CL21B105KBFNNNE - Multilayer Ceramic Capacitor

Samsung Electro-Mechanics CL21B105KBFNNNE: 0805 MLCC, 1 µF ±10% X7R, 50 V. An Adom Basic Part: Adom keeps it on reels for its pick-and-place line, so boards built with it draw on Adom stock.

Key specs

Notes for designers

CL21B105KBFNNNE is a 1 µF X7R in 0805 with a full 50 V rating (p.1), the general-purpose bypass and filter capacitor for rails where a 16 V or 25 V part would leave no headroom. Tolerance is ±10%, and the X7R dielectric holds capacitance within ±15% across the whole −55 to +125 °C span. (p.1, p.2)

The reliability table gives the rest of the design numbers: dissipation factor 0.1 max at 1 kHz / 1.0 Vrms, insulation resistance of 10,000 MΩ or 100 MΩ·µF (whichever is smaller), and a withstanding-voltage proof at 250% of rated. The life test runs 1,000 h at 150% of rated voltage at the maximum operating temperature. (p.2) Reflow is rated at a 260±5 °C peak for 30 s. (p.2)

Two Class II realities still apply. Capacitance moves with applied DC bias, so check the bias curve at your working voltage instead of trusting the label. (p.14) And mechanical strain is a spec, not a footnote: the bending test allows up to ±10% capacitance change at 1 mm of board flex. (p.2) It ships 2,000 to a 7-inch reel on 4 mm-pitch embossed tape. (p.4)

3D model provenance

The STEP is Samsung Electro-Mechanics' own model (CL21A105KAF1INE.STEP, published through SnapEDA as "Created with Samsung"). Samsung builds its MLCC models at the top of the thickness tolerance, so this one is 1.36 mm tall against the 1.25 +/- 0.10 mm thickness Samsung lists for this part. Samsung exports it lying on its side (Y up); it is stood upright (Z up, seated on the board) without changing its shape or colours. Samsung's file is kept byte for byte in provenance/, beside the previous model.

Footprint

Redrawn from the datasheet land pattern (the previous pads were off by up to 0.476 mm).

Source: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint).

Chip outline

The part's 3D outline in the standard pose (pad 1 toward the viewer), drawn from the STEP by Adom's OpenCascade service; the part number sits where the laser-etched mark is on the 3D model and reads the same way.

Symbol options

The default symbol, CL21B105KBFNNNE.kicad_sym (the one in the Symbol & Footprint panel), is the plain standard symbol. CL21B105KBFNNNE-outline.kicad_sym is the same symbol with the part's 3D chip outline drawn beside it, its part number placed and reading as on the 3D model.

Ordering

Downloads

Provenance

• Datasheet: SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics. md5 f2b6cb96bcd738273fbcab2f38f80926
• Footprint: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint). Pads redrawn on 2026-10-03.
• 3D model and symbol: unchanged by the footprint pass; the etched STEP adds a flat virtual part-number mark (an identification aid, not the maker's marking).

More

• Datasheet pages: the 36 datasheet pages as images.
• Assembly animation: the part dropping onto its pads, and Adom's pick-and-place picking it from tape.