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DMC3071LVT-13

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Diodes Incorporated MOSFETs, TSOT-26. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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DMC3071LVT-13

Diodes Incorporated · MOSFETs · TSOT-26

DMC3071LVT-13 from Diodes Incorporated, in a TSOT-26. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G1 input Gate of Q1 N-channel MOSFET, with a VGS(TH) of 1.0V to 2.5V and an absolute maximum VGSS of ±20V.
2 S2 passive Source of Q2 P-channel MOSFET, rated for VDSS of -30V and continuous drain current of -3.3A at TA = +25°C.
3 G2 input Gate of Q2 P-channel MOSFET, with a VGS(TH) of -1V to -2.5V and an absolute maximum VGSS of ±20V.
4 D2 passive Drain of Q2 P-channel MOSFET, rated for VDSS of -30V and pulsed drain current IDM of -10A.
5 S1 passive Source of Q1 N-channel MOSFET, rated for VDSS of 30V and continuous drain current of 4.6A at TA = +25°C.
6 D1 passive Drain of Q1 N-channel MOSFET, rated for VDSS of 30V and pulsed drain current IDM of 20A.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package TSOT-26
Category Triode/MOS Tube/Transistor
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage Q1 N-channel BVDSS 30 V VGS = 0V, ID = 250µA 2
Drain-Source Breakdown Voltage Q2 P-channel BVDSS -30 V VGS = 0V, ID = -250µA 3
Zero Gate Voltage Drain Current Q1 IDSS 1 µA VDS = 30V, VGS = 0V 2
Zero Gate Voltage Drain Current Q2 IDSS -1 µA VDS = -30V, VGS = 0V 3
Gate-Source Leakage Q1 IGSS -100 100 nA VGS = ±20V, VDS = 0V 2
Gate-Source Leakage Q2 IGSS -100 100 nA VGS = ±20V, VDS = 0V 3
Gate Threshold Voltage Q1 VGS(TH) 1 2.5 V VDS = VGS, ID = 250μA 2
Gate Threshold Voltage Q2 VGS(TH) -1 -2.5 V VDS = VGS, ID = -250μA 3
Static Drain-Source On-Resistance Q1 at VGS=10V RDS(ON) 34 50 mΩ VGS = 10V, ID = 3.5A 2
Static Drain-Source On-Resistance Q1 at VGS=4.5V RDS(ON) 44 90 mΩ VGS = 4.5V, ID = 2.0A 2
Static Drain-Source On-Resistance Q2 at VGS=-10V RDS(ON) 83 95 mΩ VGS = -10V, ID = -3.8A 3
Static Drain-Source On-Resistance Q2 at VGS=-4.5V RDS(ON) 128 140 mΩ VGS = -4.5V, ID = -3.0A 3
Diode Forward Voltage Q1 VSD 0.8 1 V VGS = 0V, IS = 1A 2
Diode Forward Voltage Q2 VSD -0.8 -1.2 V VGS = 0V, IS = -1A 3
Gate-Source Voltage Q1 and Q2 VGSS -20 20 V 2
Drain-Source Voltage Q1 VDSS 30 V 2
Drain-Source Voltage Q2 VDSS -30 V 2
Continuous Drain Current Q1 TA=+25°C ID 4.6 A VGS = 10V, steady state, TA = +25°C 2
Continuous Drain Current Q1 TA=+70°C ID 3.6 A VGS = 10V, steady state, TA = +70°C 2
Continuous Drain Current Q2 TA=+25°C ID -3.3 A VGS = 10V, steady state, TA = +25°C 2
Continuous Drain Current Q2 TA=+70°C ID -2.6 A VGS = 10V, steady state, TA = +70°C 2
Maximum Continuous Body Diode Forward Current Q1 IS 1.5 A Note 6 2
Maximum Continuous Body Diode Forward Current Q2 IS -1.3 A Note 6 2
Pulsed Drain Current Q1 IDM 20 A 380µs Pulse, Duty Cycle = 1% 2
Pulsed Drain Current Q2 IDM -10 A 380µs Pulse, Duty Cycle = 1% 2
Total Power Dissipation TA=+25°C (Note 5) PD 0.7 W TA = +25°C, Note 5 2
Total Power Dissipation TA=+25°C (Note 6) PD 1.1 W TA = +25°C, Note 6 2
Thermal Resistance Junction to Ambient (Note 5) RJA 186 °C/W Steady state, Note 5 2
Thermal Resistance Junction to Ambient (Note 6) RJA 117 °C/W Steady state, Note 6 2
Thermal Resistance Junction to Case RJC 45 °C/W 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Thermal Resistance Junction to Ambient (transient reference) RθJA 165 ℃/W Figure 25 reference, single pulse duty cycle 8

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminals Connections: See Diagram  Terminals: Finish, Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: DMC3071LVT-13
  • Footprint: Package_TO_SOT_SMD:TSOT-23-6
  • 3D model: TSOT-26 (KiCad packages3D, STEP)
  • 3D model files: dmc3071lvt-13-etched.step / dmc3071lvt-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmc3071lvt-13.step / dmc3071lvt-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (10 pp, sha256 0eb550aaebf6652a, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF