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DGD2103MS8-13

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Diodes Incorporated Gate Drive ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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DGD2103MS8-13

Diodes Incorporated · Gate Drive ICs · SOIC-8

DGD2103MS8-13 from Diodes Incorporated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Low-side and logic supply, recommended operating range 10 V to 20 V, with undervoltage lockout (positive-going threshold 8.0 V to 9.8 V, typical 8.9 V).
2 HIN input Logic input for the high-side gate driver, in phase with HO; logic inputs are TTL/CMOS compatible down to 3.3 V, Schmitt-triggered, with recommended range 0 V to 6 V.
3 LIN* input Logic input for the low-side gate driver, out of phase with LO; logic inputs are TTL/CMOS compatible down to 3.3 V, Schmitt-triggered, with recommended range 0 V to 6 V.
4 COM power_in Low-side and logic return (ground reference) for the device.
5 LO output Low-side gate drive output, rated for 290 mA source and 600 mA sink output current capability, with outputs tolerant to negative transients.
6 VS power_in High-side floating supply return; logic operation is specified for VS from -5 V to +600 V and dVS/dt is limited to 50 V/ns.
7 HO output High-side gate drive output, referenced to VS, with output voltage limited to VS - 0.3 V to VB + 0.3 V.
8 VB power_in High-side floating supply, recommended at VS + 10 V to VS + 20 V, with absolute maximum rating of -0.3 V to +624 V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOIC-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
High-Side Floating Supply Voltage VB -0.3 624 V 3
Offset Supply Voltage Transient dVS / dt 50 V/ns 3
Low-Side Fixed Supply Voltage VCC -0.3 24 V 3
Low-Side Output Voltage VLO -0.3 V 3
Logic Input Voltage (HIN and LIN*) VIN -0.3 V 3
Power Dissipation Linear Derating Factor PD 0.625 W @TA = +25°C; Note 5 3
Thermal Resistance, Junction to Ambient RθJA 200 °C/W Note 5: standard JEDEC 2-layer FR-4 board 3
Operating Temperature TJ 150 °C 3
Lead Temperature (Soldering, 10s) TL 300 °C Soldering, 10s 3
Storage Temperature Range TSTG -55 150 °C 3
High Side Floating Supply Offset Voltage VS 600 V Note 6: logic operation for VS of -5V to +600V 3
Low Side Supply Voltage VCC 10 20 V 3
Low Side Output Voltage VLO 0 V 3
Logic Input Voltage (HIN & LIN*) VIN 0 6 V 3
Ambient Temperature TA -40 125 °C 3
Logic “1” (HIN) & Logic “0” (LIN*) Input Voltage VIH 2.5 V VCC = 10V to 20V 4
Logic “0” (HIN) & Logic “1” (LIN*) Input Voltage VIL 0.8 V VCC = 10V to 20V 4
High Level Output Voltage, VBIAS - VO VOH 0.05 0.2 V IO = 2mA 4
Low Level Output Voltage, VO VOL 0.02 0.1 V IO = 2mA 4
Offset Supply Leakage Current ILK 50 µA VB = VS = 600V 4
Quiescent VBS Supply Current IBSQ 60 100 µA VIN = 0V or 5V 4
Quiescent VCC Supply Current ICCQ 350 500 µA VIN = 0V or 5V 4
Logic “1” Input Bias Current IIN+ 3 10 µA HIN = 5V, LIN* = 0V 4
Logic “0” Input Bias Current IIN- 5 µA HIN = 0V, LIN* = 5V 4
VCC Supply Undervoltage Positive Going Threshold VCCUV+ 8 8.9 9.8 V 4
VCC Supply Undervoltage Negative Going Threshold VCCUV- 7.4 8.2 9 V 4
VBS Supply Undervoltage Positive Going Threshold VBSUV+ 4.5 5.5 6.5 V 4
VBS Supply Undervoltage Negative Going Threshold VBSUV- 4.2 5.2 6.2 V 4
Output High Short Circuit Pulsed Current IO+ 130 290 mA VO = 0V, PW ≤ 10µs 4
Output Low Short Circuit Pulsed Current IO- 270 600 mA VO = 15V, PW ≤ 10µs 4
Turn-On Propagation Delay tON 680 820 ns VS = 0V 4
Turn-Off Propagation Delay tOFF 150 220 ns VS = 600V 4
Delay Matching, HO & LO Turn-On / Turn-Off tDM 60 ns 4
Turn-On Rise Time tR 70 170 ns VS = 0V 4
Turn-Off Fall Time tF 35 90 ns VS = 0V 4
Deadtime: tDT LO-HO & tDT HO-LO tDT 300 420 650 ns 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Finish, Matte Tin Plated Leads. Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: DGD2103MS8-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: dgd2103ms8-13-etched.step / dgd2103ms8-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dgd2103ms8-13.step / dgd2103ms8-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (11 pp, sha256 00223e43c1dbd115, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF