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CMD50N06N

Cmos(广东场效应半导体) · MOSFETs · TO-252

CMD50N06N from Cmos(广东场效应半导体), in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; drives the N-channel MOSFET, with VGS rated ±20 V absolute maximum and gate threshold of 1 to 3 V at ID=250μA.
2 D passive Drain (center lead, shortened stub, connected to the drain tab); VDS rated 60 V and continuous ID 50 A at TC=25℃.
3 S passive Source; continuous source current 50 A and pulsed source current 200 A through the body diode.

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 50 A TC=25℃ 1
Continuous Drain Current ID 35 A TC=100℃ 1
Pulsed Drain Current IDM 200 A 1
Single Pulse Avalanche Energy EAS 90 mJ 1
Total Power Dissipation PD 75 W TC=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 50 ℃/W 1
Thermal Resistance Junction-Case RθJC 1.67 ℃/W 1
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V, ID=250μA 2
Gate Threshold Voltage VGS(th) 1 3 V VGS=VDS, ID=250μA 2
Drain-Source Leakage Current IDSS 1 uA VDS=60V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 100 uA VDS=60V, VGS=0V, TJ=100℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Static Drain-Source On-Resistance RDS(ON) 12 14 mΩ VGS=10V, ID=25A 2
Static Drain-Source On-Resistance RDS(ON) 14 16 mΩ VGS=4.5V, ID=20A 2
Continuous Source Current IS 50 A 2
Pulsed Source Current ISM 200 A VG=VD=0V, Force Current 2
Diode Forward Voltage VSD 0.84 1.25 V VGS=0V, IS=20A, TJ=25℃ 2

CAD (KiCad official)

  • Symbol: CMD50N06N
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: cmd50n06n-etched.step / cmd50n06n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmd50n06n.step / cmd50n06n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (5 pp, sha256 14778cc3b3bab7b1, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF