component
CL31B102KJHNNNE
Public Made by Adomby adom
SAMSUNG ELECTRO-MECHANICS Global Sourcing Parts, 1206. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownCL31B102KJHNNNE
SAMSUNG ELECTRO-MECHANICS · Global Sourcing Parts · 1206
CL31B102KJHNNNE from SAMSUNG ELECTRO-MECHANICS, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised capacitor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised capacitor; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SAMSUNG ELECTRO-MECHANICS |
| Package | 1206 |
| Category | Global Sourcing Parts |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Capacitance tolerance | -10 | 10 | % | 1kHz±10% / 1.0±0.2Vrms | 2 | ||
| Rated voltage | 2000 | V | 1 | ||||
| Temperature characteristics of capacitance (X7R) | -15 | 15 | % | From -55℃ to 125℃ | 2 | ||
| Dissipation factor (Tan δ) | Tan δ | 0.025 | 2 | ||||
| Insulation resistance (MΩ limit) | IR | 10000 | ㏁ | 500±50 Vdc 60±5 sec | 2 | ||
| Insulation resistance (MΩ·µF limit) | IR | 500 | ㏁·㎌ | 500±50 Vdc 60±5 sec | 2 | ||
| Bending strength: capacitance change | -10 | 10 | % | Bending to the limit (1mm) with 1.0mm/sec | 2 | ||
| Solderability: terminal surface coverage | 95 | % | Solder coverage of terminal surface | 2 | |||
| High temperature resistance: capacitance change | -12.5 | 12.5 | % | With 150% of the rated voltage | 2 | ||
| High temperature resistance: Tan δ | Tan δ | 0.05 | 2 | ||||
| High temperature resistance: insulation resistance (MΩ limit) | IR | 1000 | ㏁ | 2 | |||
| High temperature resistance: insulation resistance (MΩ·µF limit) | IR | 50 | ㏁·㎌ | 2 | |||
| Self-heating temperature rise limit | 20 | ℃ | AC or pulse voltage applied to MLCC | 15 | |||
| Nominal capacitance | C | 1 | ㎋ | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | * Caution - Iron tip should not contact with ceramic body directly Lead-free solder: Sn-3.0Ag-0.5CU | 26 |
CAD (KiCad official)
- Symbol:
CL31B102KJHNNNE - Footprint:
Capacitor_SMD:C_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
cl31b102kjhnnne-etched.step/cl31b102kjhnnne-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cl31b102kjhnnne.step/cl31b102kjhnnne.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SAMSUNG ELECTRO-MECHANICS datasheet (38 pp, sha256
f27f6d2d77220528, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).