470 nF Capacitor 0805 - Samsung CL21B474KBFNNNG

Samsung Electro-Mechanics CL21B474KBFNNNG: 0805 MLCC, 470 nF ±10% X7R, 50 V. An Adom Basic Part: Adom keeps it on reels for its pick-and-place line, so boards built with it draw on Adom stock.

Key specs

Notes for designers

CL21B474KBFNNNG is a 470 nF ±10% X7R ceramic in 0805 with a full 50 V rating (p.1), the in-between value for filtering and timing where 100 nF is too small and 1 µF is more than the node needs. The X7R dielectric holds capacitance within ±15% across the whole −55 to +125 °C range, so it keeps its value at hot spots where an X5R part would already be out of spec. (p.2)

The reliability table carries the rest: dissipation factor 0.1 max at 1 kHz / 1.0 Vrms (measured after a 150 °C de-aging bake and 24-hour rest), insulation resistance of 10,000 MΩ or 100 MΩ·µF whichever is smaller, a 250%-of-rated withstanding-voltage proof, and a 1,000-hour life test at 150% of rated voltage. (p.2) Reflow is the recommended soldering method, 260 +0/−5 °C peak, 10 s max. (p.2) The document is Samsung's 3-page short-form spec: decode, dimensions, reliability table and soldering method only, with no tape dimensions, reel quantity, or bias/TCC curves.

3D model provenance

The STEP is Samsung Electro-Mechanics' own model (CL21A105KAF1INE.STEP, published through SnapEDA as "Created with Samsung"). Samsung builds its MLCC models at the top of the thickness tolerance, so this one is 1.36 mm tall against the 1.25 +/- 0.10 mm thickness Samsung lists for this part. Samsung exports it lying on its side (Y up); it is stood upright (Z up, seated on the board) without changing its shape or colours. SnapEDA rate-limited the CL21B474KBFNNN download; Samsung serves CL21A105KAF1INE (its 1.25 mm F-class 0805 model) for both other F-code parts here (CL21B105KBFNNN, CL21A225KAFNNN), so the same file is used. Samsung's file is kept byte for byte in provenance/, beside the previous model.

Footprint

Redrawn from the datasheet land pattern (the previous pads were off by up to 0.476 mm).

Source: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint) (this part's 3-page reference sheet has no land table; the same Samsung MLCC manual table is p.32 of the CL21B104KBCNFNC specification on adom/cl21b104kbcnfnc), p.32 (5-4 Land dimension, Reflow Footprint).

Chip outline

The part's 3D outline in the standard pose (pad 1 toward the viewer), drawn from the STEP by Adom's OpenCascade service; the part number sits where the laser-etched mark is on the 3D model and reads the same way.

Symbol options

The default symbol, CL21B474KBFNNNG.kicad_sym (the one in the Symbol & Footprint panel), is the plain standard symbol. CL21B474KBFNNNG-outline.kicad_sym is the same symbol with the part's 3D chip outline drawn beside it, its part number placed and reading as on the 3D model.

Ordering

Downloads

Provenance

• Datasheet: SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics. md5 4dc9096e5e6691846ef8c3ffc50af5cd
• Footprint: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint) (this part's 3-page reference sheet has no land table; the same Samsung MLCC manual table is p.32 of the CL21B104KBCNFNC specification on adom/cl21b104kbcnfnc), p.32 (5-4 Land dimension, Reflow Footprint). Pads redrawn on 2026-10-03.
• 3D model and symbol: unchanged by the footprint pass; the etched STEP adds a flat virtual part-number mark (an identification aid, not the maker's marking).

More

• Datasheet pages: the 3 datasheet pages as images.
• Assembly animation: the part dropping onto its pads, and Adom's pick-and-place picking it from tape.