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John Lauer Use generic 3rd party fab wording a9bb39f 6d ago

Independent BQ25792 placement and routing

Native Fusion board: bq-astra-final-live, saved on ConfRoomROG in Default Project / Astra BQ Placement Study.

The original Adonis board is preserved in the public adom/bq25792-charger source and a separate saved reference document. All 109 elements were moved off-board left in a stripped copy. The accepted new placement was calculated from the netlist and footprints, with Molecule interface constraints and critical-component anchors. Routing used explicit octilinear planning, joint IC escape assignment and obstruction repair. No original trace geometry or external autorouter was reused. The video records replay of the calculated geometry into Fusion; it does not represent calculation occurring at playback speed.

Measured result on the recorded replay

  • Original outline retained: 50.4 x 26.4 mm; four copper layers.
  • 109 elements and 50 nets retained; read-back placement and netlist match.
  • 53 machine-pin pad centers checked on the 2 mm Molecule grid, zero failures.
  • Four 1.2 mm drill corner pins retained at (1.2,1.2), (1.2,25.2), (49.2,25.2), (49.2,1.2) mm.
  • Medium-contact footprint drills updated from the source's 0.84 mm to the current component definition's 0.78 mm. This is an explicit footprint change, not an unnoticed difference.
  • Final native geometry: 879 wire segments, 157 routing vias, 69 pour outlines. All wire segments horizontal, vertical or 45 degrees within coordinate quantization tolerance.
  • Final native DRC: 0 airwires, 0 errors, 0 warnings. Evidence: join-repair-recording/final-drc.json.
  • Active saved profile: 3rd party fab 4L with John 0.1mm isolation floor. Different-net copper clearances retain the floor; pad-to-pad remains the stricter 0.15 mm, copper-to-edge 0.2 mm and drill-to-drill 0.2 mm.
  • Final copper coverage, via identities, pour outlines/properties and placement audited against the accepted calculation plus the recorded explicit LDO_3V3 join: final-audit.json.
  • Both C32/PMID and C18/SYS and their PGND returns reach IC1 on connected top-layer copper in the native filled-geometry analysis.

Recorded corrections

  1. The initial verifier grouped centerlines by width and falsely reported missing SCL copper when Fusion removed a redundant narrow segment covered by a wider segment. The verifier now compares occupied copper per net/layer, with widths retained. It rejects actual missing, narrower and wider copper. The stopped take and all reports remain preserved.
  2. Native DRC on the completed replay found one LDO_3V3 airwire despite copper coverage matching the imported candidate. A short horizontal/45-degree connection between nearby vias was calculated, recorded and added on layer 15. Fresh native DRC then returned zero airwires/errors/warnings. The final artifact includes this correction; the pre-correction result is not presented as final.

Significant tradeoffs and unqualified items

The new layout uses 157 routing vias versus the original's 88. This is not a claim of global optimum, lower EMI, better efficiency or superior thermal performance. The original comparison copy under the same rule profile reported 14 wire-stub errors and 7 warnings after refill; preserve that baseline separately from new-board results.

Only a battery target of up to 4S lithium-ion was supplied. Input range, charge/load current, loss budget, ambient, enclosure and airflow remain unspecified. Native DRC is not current-capacity, signal-integrity, voltage/transient or thermal signoff. Copper area is not dissipated power or temperature. The area-analysis script uses declared pad dimensions and polygonized circles; effective rule-expanded pad dimensions need CAM-output verification before manufacturing-area claims.

Molecule corner/grid and electrical mating patterns were checked. Full daughterboard envelopes, pin/jumper access, press-fit tolerances, assembly clearances and mechanical fit still need qualification. The current medium-contact component documentation itself notes press-fit validation is ongoing.

These are standalone board snapshots with preserved netlist membership. Fusion displays its schematic/PCB synchronization warning; no claim of synchronized parent Electronics Design or ERC signoff is made. Native Gerber/CAM and manufacturing acceptance were not requested or completed in this pass.

Artifacts and reproduction

  • astra-comparison-native.brd: authoritative final saved native export.
  • adonis-comparison-native.brd: comparison reference export.
  • placement-candidate-08.json: accepted placement.
  • routing-repair-04/candidate-plan.json: accepted route calculation before explicit final join.
  • replay-items-with-explicit-join.json: expected final routing primitives.
  • add_copper.py: power/ground copper allocation.
  • verify_copper.py, audit_final.py, measure_native.py: checks, with their stated limits.
  • captures/: original native recordings; failed takes retained.
  • edit_video.py, verified-edit-cuts.json, narration.json, captions.ass, edit-manifest.json: video recipe and provenance.

Do not blindly rerun live scripts: they contain exact task document/host identities and expected checkpoints. General routing skills should teach manufacturer selection, interface constraints, joint escape planning, width-aware copper verification, explicit native junctions and final DRC without these demo-specific paths.

The installed fusion_route_net description exposes conservative two-layer preflight. This four-layer run did not treat it as a four-layer autorouter. The independent planner modeled layers 1/2/15/16, and live replay used native Electron.run LINE/VIA/POLYGON commands through guarded fusion_run_modeling_script, followed by native snapshots and fusion_routing_drc. The bridge transports and validates explicit actions; routing intelligence and placement heuristics are in the calculation scripts.