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CL9906A18L3M

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CHIPLINK(芯联) Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOT-23-3L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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CL9906A18L3M

CHIPLINK(芯联) · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-3L

CL9906A18L3M from CHIPLINK(芯联), in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground terminal of the regulator (接地端), which is pin 1 in the SOT-23-3L column of the pin table.
2 VOUT power_out Regulated output (1.8 V nominal for the A18 variant); the VOUT pin voltage is limited to GND-0.3 V to VIN+0.3 V and the output current to 250 mA maximum at VIN=3.3 V.
3 VIN power_in Power supply input; maximum input voltage is 6.5 V, and the VIN pin absolute maximum rating is -0.3 V to +7.0 V.

Key specifications

Parameter Value
Manufacturer CHIPLINK(芯联)
Package SOT-23-3L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage (A18 variant, 1.8 V) VOUT 1.764 1.8 1.836 V VIN =3.3V, IOUT=30mA 5
Load regulation ΔVOUT 15 mV VIN=3.3V, 1mA≤IOUT≤100mA 5
Load regulation ΔVOUT 30 mV VIN=3.3V, 1mA≤IOUT≤200mA 5
Dropout voltage Vdif1 70 mV IOUT =30mA 5
Dropout voltage Vdif2 240 mV IOUT =100mA 5
Line regulation ΔVOUT/(ΔVIN*VOUT) 0.05 %/V IOUT =30mA, 3.3≤VIN≤7V 5
Maximum output current IOUT (max) 250 mA VIN =3.3V 5
Short-circuit current ISHORT 50 mA VIN =3.3V 5
Overcurrent protection current ILIMIT 300 mA VIN =3.3V 5
Quiescent current IQ 1 uA 5
Input voltage VIN 6.5 V 5
Input voltage (absolute) VIN -0.3 7 V 3
VOUT pin voltage VOUT -0.3 V Referenced to GND; upper limit printed as VIN+0.3 V 3
VOUT pin current IOUT 500 mA Note (1): IOUT ≤ Pd/(VIN−VOUT) 3
Maximum power dissipation, SOT23_3L Pd 300 mW 3
Maximum power dissipation, SOT23_3L Pd 600 mW With increased PCB heat dissipation (reference only) 3
Operating ambient temperature Topr -25 85 C 3
Storage temperature Tstg -40 125 C 3
Soldering temperature Tsolder 260 C 10s 3
ESD human body model 4000 V HBM 3
ESD machine model 400 V MM 3
Latch-up level 400 mA 3

CAD (KiCad official)

  • Symbol: CL9906A18L3M
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3L (KiCad packages3D, STEP)
  • 3D model files: cl9906a18l3m-etched.step / cl9906a18l3m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cl9906a18l3m.step / cl9906a18l3m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: CHIPLINK(芯联) datasheet (12 pp, sha256 defc25fc4da55cd3, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF