component
CY8C4045LQI-S411
Public Made by Adomby adom
Cypress Semicon Microcontroller Units (MCUs/MPUs/SOCs), QFN-24(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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CY8C4045LQI-S411
Cypress Semicon · Microcontroller Units (MCUs/MPUs/SOCs) · QFN-24(4x4)
CY8C4045LQI-S411 from Cypress Semicon, in a QFN-24(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | P1.7 | bidirectional | GPIO port 1 bit 7 with no alternate function listed in the pin assignment table. |
| 2 | P2.0 | bidirectional | GPIO that can be Smart I/O prgio[0].io[0], tcpwm.line[4]:0, csd.comp, tcpwm.tr_in[4], or Deep Sleep scb[1] I2C SCL:1 / SPI MOSI:2. |
| 3 | P2.1 | bidirectional | GPIO that can be Smart I/O prgio[0].io[1], tcpwm.line_compl[4]:0, tcpwm.tr_in[5], or Deep Sleep scb[1] I2C SDA:1 / SPI MISO:2. |
| 4 | P2.6 | bidirectional | GPIO that can be Smart I/O prgio[0].io[6], tcpwm.line[1]:1, or scb[1] spi_select3:1. |
| 5 | P2.7 | bidirectional | GPIO that can be Smart I/O prgio[0].io[7], tcpwm.line_compl[1]:1, or Deep Sleep lpcomp.comp[0]:1. |
| 6 | P3.0 | bidirectional | GPIO that can be Smart I/O prgio[1].io[0], tcpwm.line[0]:0, scb[1] UART RX:1, or Deep Sleep scb[1] I2C SCL:2 / SPI MOSI:0. |
| 7 | P3.2 | bidirectional | GPIO that can be Smart I/O prgio[1].io[2], tcpwm.line[1]:0, scb[1] UART CTS:1, SWD data (cpuss.swd_data), or scb[1] SPI clock:0. |
| 8 | P3.3 | bidirectional | GPIO that can be Smart I/O prgio[1].io[3], tcpwm.line_compl[1]:0, scb[1] UART RTS:1, SWD clock (cpuss.swd_clk), or scb[1] spi_select0:0. |
| 9 | P4.0 | bidirectional | GPIO that can be CAPSENSE external reference csd.vref_ext, scb[0] UART RX:0, tcpwm.tr_in[10], or Deep Sleep scb[0] I2C SCL:1 / SPI MOSI:0. |
| 10 | P4.1 | bidirectional | GPIO that can be CAPSENSE csd.cshieldpads, scb[0] UART TX:0, tcpwm.tr_in[11], or Deep Sleep scb[0] I2C SDA:1 / SPI MISO:0. |
| 11 | P4.2 | bidirectional | GPIO that can be CAPSENSE modulator capacitor pad csd.cmodpad, scb[0] UART CTS:0, lpcomp.comp[0]:0, or scb[0] SPI clock:0. |
| 12 | P4.3 | bidirectional | GPIO that can be CAPSENSE csd.csh_tank, scb[0] UART RTS:0, lpcomp.comp[1]:0, or scb[0] spi_select0:0. |
| 13 | P0.0 | bidirectional | GPIO that can be low-power comparator input lpcomp.in_p[0], tcpwm.tr_in[0], or scb[0] spi_select1:0. |
| 14 | P0.1 | bidirectional | GPIO that can be low-power comparator input lpcomp.in_n[0], tcpwm.tr_in[1], or scb[0] spi_select2:0. |
| 15 | P0.4 | bidirectional | GPIO that can be watch crystal input wco.wco_in, scb[1] UART RX:0, or Deep Sleep scb[1] I2C SCL:0 / SPI MOSI:1. |
| 16 | P0.5 | bidirectional | GPIO that can be watch crystal output wco.wco_out, scb[1] UART TX:0, or Deep Sleep scb[1] I2C SDA:0 / SPI MISO:1. |
| 17 | P0.6 | bidirectional | GPIO that can be external clock input srss.ext_clk, scb[1] UART CTS:0, or scb[1] SPI clock:1. |
| 18 | XRES | input | External reset input pin. |
| 19 | VCCD | power_out | Regulated digital supply (1.8 V ± 5%); must be bypassed to ground with a 0.1 µF X5R ceramic or better capacitor and not connected to anything else in the 1.8 V to 5.5 V supply mode. |
| 20 | VSSD | power_in | Ground pin for the digital section. |
| 21 | VDD | power_in | Power supply to all sections of the chip, 1.8 V to 5.5 V (or 1.71 V to 1.89 V when externally regulated with VCCD shorted). |
| 22 | VSSA | power_in | Ground pin for the analog section. |
| 23 | P1.2 | bidirectional | GPIO that can be tcpwm.line[3]:1, scb[0] UART CTS:1, tcpwm.tr_in[2], or scb[0] SPI clock:1. |
| 24 | P1.3 | bidirectional | GPIO that can be tcpwm.line_compl[3]:1, scb[0] UART RTS:1, tcpwm.tr_in[3], or scb[0] spi_select0:1. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Cypress Semicon |
| Package | QFN-24(4x4) |
| Category | Single Chip Microcomputer/Microcontroller |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Digital supply relative to VSS | VDDD_ABS | -0.5 | 6 | V | 21 | ||
| Direct digital core voltage input relative to VSS | VCCD_ABS | -0.5 | 1.95 | V | 21 | ||
| GPIO voltage | VGPIO_ABS | -0.5 | V | Max is VDD + 0.5 | 21 | ||
| Maximum current per GPIO | IGPIO_ABS | -25 | 25 | mA | 21 | ||
| GPIO injection current | IGPIO_injection | -0.5 | 0.5 | mA | Max for VIH > VDDD, Min for VIL < VSS; current injected per pin | 21 | |
| ESD human body model | ESD_HBM | 2200 | V | 21 | |||
| ESD charged device model | ESD_CDM | 500 | V | 21 | |||
| Pin current for latch-up | LU | -140 | 140 | mA | 21 | ||
| Power supply input voltage (internally regulated) | VDD | 1.8 | 5.5 | V | Internally regulated supply | 22 | |
| Power supply input voltage (VCCD = VDD = VDDA) | VDD | 1.71 | 1.89 | V | Internally unregulated supply | 22 | |
| Output voltage (for core logic) | VCCD | 1.8 | V | 22 | |||
| External regulator voltage bypass | CEFC | 0.1 | µF | X5R ceramic or better | 22 | ||
| Power supply bypass capacitor | CEXC | 1 | µF | X5R ceramic or better | 22 | ||
| Active mode current, execute from flash, CPU at 6 MHz | IDD5 | 1.2 | 2 | mA | Active mode, VDD = 1.8 V to 5.5 V | 22 | |
| Active mode current, execute from flash, CPU at 24 MHz | IDD8 | 2.4 | 4 | mA | Active mode, VDD = 1.8 V to 5.5 V | 22 | |
| Active mode current, execute from flash, CPU at 48 MHz | IDD11 | 4.6 | 5.9 | mA | Active mode, VDD = 1.8 V to 5.5 V | 22 | |
| Sleep current, I2C wakeup, WDT, comparators on | IDD17 | 1.1 | 1.6 | mA | VDDD = 1.8 V to 5.5 V (Regulator on); 6 MHz | 22 | |
| Sleep current, I2C wakeup, WDT, comparators on | IDD20 | 1.4 | 1.9 | mA | VDDD = 1.8 V to 5.5 V (Regulator on); 12 MHz | 22 | |
| Sleep current, I2C wakeup, WDT, comparators on | IDD23 | 0.7 | 0.9 | mA | VDDD = 1.71 V to 1.89 V (Regulator bypassed); 6 MHz | 22 | |
| Sleep current, I2C wakeup, WDT, comparators on | IDD23A | 0.9 | 1.1 | mA | VDDD = 1.71 V to 1.89 V (Regulator bypassed); 12 MHz | 22 | |
| Deep Sleep current, I2C wakeup and WDT on | IDD26 | 2.5 | 60 | µA | VDD = 1.8 V to 3.6 V (Regulator on) | 22 | |
| Supply current while XRES asserted | IDD_XR | 2 | 5 | mA | 22 | ||
| IMO operating current at 48 MHz | IIMO1 | 250 | µA | 39 | |||
| IMO operating current at 24 MHz | IIMO2 | 180 | µA | 39 | |||
| IMO frequency variation at 24, 32, and 48 MHz (trimmed) | FIMOTOL1 | -2 | 2 | % | At -40°C to 85°C, for industrial temperature range and original extended industrial range parts | 39 | |
| IMO startup time | TSTARTIMO | 7 | µs | 39 | |||
| RMS jitter at 24 MHz | TJITRMSIMO2 | 145 | ps | 39 | |||
| ILO operating current | IILO1 | 0.3 | 1.05 | µA | 40 | ||
| ILO startup time | TSTARTILO1 | 2 | ms | 40 | |||
| ILO duty cycle | TILODUTY | 40 | 50 | 60 | % | 40 | |
| ILO frequency range | FILOTRIM1 | 20 | 40 | 80 | kHz | 40 | |
| WCO crystal frequency | FWCO | 32.768 | kHz | 40 | |||
| WCO frequency tolerance | FTOL | 50 | 250 | ppm | With 20-ppm crystal | 40 | |
| WCO equivalent series resistance | ESR | 50 | kΩ | 40 | |||
| WCO drive level | PD | 1 | µW | 40 | |||
| WCO startup time | TSTART | 500 | ms | 40 | |||
| WCO crystal load capacitance | CL | 6 | 12.5 | pF | 40 | ||
| WCO crystal shunt capacitance | C0 | 1.35 | pF | 40 | |||
| WCO operating current (high power mode) | IWCO1 | 8 | µA | 40 | |||
| WCO operating current (low power mode) | IWCO2 | 1 | µA | 40 | |||
| External clock input frequency | ExtClkFreq | 0 | 48 | MHz | 41 | ||
| External clock duty cycle | ExtClkDuty | 45 | 55 | % | Measured at VDD/2 | 41 | |
| System clock source switching time | TCLKSWITCH | 3 | 4 | Periods | 41 | ||
| Max delay added by Smart I/O in Bypass Mode | PRG_BYPASS | 1.6 | ns | 41 | |||
| Operating ambient temperature | TA | -40 | 25 | 105 | °C | 44 | |
| Operating junction temperature | TJ | -40 | 125 | °C | 44 | ||
| Package thermal resistance junction-to-ambient | TJA | 21.7 | °C/W | 24L QFN | 44 | ||
| Package thermal resistance junction-to-case | TJC | 5.6 | °C/W | 24L QFN | 44 |
CAD (KiCad official)
- Symbol:
CY8C4045LQI-S411 - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm - 3D model: QFN-24(4x4) (KiCad packages3D, STEP)
- 3D model files:
cy8c4045lqi-s411-etched.step/cy8c4045lqi-s411-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cy8c4045lqi-s411.step/cy8c4045lqi-s411.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Cypress Semicon datasheet (58 pp, sha256
493ab905a29a5d98, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).