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Contents

README

markdown

DGD2106MS8-13

Diodes Incorporated · Gate Drivers · SO-8

DGD2106MS8-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Low-side and logic fixed supply, recommended operating range 10 V to 20 V (absolute maximum -0.3 to +24 V).
2 HIN input Logic input for the high-side gate driver output, in phase with HO; Schmitt-triggered with internal pull-down, TTL/CMOS compatible down to 3.3 V, with logic input voltage rated 0 V to 5 V.
3 LIN input Logic input for the low-side gate driver output, in phase with LO; Schmitt-triggered with internal pull-down, TTL/CMOS compatible down to 3.3 V, with logic input voltage rated 0 V to 5 V.
4 COM power_in Logic and low-side return; the reference for the HIN/LIN inputs and the HO/LO outputs.
5 LO output Low-side gate drive output, swinging between 0 V and VCC, with pulsed sink current of 600 mA typical (PW ≤ 10 µs).
6 VS power_in High-side floating supply return; logic operation is specified for VS from -5 V to +600 V, with VS offset supply transient dVS/dt of 50 V/ns maximum.
7 HO output High-side gate drive output, floating and referenced to VS, swinging between VS and VB.
8 VB power_in High-side floating supply, recommended operating range VS + 10 V to VS + 20 V (absolute maximum -0.3 to +624 V).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Logic “1” Input Voltage VIH 2.5 V VCC = 10V to 20V 4
Logic “0” Input Voltage VIL 0.6 V VCC = 10V to 20V 4
High Level Output Voltage, VBIAS - VO VOH 0.05 0.2 V IO = 2mA 4
Low Level Output Voltage, VO VOL 0.02 0.1 V IO = 2mA 4
Offset Supply Leakage Current ILK 50 µA VB = VS = 600V 4
Quiescent VBS Supply Current IBSQ 20 75 130 µA VIN = 0V or 5V 4
Quiescent VCC Supply Current ICCQ 60 120 180 µA VIN = 0V or 5V 4
Logic “1” Input Bias Current IIN+ 5 20 µA VIN = 5V 4
Logic “0” Input Bias Current IIN- 2 µA VIN = 0V 4
VBS Supply Undervoltage Positive Going Threshold VBSUV+ 7 8.4 9.8 V 4
VBS Supply Undervoltage Negative Going Threshold VBSUV- 6.4 7.8 9 V 4
VCC Supply Undervoltage Positive Going Threshold VCCUV+ 7 8.4 9.8 V 4
VCC Supply Undervoltage Negative Going Threshold VCCUV- 6.4 7.8 9 V 4
Hysterisis (VCC) VCCUVH 0.3 0.7 V 4
Hysterisis (VBS) VBSUVH 0.3 0.7 V 4
Output High Short Circuit Pulsed Current IO+ 130 290 mA VO = 0V, PW ≤ 10µs 4
Output Low Short Circuit Pulsed Current IO- 270 600 mA VO = 15V, PW ≤ 10µs 4
Turn-On Propagation Delay tON 100 300 ns VS = 0V 4
Turn-Off Propagation Delay tOFF 100 280 ns VS = 0V or 600V 4
Delay Matching tDM 30 ns 4
Turn-On Rise Time tR 90 220 ns VS = 0V 4
Turn-Off Fall Time tF 30 80 ns VS = 0V 4
High Side Floating Supply Offset Voltage VS 600 V Note 6: logic operation for VS of -5V to +600V 3
Low Side and Logic Fixed Supply Voltage VCC 10 20 V 3
Low Side Output Voltage VLO 0 V 3
Logic Input Voltage VIN 0 5 V 3
Ambient Temperature TA -40 125 °C 3
High-Side Floating Supply Voltage VB -0.3 624 V 3
Offset Supply Voltage Transient dVS / dt 50 V/ns 3
Low-Side and Logic Fixed Supply Voltage VCC -0.3 24 V 3
Operating Temperature TJ 150 °C 3
Lead Temperature (Soldering) TL 300 °C 10s 3
Storage Temperature Range TSTG -55 150 °C 3
Power Dissipation Linear Derating Factor PD 0.625 W Note 5: standard JEDEC 2-layer FR-4 board 3
Thermal Resistance, Junction to Ambient RθJA 200 °C/W Note 5: standard JEDEC 2-layer FR-4 board 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Finish, Matte Tin Plated Leads. Solderable per MIL￾STD-202, Method 208  Weight: 0.075 grams (Approximate) 1

CAD (KiCad official)

  • Symbol: DGD2106MS8-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: dgd2106ms8-13-etched.step / dgd2106ms8-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dgd2106ms8-13.step / dgd2106ms8-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (11 pp, sha256 a371f83d1e749fa6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF