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CY8C24123A-24SXI

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Cypress Semicon Microcontroller Units (MCUs/MPUs/SOCs), SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentsingle chip microcomputer-microcontrollercy8c24123a-24sxifactory-2.0.0extractor-text

Verified CY8C24123A-24SXI

by Ray · last 2 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

2 Nov 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: CY8C24123A-24SXI · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 71-page datasheet
  • ✓distributor: lcsc C2953646, digikey CY8C24123A-24SXI-ND, mouser 727-CY8C24123A-24SXI
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-5ue3wghd/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ cy8c24123a-24sxi.kicad_sym✓ cy8c24123a-24sxi.kicad_mod✓ cy8c24123a-24sxi.step
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Ray Publish 0.1.0 e430b99

CY8C24123A-24SXI

Cypress Semicon · Microcontroller Units (MCUs/MPUs/SOCs) · SOIC-8

CY8C24123A-24SXI from Cypress Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P0[5] bidirectional General-purpose I/O pin that serves as an analog column mux input and column output.
2 P0[3] bidirectional General-purpose I/O pin that serves as an analog column mux input and column output.
3 P1[1] bidirectional General-purpose I/O pin that serves as crystal input (XTALin), I2C serial clock (SCL) and ISSP-SCLK, which is not high Z at POR.
4 VSS power_in Ground connection.
5 P1[0] bidirectional General-purpose I/O pin that serves as crystal output (XTALout), I2C serial data (SDA) and ISSP-SDATA, which is not high Z at POR.
6 P0[2] bidirectional General-purpose I/O pin that serves as an analog column mux input.
7 P0[4] bidirectional General-purpose I/O pin that serves as an analog column mux input.
8 VDD power_in Supply voltage.

Key specifications

Parameter Value
Manufacturer Cypress Semicon
Package SOIC-8
Category Single Chip Microcomputer/Microcontroller
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Storage temperature TSTG -55 25 100 °C Higher storage temperatures reduce data retention time 18
Ambient temperature with power applied TA -40 85 °C 18
Supply voltage on VDD relative to VSS VDD -0.5 6 V 18
Maximum current into any port pin IMIO -25 50 mA 18
Electrostatic discharge voltage ESD 2000 V Human body model ESD 18
Latch up current LU 200 mA 18
Ambient temperature TA -40 85 °C 19
Junction temperature TJ -40 100 °C 19
Supply voltage VDD 2.4 5.25 V 19
Supply current IDD 5 8 mA VDD = 5.0 V, TA = 25 °C, CPU = 3 MHz, SLIMO mode = 0, IMO = 24 MHz 19
Supply current IDD3 3.3 6 mA VDD = 3.3 V, TA = 25 °C, CPU = 3 MHz, SLIMO mode = 0, IMO = 24 MHz 19
Supply current IDD27 2 4 mA VDD = 2.7 V, TA = 25 °C, CPU = 0.75 MHz, SLIMO mode = 1, IMO = 6 MHz 19
Sleep (mode) current with POR, LVD, sleep timer, and WDT ISB 3 6.5 µA VDD = 3.3 V, -40 °C ≤ TA ≤ 55 °C, analog power = off 19
Sleep current at high temperature ISBH 4 25 µA VDD = 3.3 V, 55 °C < TA ≤ 85 °C, analog power = off 19
Sleep current with external crystal ISBXTL 4 7.5 µA VDD = 3.3 V, -40 °C ≤ TA ≤ 55 °C, analog power = off 19
Sleep current with external crystal at high temperature ISBXTLH 5 26 µA VDD = 3.3 V, 55 °C < TA ≤ 85 °C, analog power = off 19
Reference voltage (Bandgap) VREF 1.28 1.3 1.32 V VDD > 3.0 V 19
Reference voltage (Bandgap) VREF27 1.16 1.3 1.32 V VDD = 2.4 V to 3.0 V 19
Pull-up resistor RPU 4 5.6 8 kΩ 20
Pull-down resistor RPD 4 5.6 8 kΩ 20
Low output level (5 V / 3.3 V) VOL 0.75 V IOL = 25 mA, VDD = 4.75 to 5.25 V 20
High level source current (5 V / 3.3 V) IOH 10 mA VOH = VDD, 1.0 V 20
Low level sink current (5 V / 3.3 V) IOL 25 mA VOL = 0.75 V 20
Input low level (5 V / 3.3 V) VIL 0.8 V VDD = 3.0 to 5.25 20
Input high level (5 V / 3.3 V) VIH 2.1 V VDD = 3.0 to 5.25 20
Capacitive load on pins as input CIN 3.5 10 pF Package and pin dependent. Temp = 25 °C 20
Capacitive load on pins as output COUT 3.5 10 pF Package and pin dependent. Temp = 25 °C 20
Low output level (2.7 V) VOL 0.75 V IOL = 11.25 mA, VDD = 2.4 to 3.0 V 20
High level source current (2.7 V) IOH 2 mA VOH = VDD, 0.4 20
Input low level (2.7 V) VIL 0.75 V VDD = 2.4 to 3.0 20
Input high level (2.7 V) VIH 2 V VDD = 2.4 to 3.0 20
Low level sink current (2.7 V) IOL 11.25 mA VOL = .75 20
Input hysteresis (5 V / 3.3 V) VH 60 mV 20
Input hysteresis (2.7 V) VH 90 mV 20
Input leakage (absolute value) IIL 1 nA Gross tested to 1 µA 20
Average input offset voltage drift (5 V opamp) TCVOSOA 7 35 µV/°C 21
Supply voltage rejection ratio (5 V opamp) PSRROA 64 80 dB VSS ≤ VIN ≤ (VDD, 2.25) or (VDD, 1.25 V) ≤ VIN ≤ VDD 21
LPC supply current ISLPC 10 40 µA 23
LPC voltage offset VOSLPC 2.5 30 mV 23
VDD for programming and erase VDDP 4.5 5 5.5 V 36
Supply voltage for flash write operation VDDIWRITE 2.7 5.25 V 36
Supply current during programming or verify IDDP 5 25 mA 36
Flash endurance (per block) FlashENPB 50000 cycles Erase/write cycles per block 36
Flash endurance (total) FlashENT 1.8e+06 cycles Erase/write cycles 36
Flash data retention FlashDR 10 Years 36
IMO frequency for 24 MHz FIMO24 22.8 24 25.2 MHz Trimmed for 5 V or 3.3 V operation, SLIMO mode = 0 37
IMO frequency for 6 MHz FIMO6 5.5 6 6.5 MHz Trimmed for 5 V or 3.3 V operation, SLIMO mode = 1 37
CPU frequency (5 V nominal) FCPU1 0.937 24 24.6 MHz SLIMO mode = 0 37
CPU frequency (3.3 V nominal) FCPU2 0.937 12 12.3 MHz SLIMO mode = 0 37
ILO frequency F32K1 15 32 64 kHz 37
ILO untrimmed frequency F32K_U 5 100 kHz After a reset and before the M8C starts to run 37
PLL lock time TPLLSLEW 0.5 10 ms 37
External reset pulse width tXRST 10 µs 37
24 MHz duty cycle DC24M 40 50 60 % 38
Power supply slew rate SRPOWER_UP 250 V/ms VDD slew rate during power-up 38
Time from end of POR to CPU executing code tPOWERUP 16 100 ms Power-up from 0 V 38
Frequency of SCLK FSCLK 0 8 MHz 49

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC The emulator consists of a base unit that connects to the PC 8

CAD (KiCad official)

  • Symbol: CY8C24123A-24SXI
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: cy8c24123a-24sxi-etched.step / cy8c24123a-24sxi-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cy8c24123a-24sxi.step / cy8c24123a-24sxi.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cypress Semicon datasheet (71 pp, sha256 96046f32dbd7d49d, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF