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CMN3400ZM

Cmos(广东场效应半导体) · IC · SOT-23-3L

CMN3400ZM from Cmos(广东场效应半导体), in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the N-channel MOSFET, rated for gate-source voltage VGS of ±20V, and the datasheet notes operation with gate voltages as low as 1.5V.
2 Source passive Source terminal of the N-channel MOSFET, the common reference for VGS; the device is rated for drain-source voltage VDS of 30V.
3 Drain passive Drain terminal of the N-channel MOSFET, rated for 30V drain-source voltage and 6A continuous drain current at TA=25℃.

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package SOT-23-3L
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 25 mΩ VGS=10V, ID=6A 2
Static Drain-Source On-Resistance RDS(ON) 38 mΩ VGS=4.5V, ID=5A 2
Gate Threshold Voltage VGS(th) 1 3 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=24V, VGS=0V 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Diode Forward Voltage VSD 1 V VGS=0V, IS=1A 2
Drain-Source Voltage VDS 30 V 2
Gate-Source Voltage VGS -20 20 V 2
Continuous Drain Current ID@TA=25℃ 6 A TA=25℃ 2
Pulsed Drain Current IDM 30 A 2
Total Power Dissipation PD@TA=25℃ 1.5 W TA=25℃ 2
Storage Temperature Range TSTG -55 150 ℃ 2
Operating Junction Temperature Range TJ -55 150 ℃ 2
Thermal Resistance Junction-ambient RθJA 125 ℃/ W Junction-ambient 2
Thermal Resistance Junction-case RθJC 125 °C/W Junction-to-case, as printed in transient thermal impedance graph note 5

CAD (KiCad official)

  • Symbol: CMN3400ZM
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3L (KiCad packages3D, STEP)
  • 3D model files: cmn3400zm-etched.step / cmn3400zm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmn3400zm.step / cmn3400zm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (5 pp, sha256 60bcf8e9ad1988ec, retrieved 2026-11-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF