component
CY8C24123A-24SXI
Public Made by Adomby adom
Cypress Semicon Microcontroller Units (MCUs/MPUs/SOCs), SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownCY8C24123A-24SXI
Cypress Semicon · Microcontroller Units (MCUs/MPUs/SOCs) · SOIC-8
CY8C24123A-24SXI from Cypress Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | P0[5] | bidirectional | General-purpose I/O pin that serves as an analog column mux input and column output. |
| 2 | P0[3] | bidirectional | General-purpose I/O pin that serves as an analog column mux input and column output. |
| 3 | P1[1] | bidirectional | General-purpose I/O pin that serves as crystal input (XTALin), I2C serial clock (SCL) and ISSP-SCLK, which is not high Z at POR. |
| 4 | VSS | power_in | Ground connection. |
| 5 | P1[0] | bidirectional | General-purpose I/O pin that serves as crystal output (XTALout), I2C serial data (SDA) and ISSP-SDATA, which is not high Z at POR. |
| 6 | P0[2] | bidirectional | General-purpose I/O pin that serves as an analog column mux input. |
| 7 | P0[4] | bidirectional | General-purpose I/O pin that serves as an analog column mux input. |
| 8 | VDD | power_in | Supply voltage. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Cypress Semicon |
| Package | SOIC-8 |
| Category | Single Chip Microcomputer/Microcontroller |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage temperature | TSTG | -55 | 25 | 100 | °C | Higher storage temperatures reduce data retention time | 18 |
| Ambient temperature with power applied | TA | -40 | 85 | °C | 18 | ||
| Supply voltage on VDD relative to VSS | VDD | -0.5 | 6 | V | 18 | ||
| Maximum current into any port pin | IMIO | -25 | 50 | mA | 18 | ||
| Electrostatic discharge voltage | ESD | 2000 | V | Human body model ESD | 18 | ||
| Latch up current | LU | 200 | mA | 18 | |||
| Ambient temperature | TA | -40 | 85 | °C | 19 | ||
| Junction temperature | TJ | -40 | 100 | °C | 19 | ||
| Supply voltage | VDD | 2.4 | 5.25 | V | 19 | ||
| Supply current | IDD | 5 | 8 | mA | VDD = 5.0 V, TA = 25 °C, CPU = 3 MHz, SLIMO mode = 0, IMO = 24 MHz | 19 | |
| Supply current | IDD3 | 3.3 | 6 | mA | VDD = 3.3 V, TA = 25 °C, CPU = 3 MHz, SLIMO mode = 0, IMO = 24 MHz | 19 | |
| Supply current | IDD27 | 2 | 4 | mA | VDD = 2.7 V, TA = 25 °C, CPU = 0.75 MHz, SLIMO mode = 1, IMO = 6 MHz | 19 | |
| Sleep (mode) current with POR, LVD, sleep timer, and WDT | ISB | 3 | 6.5 | µA | VDD = 3.3 V, -40 °C ≤ TA ≤ 55 °C, analog power = off | 19 | |
| Sleep current at high temperature | ISBH | 4 | 25 | µA | VDD = 3.3 V, 55 °C < TA ≤ 85 °C, analog power = off | 19 | |
| Sleep current with external crystal | ISBXTL | 4 | 7.5 | µA | VDD = 3.3 V, -40 °C ≤ TA ≤ 55 °C, analog power = off | 19 | |
| Sleep current with external crystal at high temperature | ISBXTLH | 5 | 26 | µA | VDD = 3.3 V, 55 °C < TA ≤ 85 °C, analog power = off | 19 | |
| Reference voltage (Bandgap) | VREF | 1.28 | 1.3 | 1.32 | V | VDD > 3.0 V | 19 |
| Reference voltage (Bandgap) | VREF27 | 1.16 | 1.3 | 1.32 | V | VDD = 2.4 V to 3.0 V | 19 |
| Pull-up resistor | RPU | 4 | 5.6 | 8 | kΩ | 20 | |
| Pull-down resistor | RPD | 4 | 5.6 | 8 | kΩ | 20 | |
| Low output level (5 V / 3.3 V) | VOL | 0.75 | V | IOL = 25 mA, VDD = 4.75 to 5.25 V | 20 | ||
| High level source current (5 V / 3.3 V) | IOH | 10 | mA | VOH = VDD, 1.0 V | 20 | ||
| Low level sink current (5 V / 3.3 V) | IOL | 25 | mA | VOL = 0.75 V | 20 | ||
| Input low level (5 V / 3.3 V) | VIL | 0.8 | V | VDD = 3.0 to 5.25 | 20 | ||
| Input high level (5 V / 3.3 V) | VIH | 2.1 | V | VDD = 3.0 to 5.25 | 20 | ||
| Capacitive load on pins as input | CIN | 3.5 | 10 | pF | Package and pin dependent. Temp = 25 °C | 20 | |
| Capacitive load on pins as output | COUT | 3.5 | 10 | pF | Package and pin dependent. Temp = 25 °C | 20 | |
| Low output level (2.7 V) | VOL | 0.75 | V | IOL = 11.25 mA, VDD = 2.4 to 3.0 V | 20 | ||
| High level source current (2.7 V) | IOH | 2 | mA | VOH = VDD, 0.4 | 20 | ||
| Input low level (2.7 V) | VIL | 0.75 | V | VDD = 2.4 to 3.0 | 20 | ||
| Input high level (2.7 V) | VIH | 2 | V | VDD = 2.4 to 3.0 | 20 | ||
| Low level sink current (2.7 V) | IOL | 11.25 | mA | VOL = .75 | 20 | ||
| Input hysteresis (5 V / 3.3 V) | VH | 60 | mV | 20 | |||
| Input hysteresis (2.7 V) | VH | 90 | mV | 20 | |||
| Input leakage (absolute value) | IIL | 1 | nA | Gross tested to 1 µA | 20 | ||
| Average input offset voltage drift (5 V opamp) | TCVOSOA | 7 | 35 | µV/°C | 21 | ||
| Supply voltage rejection ratio (5 V opamp) | PSRROA | 64 | 80 | dB | VSS ≤ VIN ≤ (VDD, 2.25) or (VDD, 1.25 V) ≤ VIN ≤ VDD | 21 | |
| LPC supply current | ISLPC | 10 | 40 | µA | 23 | ||
| LPC voltage offset | VOSLPC | 2.5 | 30 | mV | 23 | ||
| VDD for programming and erase | VDDP | 4.5 | 5 | 5.5 | V | 36 | |
| Supply voltage for flash write operation | VDDIWRITE | 2.7 | 5.25 | V | 36 | ||
| Supply current during programming or verify | IDDP | 5 | 25 | mA | 36 | ||
| Flash endurance (per block) | FlashENPB | 50000 | cycles | Erase/write cycles per block | 36 | ||
| Flash endurance (total) | FlashENT | 1.8e+06 | cycles | Erase/write cycles | 36 | ||
| Flash data retention | FlashDR | 10 | Years | 36 | |||
| IMO frequency for 24 MHz | FIMO24 | 22.8 | 24 | 25.2 | MHz | Trimmed for 5 V or 3.3 V operation, SLIMO mode = 0 | 37 |
| IMO frequency for 6 MHz | FIMO6 | 5.5 | 6 | 6.5 | MHz | Trimmed for 5 V or 3.3 V operation, SLIMO mode = 1 | 37 |
| CPU frequency (5 V nominal) | FCPU1 | 0.937 | 24 | 24.6 | MHz | SLIMO mode = 0 | 37 |
| CPU frequency (3.3 V nominal) | FCPU2 | 0.937 | 12 | 12.3 | MHz | SLIMO mode = 0 | 37 |
| ILO frequency | F32K1 | 15 | 32 | 64 | kHz | 37 | |
| ILO untrimmed frequency | F32K_U | 5 | 100 | kHz | After a reset and before the M8C starts to run | 37 | |
| PLL lock time | TPLLSLEW | 0.5 | 10 | ms | 37 | ||
| External reset pulse width | tXRST | 10 | µs | 37 | |||
| 24 MHz duty cycle | DC24M | 40 | 50 | 60 | % | 38 | |
| Power supply slew rate | SRPOWER_UP | 250 | V/ms | VDD slew rate during power-up | 38 | ||
| Time from end of POR to CPU executing code | tPOWERUP | 16 | 100 | ms | Power-up from 0 V | 38 | |
| Frequency of SCLK | FSCLK | 0 | 8 | MHz | 49 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | The emulator consists of a base unit that connects to the PC | 8 |
CAD (KiCad official)
- Symbol:
CY8C24123A-24SXI - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
cy8c24123a-24sxi-etched.step/cy8c24123a-24sxi-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cy8c24123a-24sxi.step/cy8c24123a-24sxi.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Cypress Semicon datasheet (71 pp, sha256
96046f32dbd7d49d, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).