# CL31B102KJHNNNE

**SAMSUNG ELECTRO-MECHANICS** · Global Sourcing Parts · 1206

CL31B102KJHNNNE from SAMSUNG ELECTRO-MECHANICS, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised capacitor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised capacitor; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SAMSUNG ELECTRO-MECHANICS |
| Package | 1206 |
| Category | Global Sourcing Parts |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Capacitance tolerance |  | -10 |  | 10 | % | 1kHz±10% / 1.0±0.2Vrms | 2 |
| Rated voltage |  |  |  | 2000 | V |  | 1 |
| Temperature characteristics of capacitance (X7R) |  | -15 |  | 15 | % | From -55℃ to 125℃ | 2 |
| Dissipation factor (Tan δ) | Tan δ |  |  | 0.025 |  |  | 2 |
| Insulation resistance (MΩ limit) | IR | 10000 |  |  | ㏁ | 500±50 Vdc 60±5 sec | 2 |
| Insulation resistance (MΩ·µF limit) | IR | 500 |  |  | ㏁·㎌ | 500±50 Vdc 60±5 sec | 2 |
| Bending strength: capacitance change |  | -10 |  | 10 | % | Bending to the limit (1mm) with 1.0mm/sec | 2 |
| Solderability: terminal surface coverage |  | 95 |  |  | % | Solder coverage of terminal surface | 2 |
| High temperature resistance: capacitance change |  | -12.5 |  | 12.5 | % | With 150% of the rated voltage | 2 |
| High temperature resistance: Tan δ | Tan δ |  |  | 0.05 |  |  | 2 |
| High temperature resistance: insulation resistance (MΩ limit) | IR | 1000 |  |  | ㏁ |  | 2 |
| High temperature resistance: insulation resistance (MΩ·µF limit) | IR | 50 |  |  | ㏁·㎌ |  | 2 |
| Self-heating temperature rise limit |  |  |  | 20 | ℃ | AC or pulse voltage applied to MLCC | 15 |
| Nominal capacitance | C |  | 1 |  | ㎋ |  | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | * Caution - Iron tip should not contact with ceramic body directly Lead-free solder: Sn-3.0Ag-0.5CU | 26 |

## CAD (KiCad official)

- Symbol: `CL31B102KJHNNNE`
- Footprint: `Capacitor_SMD:C_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `cl31b102kjhnnne-etched.step` / `cl31b102kjhnnne-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cl31b102kjhnnne.step` / `cl31b102kjhnnne.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SAMSUNG ELECTRO-MECHANICS datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590908159072546816) (38 pp, sha256 `f27f6d2d77220528`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cl31b102kjhnnne-datasheet.pdf)