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CMP110N08

Cmos(广东场效应半导体) · MOSFETs · TO-220

CMP110N08 from Cmos(广东场效应半导体), in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; threshold VGS(th) 2 to 4 V at VDS=VGS, ID=250uA, with absolute maximum VGS of ±25 V.
2 D passive Drain (also connected to the tab); VDS max 80 V, continuous current 110 A at TC=25℃ and pulsed 440 A.
3 S passive Source; continuous body-diode source current IS is 110 A and pulsed ISM is 440 A.

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package TO-220
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 80 V 1
Gate-Source Voltage VGS -25 25 V 1
Continuous Drain Current ID 110 A TC=25℃ 1
Continuous Drain Current ID 80 A TC=100℃ 1
Pulsed Drain Current IDM 440 A 1
Single Pulse Avalanche Energy EAS 1322 mJ 1
Total Power Dissipation PD 250 W TC=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-ambient R JA 91 ℃/W min. footprint 1
Thermal Resistance Junction-case R JC 0.5 ℃/W 1
Drain-Source Breakdown Voltage BVDSS 80 V VGS=0V, ID=250uA 2
Gate Threshold Voltage VGS(th) 2 4 V VDS=VGS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=80V, VGS=0V 2
Drain-Source Leakage Current IDSS 100 uA VDS=80V, VGS=0V, temperature symbol garbled in source 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±25V, VDS=0V 2
Diode Forward Voltage VSD 0.86 1.4 V VGS=0V, IS=40A 2
Continuous Source Current IS 110 A 2
Pulsed Source Current ISM 440 A VG=VD=0V, Force Current 2

CAD (KiCad official)

  • Symbol: CMP110N08
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: cmp110n08-etched.step / cmp110n08-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmp110n08.step / cmp110n08.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (3 pp, sha256 fd3307b3836ff754, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF