3kV. |
| 4 | S | passive | Source terminal of the MOSFET; maximum continuous body diode forward current IS is -2.0A. |
| 5 | D | passive | Drain terminal of the -20V P-channel MOSFET, rated for continuous drain current of -6.0A at TA = +25°C (steady state, VGS = -4.5V). |
| 6 | D | passive | Drain terminal of the -20V P-channel MOSFET, rated for continuous drain current of -6.0A at TA = +25°C (steady state, VGS = -4.5V). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | TSOT-26 |
| Category | Transistors/Thyristors |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | -20 | V | | 2 |
| Gate-Source Voltage | VGSS | -12 | | 12 | V | | 2 |
| Continuous Drain Current, steady state | ID | | | -6 | A | VGS=-4.5V, TA=+25°C | 2 |
| Continuous Drain Current, steady state | ID | | | -4.8 | A | VGS=-4.5V, TA=+70°C | 2 |
| Continuous Drain Current, t<10s | ID | | | -7.2 | A | VGS=-4.5V, TA=+25°C | 2 |
| Continuous Drain Current, t<10s | ID | | | -5.7 | A | VGS=-4.5V, TA=+70°C | 2 |
| Continuous Drain Current, steady state | ID | | | -5.2 | A | VGS=-2.5V, TA=+25°C | 2 |
| Continuous Drain Current, steady state | ID | | | -4.1 | A | VGS=-2.5V, TA=+70°C | 2 |
| Continuous Drain Current, t<10s | ID | | | -6.2 | A | VGS=-2.5V, TA=+25°C | 2 |
| Continuous Drain Current, t<10s | ID | | | -4.9 | A | VGS=-2.5V, TA=+70°C | 2 |
| Maximum Continuous Body Diode Forward Current | IS | | | -2 | A | Note 6 | 2 |
| Pulsed Drain Current | IDM | | | -24 | A | 10µs pulse, duty cycle = 1% | 2 |
| Total Power Dissipation | PD | | | 1.2 | W | Note 5 (FR-4, minimum recommended pad layout) | 2 |
| Total Power Dissipation | PD | | | 2 | W | Note 6 (FR-4, 1 inch square copper plate) | 2 |
| Thermal Resistance, Junction to Ambient, steady state | RθJA | | | 106 | °C/W | Note 5 | 2 |
| Thermal Resistance, Junction to Ambient, t<10s | RθJA | | | 74 | °C/W | Note 5 | 2 |
| Thermal Resistance, Junction to Ambient, steady state | RθJA | | | 65 | °C/W | Note 6 | 2 |
| Thermal Resistance, Junction to Ambient, t<10s | RθJA | | | 46 | °C/W | Note 6 | 2 |
| Thermal Resistance, Junction to Case, steady state | RθJC | | | 11.8 | °C/W | Note 6 | 2 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 | | 150 | °C | | 2 |
| Drain-Source Breakdown Voltage | BVDSS | -20 | | | V | VGS = 0V, ID = -250µA | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | -1 | µA | VDS = -20V, VGS = 0V | 2 |
| Gate-Source Leakage | IGSS | | | 10 | µA | VGS = 8V, VDS = 0V | 2 |
| Gate Threshold Voltage | VGS(TH) | -0.4 | -0.7 | -1.5 | V | VDS = VGS, ID = -250µA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 23 | 35 | mΩ | VGS = -4.5V, ID = -4.0A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 30 | 45 | mΩ | VGS = -2.5V, ID = -4.0A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 41 | 62 | mΩ | VGS = -1.8V, ID = -2.0A | 2 |
| Diode Forward Voltage | VSD | | -0.7 | -1 | V | VGS = 0V, IS = -1A | 2 |
| Input Capacitance | Ciss | | 1610 | 2400 | pF | VDS = -10V, VGS = 0V, f = 1.0MHz | 2 |
| Output Capacitance | Coss | | 157 | 210 | pF | VDS = -10V, VGS = 0V, f = 1.0MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 145 | 200 | pF | VDS = -10V, VGS = 0V, f = 1.0MHz | 2 |
| Gate Resistance | RG | | 9.4 | 14.1 | Ω | VDS = 0V, VGS = 0V, f = 1.0MHz | 2 |
| Total Gate Charge | Qg | | 15.4 | 23.1 | nC | VDS = -10V, VGS = -4.5V, ID = -4A | 2 |
| Turn-On Delay Time | tD(ON) | | 17 | 33 | ns | VGS = -4.5V, VDS = -10V, RG = 6Ω, ID = -1A, RL = 10Ω | 2 |
| Turn-On Rise Time | tR | | 12 | 19 | ns | VGS = -4.5V, VDS = -10V, RG = 6Ω, ID = -1A, RL = 10Ω | 2 |
| Turn-Off Delay Time | tD(OFF) | | 94 | 150 | ns | VGS = -4.5V, VDS = -10V, RG = 6Ω, ID = -1A, RL = 10Ω | 2 |
| Turn-Off Fall Time | tF | | 42 | 64 | ns | VGS = -4.5V, VDS = -10V, RG = 6Ω, ID = -1A, RL = 10Ω | 2 |
| Reverse Recovery Time | tRR | | 14 | 25 | ns | IF = -4.5A, di/dt = 100A/µs | 2 |
| Reverse Recovery Charge | QRR | | 4 | 8 | nC | IF = -4.5A, di/dt = 100A/µs | 2 |
## CAD (KiCad official)
- Symbol: `DMP2035UVT-7`
- Footprint: `Package_TO_SOT_SMD:TSOT-23-6`
- 3D model: TSOT-26 (KiCad packages3D, STEP)
- 3D model files: `dmp2035uvt-7-etched.step` / `dmp2035uvt-7-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dmp2035uvt-7.step` / `dmp2035uvt-7.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Diodes Incorporated datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588885264593276928) (6 pp, sha256 `6a4eab87d0444b30`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/dmp2035uvt-7-datasheet.pdf)