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2.2 µF Capacitor 0805 - Samsung CL21A225KAFNNNG

Public Made by Adom Basic Part

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0805 MLCC · 2.2 µF ±10% X5R · 25 V

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John Lauer Remove the product image: a marketing render, not a photo of the part 9889b41 17d ago

2.2 µF Capacitor 0805 - Samsung CL21A225KAFNNNG

Samsung Electro-Mechanics CL21A225KAFNNNG: 0805 MLCC, 2.2 µF ±10% X5R, 25 V. An Adom Basic Part: Adom keeps it on reels for its pick-and-place line, so boards built with it draw on Adom stock.

Key specs

Spec Datasheet
0805 multilayer ceramic chip capacitor, 2.00 × 1.25 × 1.25 mm body (±0.10 mm), 0.50 mm termination bands; Ni inner electrodes, Cu termination, Ni/100% Sn Pb-free plating p.1
2.2 µF ±10%, rated 25 V, X5R (Class II) dielectric, code A p.1
X5R temperature characteristic: capacitance change within ±15% from −55 to +85 °C p.2
Dissipation factor 0.1 max at 1 kHz / 1.0 Vrms; insulation resistance 10,000 MΩ or 500 MΩ·µF, whichever is smaller p.2
Withstands 250% of rated voltage with no dielectric or mechanical breakdown; high-temperature life test at 150% of rated voltage for 1,000 h p.2
Class II dielectric, capacitance changes with applied DC and AC voltage; the product manual requires designing against the DC-bias characteristic p.11, p.14
Reflow soldering rated to a 260±5 °C peak, 30 s p.2
Supplied on embossed (plastic) carrier tape, 7-inch reel p.1
Store at 0-40 °C and ≤70% RH; solderability shelf life 6 months from delivery p.33

Notes for designers

CL21A225KAFNNNG is a 2.2 µF ±10% X5R ceramic in 0805, rated 25 V (p.1), the middle of the family's capacitance ladder, sized for local bulk decoupling on 5 V and 12 V rails. The X5R dielectric holds capacitance within ±15% from −55 to +85 °C. (p.2)

Its insulation-resistance spec is the strong one in this group: 10,000 MΩ or 500 MΩ·µF whichever is smaller, where most of the higher-value siblings are held to 100 MΩ·µF. Dissipation factor is 0.1 max at 1 kHz / 1.0 Vrms, the dielectric is proofed at 250% of rated voltage, and the life test runs 1,000 h at 150% of rated at maximum operating temperature. (p.2)

The limits to respect: the X5R window closes at +85 °C, not 125, (p.2) and as a Class II ceramic its capacitance drops under DC bias, the product manual explicitly requires checking the bias characteristic at your working voltage. (p.14) Reflow is rated 260±5 °C peak for 30 s, and it ships on embossed tape on a 7-inch reel. (p.2, p.1)

3D model provenance

The STEP is Samsung Electro-Mechanics' own model (CL21A105KAF1INE.STEP, published through SnapEDA as "Created with Samsung"). Samsung builds its MLCC models at the top of the thickness tolerance, so this one is 1.36 mm tall against the 1.25 +/- 0.10 mm thickness Samsung lists for this part. Samsung exports it lying on its side (Y up); it is stood upright (Z up, seated on the board) without changing its shape or colours. Samsung's file is kept byte for byte in provenance/, beside the previous model.

Footprint

Redrawn from the datasheet land pattern (the previous pads were off by up to 0.476 mm).

Source: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint).

mm Datasheet KiCad standard (C_0805_2012Metric) Previous This page
Pad length (along the part) 0.75 to 0.8 1 1.05 0.775
Pad width 1.25 to 1.3 1.45 1.38 1.275
Gap between pads 0.7 to 0.75 0.9 0.726 0.725
Centre to centre 1.45 to 1.55 1.9 1.776 1.5
Overall 2.2 to 2.35 2.9 2.826 2.275
Corner radius not specified 0.25 (ratio 0.25) 0.1313 (ratio 0.125) square (as drawn)
Corners: square, as the datasheet draws them. The datasheet does not call for rounded corners, so the footprint does not add any.

Chip outline

The part's 3D outline in the standard pose (pad 1 toward the viewer), drawn from the STEP by Adom's OpenCascade service; the part number sits where the laser-etched mark is on the 3D model and reads the same way.

Symbol options

The default symbol, CL21A225KAFNNNG.kicad_sym (the one in the Symbol & Footprint panel), is the plain standard symbol. CL21A225KAFNNNG-outline.kicad_sym is the same symbol with the part's 3D chip outline drawn beside it, its part number placed and reading as on the 3D model.

Ordering
MPN CL21A225KAFNNNG
Manufacturer Samsung Electro-Mechanics
Adom stock Adom Basic Part, stocked on reels for Adom's pick-and-place line; reel counts on pnp-inventory
Other sources adom-parts-search compares Mouser, DigiKey and JLCPCB

Downloads

File What it is
CL21A225KAFNNNG.kicad_sym KiCad symbol (standard symbol, the page default)
CL21A225KAFNNNG-outline.kicad_sym KiCad symbol with the 3D chip outline
CL21A225KAFNNNG.kicad_mod KiCad footprint (datasheet land pattern)
CL21A225KAFNNNG.step 3D STEP with the part number laser-etched (default)
CL21A225KAFNNNG-unetched.step 3D STEP, bare (no mark)
CL21A225KAFNNNG.glb 3D GLB of the etched model (board use)
CL21A225KAFNNNG-unetched.glb 3D GLB, bare
CL21A225KAFNNNG.lbr Fusion 360 / EAGLE library
CL21A225KAFNNNG.adom-lbr.json adom-lbr part (converts to Altium, KiCad, EAGLE)
CL21A225KAFNNNG-datasheet.pdf Datasheet (release asset)

Provenance

  • Datasheet: SPECIFICATION (Reference sheet), per-MPN Samsung MLCC spec sheets (pages 4-36 of the full docs are the generic 'MLCC Product Manual' annex), revised No version/revision number printed in any of the 8 docs. Only in-body date: 'Product specifications included in the specifications are effective as of March 1, 2013.' (page 2 of all 8 docs)., Samsung Electro-Mechanics. md5 e34f8d47666017b0b07ffb885ec92aa6
  • Footprint: Land pattern from Samsung MLCC Product Manual, section 5-4 Land dimension (Reflow Footprint), p.32 (5-4 Land dimension, Reflow Footprint). Pads redrawn on 2026-10-03.
  • 3D model and symbol: unchanged by the footprint pass; the etched STEP adds a flat virtual part-number mark (an identification aid, not the maker's marking).

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