# CS25N06C4

**Wuxi China Resources Huajing Microelectronics** · MOSFETs · TO-252-2

CS25N06C4 from Wuxi China Resources Huajing Microelectronics, in a TO-252-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-to-source voltage rated ±20 V, with threshold VGS(TH) 1.0 to 2.0 V at VDS=VGS, ID=250µA. |
| 2 | D | passive | Drain (also the tab); drain-to-source voltage 60 V, continuous drain current 25 A at TC=25 °C. |
| 3 | S | passive | Source; body diode continuous source current 25 A at TC=25 °C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Wuxi China Resources Huajing Microelectronics |
| Package | TO-252-2 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Voltage | VDSS |  |  | 60 | V |  | 1 |
| Continuous Drain Current | ID |  |  | 25 | A | TC= 25 °C | 1 |
| Continuous Drain Current | ID |  |  | 17.5 | A | TC = 100 °C | 1 |
| Pulsed Drain Current | IDM |  |  | 100 | A | TC= 25 °C | 1 |
| Gate-to-Source Voltage | VGS | -20 |  | 20 | V |  | 1 |
| Avalanche Energy | EAS |  |  | 56.2 | mJ | L=0.5mH,VDD=30V,Ias=15A Start TJ=25℃ | 1 |
| Power Dissipation | PD |  |  | 36.2 | W | TC = 25 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 |  | 150 | ℃ |  | 1 |
| Drain to Source Breakdown Voltage | VDSS | 60 |  |  | V | VGS=0V, ID=250µA | 2 |
| Drain to Source Leakage Current | IDSS |  |  | 1 | µA | VDS =60V, VGS= 0V, Tj = 25℃ | 2 |
| Drain to Source Leakage Current | IDSS |  |  | 100 | µA | VDS =48V, VGS= 0V, Tj = 125℃ | 2 |
| Gate to Source Forward Leakage | IGSS(F) |  |  | 100 | nA | VGS=20V | 2 |
| Gate to Source Reverse Leakage | IGSS(R) |  |  | -100 | nA | VGS =-20V | 2 |
| Drain-to-Source On-Resistance | RDS(ON) |  | 23 | 29 | mΩ | VGS=10V,ID=19A | 2 |
| Drain-to-Source On-Resistance | RDS(ON) |  | 30 | 38 | mΩ | VGS=4.5V,ID=19A | 2 |
| Gate Threshold Voltage | VGS(TH) | 1 | 1.5 | 2 | V | VDS = VGS, ID = 250µA | 2 |
| Continuous Source Current (Body Diode) | IS |  |  | 25 | A | TC= 25℃ | 3 |
| Maximum Pulsed Current (Body Diode) | ISM |  |  | 100 | A |  | 3 |
| Diode Forward Voltage | VSD |  |  | 1.2 | V | IS=20A,VGS=0V | 3 |
| Junction-to-Case Thermal Resistance | RθJC |  |  | 3.45 | ℃/W |  | 3 |
| Junction-to-Ambient Thermal Resistance | RθJA |  |  | 111.5 | ℃/W |  | 3 |

## CAD (KiCad official)

- Symbol: `CS25N06C4`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252-2 (KiCad packages3D, STEP)
- 3D model files: `cs25n06c4-etched.step` / `cs25n06c4-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cs25n06c4.step` / `cs25n06c4.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Wuxi China Resources Huajing Microelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588911540145147904) (10 pp, sha256 `9483d873c88c8880`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cs25n06c4-datasheet.pdf)