component
CY74FCT373TSOC
Public Made by Adomby adom
Texas Instruments Latches, SOIC-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
CY74FCT373TSOC
Texas Instruments · Latches · SOIC-20-300mil
CY74FCT373TSOC from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OE | input | Output enable input: when OE is low the bus outputs show the latched data, and when OE is high the outputs are in the high-impedance state. |
| 2 | O0 | tri_state | 3-state output 0 of the latch, which is high-impedance when OE is high and drives the bus when OE is low, with a CY74FCT373T rating of 64-mA sink and 32-mA source current. |
| 3 | D0 | input | Data input 0 to the latch, which must meet the setup and hold times relative to the rising edge of LE (setup 2 ns, hold 1.5 ns). |
| 4 | D1 | input | Data input 1 to the latch, which must meet the setup and hold times relative to the rising edge of LE (setup 2 ns, hold 1.5 ns). |
| 5 | O1 | tri_state | 3-state output 1 of the latch, which is high-impedance when OE is high and drives the bus when OE is low, with a CY74FCT373T rating of 64-mA sink and 32-mA source current. |
| 6 | O2 | tri_state | 3-state output 2 of the latch, which is high-impedance when OE is high and drives the bus when OE is low, with a CY74FCT373T rating of 64-mA sink and 32-mA source current. |
| 7 | D2 | input | Data input 2 to the latch, which must meet the setup and hold times relative to the rising edge of LE (setup 2 ns, hold 1.5 ns). |
| 8 | D3 | input | Data input 3 to the latch, which must meet the setup and hold times relative to the rising edge of LE (setup 2 ns, hold 1.5 ns). |
| 9 | O3 | tri_state | 3-state output 3 of the latch, which is high-impedance when OE is high and drives the bus when OE is low, with a CY74FCT373T rating of 64-mA sink and 32-mA source current. |
| 10 | GND | power_in | Ground reference for the device. |
| 11 | LE | input | Latch enable input: when LE is high the latches are transparent to the data, and data is latched when LE transitions from high to low. |
| 12 | O4 | tri_state | 3-state output 4 of the latch, which is high-impedance when OE is high and drives the bus when OE is low, with a CY74FCT373T rating of 64-mA sink and 32-mA source current. |
| 13 | D4 | input | Data input 4 to the latch, which must meet the setup and hold times relative to the rising edge of LE (setup 2 ns, hold 1.5 ns). |
| 14 | D5 | input | Data input 5 to the latch, which must meet the setup and hold times relative to the rising edge of LE (setup 2 ns, hold 1.5 ns). |
| 15 | O5 | tri_state | 3-state output 5 of the latch, which is high-impedance when OE is high and drives the bus when OE is low, with a CY74FCT373T rating of 64-mA sink and 32-mA source current. |
| 16 | O6 | tri_state | 3-state output 6 of the latch, which is high-impedance when OE is high and drives the bus when OE is low, with a CY74FCT373T rating of 64-mA sink and 32-mA source current. |
| 17 | D6 | input | Data input 6 to the latch, which must meet the setup and hold times relative to the rising edge of LE (setup 2 ns, hold 1.5 ns). |
| 18 | D7 | input | Data input 7 to the latch, which must meet the setup and hold times relative to the rising edge of LE (setup 2 ns, hold 1.5 ns). |
| 19 | O7 | tri_state | 3-state output 7 of the latch, which is high-impedance when OE is high and drives the bus when OE is low, with a CY74FCT373T rating of 64-mA sink and 32-mA source current. |
| 20 | VCC | power_in | Supply voltage, recommended range 4.75 V to 5.25 V (nominal 5 V) for the CY74FCT373T. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-20-300mil |
| Category | Logic |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 4.75 | 5 | 5.25 | V | 3 | |
| High-level input voltage | VIH | 2 | V | 3 | |||
| Low-level input voltage | VIL | 0.8 | V | 3 | |||
| High-level output current | IOH | -32 | mA | 3 | |||
| Low-level output current | IOL | 64 | mA | 3 | |||
| Operating free-air temperature | TA | -40 | 85 | °C | 3 | ||
| Supply voltage range to ground potential | -0.5 | 7 | V | 3 | |||
| DC input voltage range | -0.5 | 7 | V | 3 | |||
| DC output voltage range | -0.5 | 7 | V | 3 | |||
| DC output current (maximum sink current/pin) | 120 | mA | 3 | ||||
| Ambient temperature range with power applied | TA | -65 | 135 | °C | 3 | ||
| Storage temperature range | Tstg | -65 | 150 | °C | 3 | ||
| Pulse duration, LE high | tw | 6 | ns | see Figure 1 | 6 | ||
| Setup time, data before LE↑ | tsu | 2 | ns | see Figure 1 | 6 | ||
| Hold time, data after LE↑ | th | 1.5 | ns | see Figure 1 | 6 | ||
| Propagation delay D to O (low-to-high) | tPLH | 1.5 | 8 | ns | see Figure 1 | 6 | |
| Propagation delay D to O (high-to-low) | tPHL | 1.5 | 8 | ns | see Figure 1 | 6 | |
| Propagation delay LE to O (low-to-high) | tPLH | 2 | 13 | ns | see Figure 1 | 6 | |
| Propagation delay LE to O (high-to-low) | tPHL | 2 | 13 | ns | see Figure 1 | 6 | |
| Enable time OE to O (high) | tPZH | 1.5 | 12 | ns | see Figure 1 | 6 | |
| Enable time OE to O (low) | tPZL | 1.5 | 12 | ns | see Figure 1 | 6 | |
| Disable time OE to O (high) | tPHZ | 1.5 | 7.5 | ns | see Figure 1 | 6 | |
| Disable time OE to O (low) | tPLZ | 1.5 | 7.5 | ns | see Figure 1 | 6 | |
| High-level output voltage | VOH | 2.4 | 3.3 | V | VCC = 4.75 V, IOH = -15 mA | 4 | |
| High-level output voltage | VOH | 2 | V | VCC = 4.75 V, IOH = -32 mA | 4 | ||
| Low-level output voltage | VOL | 0.3 | 0.55 | V | VCC = 4.75 V, IOL = 64 mA | 4 | |
| Input clamp voltage | VIK | -0.7 | -1.2 | V | VCC = 4.75 V, IIN = -18 mA | 4 | |
| Input current | II | 5 | µA | VCC = 5.25 V, VIN = VCC | 4 | ||
| High-level input current | IIH | -1 | 1 | µA | VCC = 5.25 V, VIN = 2.7 V | 4 | |
| Low-level input current | IIL | -1 | 1 | µA | VCC = 5.25 V, VIN = 0.5 V | 4 | |
| High-level off-state output current | IOZH | 10 | µA | VCC = 5.25 V, VOUT = 2.7 V | 4 | ||
| Low-level off-state output current | IOZL | -10 | µA | VCC = 5.25 V, VOUT = 0.5 V | 4 | ||
| Short-circuit output current | IOS | -60 | -120 | -225 | mA | VCC = 5.25 V, VOUT = 0 V | 4 |
| Power-off leakage current | Ioff | -1 | 1 | µA | VCC = 0 V, VOUT = 4.5 V | 4 | |
| Quiescent supply current | ICC | 0.1 | 0.2 | mA | VCC = 5.25 V, VIN ≤ 0.2 V, VIN ≥ VCC, 0.2 V | 4 | |
| Supply current per TTL high input | ΔICC | 0.5 | 2 | mA | VCC = 5.25 V, VIN = 3.4 V, f1 = 0, Outputs open | 4 | |
| Dynamic current per input transition | ICCD | 0.06 | 0.12 | mA/MHz | VCC = 5.25 V, Outputs open, one input switching at 50% duty cycle, OE = GND | 5 | |
| Total supply current, one bit switching at 10 MHz | IC | 0.7 | 1.4 | mA | VCC = 5.25 V, one bit switching at f1 = 10 MHz, VIN ≤ 0.2 V or VIN ≥ VCC, 0.2 V | 5 | |
| Total supply current, one bit switching at 50% duty cycle | IC | 1 | 2.4 | mA | VCC = 5.25 V, Outputs open, one bit at 50% duty cycle, VIN = 3.4 V or GND, OE = GND, LE = VCC | 5 | |
| Total supply current, eight bits switching at 2.5 MHz | IC | 1.3 | 2.6 | mA | VCC = 5.25 V, eight bits switching at f1 = 2.5 MHz, VIN ≤ 0.2 V or VIN ≥ VCC, 0.2 V | 5 | |
| Total supply current, eight bits switching at 2.5 MHz, TTL inputs | IC | 3.3 | 10.6 | mA | VCC = 5.25 V, Outputs open, eight bits at 50% duty cycle, VIN = 3.4 V or GND, OE = GND, LE = VCC | 5 | |
| Input capacitance | Ci | 6 | 10 | pF | 5 | ||
| Output capacitance | Co | 8 | 12 | pF | 5 | ||
| Package thermal impedance, junction-to-ambient (SO package) | θJA | 58 | °C/W | SO package, per JESD 51-7 | 3 |
CAD (KiCad official)
- Symbol:
CY74FCT373TSOC - Footprint:
Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm - 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
- 3D model files:
cy74fct373tsoc-etched.step/cy74fct373tsoc-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cy74fct373tsoc.step/cy74fct373tsoc.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (13 pp, sha256
826e982302a909bc, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).