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README: 3D model provenance (Samsung's own STEP, height vs Samsung thickness)

John Lauer ·deb30f0a5b ·26d ago ·parent 5dfeaf8
1 file changed +4
README.md+4
@@ -21,6 +21,10 @@ CL21B474KBFNNNG is a 470 nF ±10% X7R ceramic in 0805 with a full 50 V rat  The reliability table carries the rest: dissipation factor 0.1 max at 1 kHz / 1.0 Vrms (measured after a 150 °C de-aging bake and 24-hour rest), insulation resistance of 10,000 MΩ or 100 MΩ·µF whichever is smaller, a 250%-of-rated withstanding-voltage proof, and a 1,000-hour life test at 150% of rated voltage. (p.2) Reflow is the recommended soldering method, 260 +0/−5 °C peak, 10 s max. (p.2) The document is Samsung's 3-page short-form spec: decode, dimensions, reliability table and soldering method only, with no tape dimensions, reel quantity, or bias/TCC curves. +## 3D model provenance++The STEP is Samsung Electro-Mechanics' own model (`CL21A105KAF1INE.STEP`, published through SnapEDA as "Created with Samsung"). Samsung builds its MLCC models at the top of the thickness tolerance, so this one is 1.36 mm tall against the 1.25 +/- 0.10 mm thickness Samsung lists for this part. Samsung exports it lying on its side (Y up); it is stood upright (Z up, seated on the board) without changing its shape or colours. SnapEDA rate-limited the CL21B474KBFNNN download; Samsung serves CL21A105KAF1INE (its 1.25 mm F-class 0805 model) for both other F-code parts here (CL21B105KBFNNN, CL21A225KAFNNN), so the same file is used. Samsung's file is kept byte for byte in `provenance/`, beside the previous model.+ ## Footprint  Redrawn from the datasheet land pattern (the previous pads were off by up to 0.476 mm).